• Journal of the Korean Vacuum Society
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• v.15 no.3
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• pp.287-293
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• 2006

Diamond-like carbon (DLC) film was deposited using benzene $(C_6H_6)$ by r. f-plasma assisted chemical vapor deposition. The tribological properties of the DLC film were tested by rotating ball-on-disc type tribometer isolated by a chamber. The tribological test was performed in air environment of relative humidity ranging from 0 to 90% in order to observe the tribological behavior of the DLC film with the change of humidity. We used steel ball and DLC coated steel ball to investigate the effect of the counterface material. Using steel ball, the friction coefficient of DLC film increased from 0.025 to 0.2 as the humidity increased from 0% to 90%. In case of DLC coated steel ball which didn't form the Fe-rich debris, the friction coefficient showed much lower dependence of humidity as 0.08 in relative humidity 90%. We confirmed that the high humidity dependence of the friction coefficient using steel ball resulted from the increase of debris size with humidity and the formation of Fe-rich debris by the wear of steel ball. And the friction coefficient was immediately dropped when the relative humidity changed from 90% to 0% during test using steel ball. From this result, we confirmed that the effect of the Fe-rich debris on the friction coefficient was that Fe element in debris formed the highly sensitive graphitic transfer layer to humidity.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.12
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• pp.1272-1278
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• 2012

The micro barrier rip array structures have been applied in a variety of areas including as privacy films, micro heat sinks, touch panel and optical waveguide. The increased aspect ratio (AR) of barrier rip array structures is required in order to increase the efficiency and performance of these products. There are several problems such as burr, defect of surface roughness and deformation and breakage of barrier rip structure with machining high-aspect ratio micro barrier rip array structure using orthogonal cutting method. It is essential to develop technological methods to solve these problems. The optimum machining conditions for machining micro barrier rip array structures having high-aspect ratio were determined according to lengths ($200{\mu}m$ and $600{\mu}m$) and shape angles ($2.89^{\circ}$ and $0^{\circ}$) of diamond tool, overlapped cutting depths ($5{\mu}m$ and $10{\mu}m$), feed rates (100 mm/s) and three machining processes. Based on the optimum machining conditions, micro barrier rib array structures having aspect ratio 30 was machined in this study.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.703-703
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• 2013

다이아몬드상 탄소 박막(Diamond-like carbon, DLC) 박막은 낮은 마찰 계수, 높은 내마모성, 화학적 안정성, 적외선 영역에서의 높은 투과율 등의 장점을 바탕으로 MEMS (Micro-Electro Mechanical System) 소자와 MMAs (Moving Mechanical Assemblies)의 고체윤활코팅, 마그네틱 미디어와 하드디스크의 슬라이딩 표면 등 다양한 분야에 코팅소재로써 응용되어왔다 [1,2]. 현재 전기철도용 집전판은 마찰이 적고 전도성을 지니는 카본 소재로 구성되어 있다. 그러나 그 마모 비율이 너무 심하여 이를 개선할 수 있는 방안으로 고경도 저마찰력을 지니는 DLC 박막을 코팅 소재로써 제안하고자 한다. 그러나 기존에 DLC 박막은 절연특성이 매우 우수하기 때문에 기존에 전도성을 지니는 카본 집전판에 적용하기에는 어려움이 따른다. 따라서 DLC 박막 내에 실리콘(Si) 또는 금속(Metal)을 첨가시키거나, 금속 중간층을 포함시켜 전기적으로 전도특성을 향상시키는 방안이 제시되고 있으며, 본 연구에서는 DLC 박막과 유사하게 우수한 경도특성을 지니고, 낮은 마찰계수등을 지니는 비정질 탄소박막을 연구하여 카본 집전판에 코팅하고자하며, 특히 비정질 탄소박막에 금속 Ti를 도핑하여 집전판과의 접착력과 전기적 전도 특성을 향상시키고자 한다. Ti가 도핑된 탄소박막(TiC) 박막은 비대칭 마그네트론 스퍼터링(unbalanced magnetron sputtering; UBMS) 시스템을 이용하여 제작하였으며, 스퍼터링 조건 중 기판에 인가되어지는 기판온도에 따라 변화되어지는 TiC 박막의 트라이볼로지(Tribology) 특성을 고찰하고자 하였다. 증착시 기판온도의 증가는 TiC 박막의 경도, 마찰계수 특성등 트라이볼로지 특성을 향상시켰으며, 전기적 전도 특성을 향상시켰다. 이러한 결과는 스퍼터링 방법에 의해 증착되어진 TiC 박막내에 존재하는 sp2 결합과 관계가 있음을 확인할 수 있으며, 트라이 볼로지 특성은 TiC 박막내에 sp2 탄소결합의 비율 증가와 관련되어졌다. 특히 sp2 탄소결합은 TiC 박막 증착시 증가된 기판온도와 밀접한 관계가 있으며 기판온도의 증가에 따라 나노결정 클러스터의 크기와 수의 변화와 밀접한 관계가 있음을 확인하였다. 결국 기판온도는 TiC 박막의 트라이볼로지 특성을 향상시켰으며, 전기적 특성 또한 향상시켜 전기철도 집전판에 응용을 위한 소재로 평가할 수 있다.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.2
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• pp.263-267
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• 2013

