• Journal of the Korean Society for Precision Engineering
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• v.13 no.6
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• pp.145-151
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• 1996

In sawing operation of cubic zirconia, the performance of diamond cutter blade is very dependent on the blade variables. This investigation presents experimental results which show the effects of the blade variables such as concentration, grain size of diamond, types of diamond abrasives, and bond materials on the behavior of the blades. Based on the experimental results an optimum blade condition for the sawing of cubic zirconia was recommended.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.04b
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• pp.23-27
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• 1995

In sawing operation of synthetic jewelry, the performance of diamond cutter blade is very dependent on the blade variables. This investigation presents ecperimental results which show the effects of the blade variables such as types of diamond abrasives, grain size of diamond, concentration, and bond materials on the beavior of te blades. Based on the experimental results an optimum blade condition for the sawing of cubic zirconia was recommended.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.04b
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• pp.69-74
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• 1995

A theoretical analysis is presented on the mechanics of diamond blade sawing. Experimental results are also presented, which show the effects of cutting variables such as cutting speed, feed speed, cutting area, and concentration of deamond blade on the cutting forces. The analytical results aggreed well with experimental ones.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.1
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• pp.84-90
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• 1996

A theoretical analysis is presented on the mechanics of diamond blade sawing. The normal and tangential components of cutting force are calculated. Experimental results are also presented, which show the effects of cutting variables such as cutting speed, feed speed, cutting area, and concentration of diamond blade on the cutting forces. The experimental results are found to be in good agreement with those predicted by the analytical calculation.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2003.10a
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• pp.62-63
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• 2003

The inter-particle distance between diamonds on the segment surface of sawing blade predicted theoretically and measured experimentally followed a Gamma or Weibull function, rather than a normal distribution function. These results suggest that random dispersion of diamond particles in the segment may not be an efficient way of improving cutting efficiency of the blade.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.101-106
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• 2001

In order to establish the optimum process parameters and diamond saw blade composition for machining natural stone, the chip formation process and the wear process must be understood. Diamond saw blade is one of the most effective, versatile, and extensively used methods of processing rock and other hard materials, such as granite, marble, concrete and asphalt. For many years, it has been known that chip thickness is one of the most significant in the understanding of the sawing process, and other variables such as force and power have been correlated with it. In this study, mathematical relations of a material chipped by a single grit of the saw blade will be undertaken. The material chipping geometries have been mathematically defined and derived as maximum chip thickness.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1140-1141
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• 2006

Diamond tools with several layers of diamond grits through thickness direction were tested by sawing. The saw blades with evenly distributed grits showed better cutting performance compared to the random distributed saw. At a given concentration of grits, as the spacing between layers was increased, the cutting performance was improved, and as decreased, it showed more tool life

• Proceedings of the KIEE Conference
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• 2006.04a
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• pp.327-329
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• 2006

In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.251-254
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• 2006

In this paper, cutting qualifies and fracture strength of silicon dies by laser dicing are investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bending test and is compared with the die strength by mechanical sawing. As a results, die strength by the laser dicing shows a decrease of 50% in compared with die strength by the mechanical sawing.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.63-68
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• 2014

For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.