The continuing demand for increasingly slimmer and brighter liquid crystal display (LCD) panels has led to an increased focus on the role of light guide panels (LGPs) or optical films that are used to obtain diffuse, uniform light from the backlight unit (BLU). The most basic process in the production of such BLU components is the micromachining of V-shaped grooves. Thus, given the current trend, micromachining of V-shaped grooves is expected to play increasingly important roles in today's manufacturing technology. LCD BLUs comprise various optical elements such as a LGP, diffuser sheet, prism sheet, and protector sheet with V-shaped grooves. High-aspect-ratio patterns are required to reduce the number of sheets and enhance light efficiency, but there is a limit to the aspect ratio achievable for a given material and cutting tool. Therefore, this study comprised a series of experimental evaluations conducted to determine the machining limit in microcutting V-shaped grooves on electroless nickel plated die materials when using single-crystal diamond tools with point angles of $20^{\circ}-80^{\circ}$. Cutting performance was evaluated at various cutting speeds and depths of cut using different machining methods and machine tools. The experimental results are that V-shaped patterns with angles of $80^{\circ}$ or up can be realized regardless of the machining conditions and equipment. Moreover, the feed rate has little effect on machinability, and it is thought that the fly-cut method is more efficient for shallow patterns.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.12
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• pp.1303-1312
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• 2013

We report an ultra-precision lathe designed to machine micron-scale features on a large-area roll mold. The lathe can machine rolls up to 600 mm in diameter and 2,500 mm in length. All axes use hydrostatic oil bearings to exploit the high-precision, stiffness, and damping characteristics. The headstock spindle and rotary tooling table are driven by frameless direct drive motors, while coreless linear motors are used for the two linear axes. Finite element method modeling reveals that the effects of structural deformation on the machining accuracy are less than $1{\mu}m$. The results of thermal testing show that the maximum temperature rise at the spindle outer surface is approximately $0.5^{\circ}C$. Finally, performance evaluations of the error motion, micro-positioning capability, and fine-pitch machining demonstrate that the lathe is capable of producing optical-quality surfaces with micron-scale patterns with feature sizes as small as $20{\mu}m$ on a large-area roll mold.

• Journal of the Korean Ceramic Society
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• v.40 no.7
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• pp.657-661
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• 2003

The elastic moduli or fracture strengths of multi-layered film (SiO$_2$/po1y-Si/SiN/SiO$_2$, 2.77 $\mu\textrm{m}$ thick), CVD diamond film (1.6 $\mu\textrm{m}$ thick), SiO$_2$ film (1.0 $\mu\textrm{m}$ thick) and SiN film (0.43 $\mu\textrm{m}$ thick) made for the membrane of ink-jet printer head were measured with cantilever beam bending method using nanoindenter after fabricating in the form of micro cantilever beam (${\mu}$-CLB). And the elastic moduli of ${\mu}$-CLB of SiO$_2$ film and SiN film were compared with the value of each film on silicon substrate determined with nanoindentation method. The results showed that the modulus and strength of multi-layered film decrease from 68.08 ㎬ and 2.495 ㎬ to 56.53 ㎬ and 1.834 ㎬, respectively as the width of CLB increases from 18.5 $\mu\textrm{m}$ to 58.5 $\mu\textrm{m}$. And the elastic moduli of SiO$_2$ and SiN films measured with ${\mu}$-CLB bending method are 68.16 ㎬ and 215.45 ㎬, respectively and the elastic moduli of these films on silicon substrate measured with nanoindentation method are 98.78 ㎬ and 219.38 ㎬, respectively. These results show that with ${\mu}$-CLB bending technique, moduli can be measured to within 2%.

• Journal of the Korean Vacuum Society
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• v.18 no.5
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• pp.372-376
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• 2009

In the modern semiconductor industry, lithography process is used to construct specific patterns. However, due to the decreasing of line width, these days, more and more researchers are interested in PMMA(Poly Methyl Methacrylate) lithography by using e-beam instead of the prior method, PR(Photoresist) lithography by using UV(Ultra-Violet). Additionally, the patterns constructed by lithography are collapsed during the process of cleansing remnants and the resistance against the breakdown of the patterns is known to be proportional to the elastic modulus of pattern-constructing materials. In this research, we measured the change of hardness and elastic modulus of PMMA film surface according to the change of time spent to soft-bake the PMMA film. During the measurement, we controlled the tip pressure from $25{\mu}N$ to $8,500{\mu}N$ having intervals that are $134.52{\mu}N$. For these measurements, we used the Triboindenter from Hysitron to gauge the hardness and elastic modulus and the tip we used was Berkovich diamond Tip.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.61-66
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• 2012

Chemical Mechanical Planarization (CMP) is a polishing process used in the microelectronic fabrication industries to achieve a globally planar wafer surface for the manufacturing of integrated circuits. Pad conditioning plays an important role in the CMP process to maintain a material removal rate (MRR) and its uniformity. For metal CMP process, highly acidic slurry containing strong oxidizer is being used. It would affect the conditioner surface which normally made of metal such as Nickel and its alloy. If conditioner surface is corroded, diamonds on the conditioner surface would be fallen out from the surface. Because of this phenomenon, not only life time of conditioners is decreased, but also more scratches are generated. To protect the conditioners from corrosion, thin organic film deposition on the metal surface is suggested without requiring current conditioner manufacturing process. To prepare the anti-corrosion film on metal conditioner surface, vapor SAM (self-assembled monolayer) and FC (Fluorocarbon) -CVD (SRN-504, Sorona, Korea) films were prepared on both nickel and nickel alloy surfaces. Vapor SAM method was used for SAM deposition using both Dodecanethiol (DT) and Perfluoroctyltrichloro silane (FOTS). FC films were prepared in different thickness of 10 nm, 50 nm and 100 nm on conditioner surfaces. Electrochemical analysis such as potentiodynamic polarization and impedance, and contact angle measurements were carried out to evaluate the coating characteristics. Impedance data was analyzed by an electrical equivalent circuit model. The observed contact angle is higher than 90o after thin film deposition, which confirms that the coatings deposited on the surfaces are densely packed. The results of potentiodynamic polarization and the impedance show that modified surfaces have better performance than bare metal surfaces which could be applied to increase the life time and reliability of conditioner during W CMP.