• Restorative Dentistry and Endodontics
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• v.14 no.2
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• pp.65-76
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• 1989

The purpose of this study was to observe the effect on the removal of dentinal smear layer and morphological changes of reduced dentin surfaces by various dentin surface conditioners. Thirty-two healthy human premolars extracted due to periodontal or orthodontic reasons were used. The teeth were cross-sectioned to expose dentin at the middle portion of the crown with diamond rotary saw. The specimens were then divided into 8 groups. The sectioned dentin surfaces in group 1 to 4 were grinded with No. 400 grit silicone abrasive paper and those in group 5 to 8 were cut with #700 carbide bur under air-water spray. The grinded or cut dentin surfaces were conditioned with 3% $H_2O$, Dentin Conditioner(GC Inter. Corp., Japan), and Scotchprep(3M Dent Prod., U.S.A) according to manufacturer's directions. All the specimens were dried in room temperature for 48 hours, and gold-coated with Eiko ion coater(Eik-engineering Co.), and observed in Hitachi S-450 Scanning electron microscope at 15-25 KV. The following results were obtained; 1. The dentin surfaces grinded with the silicon abrasive paper were rougher in texture and heavier in amount of smear layer than those cut with the carbide bur. 2. Scrubbing of 3% $H_2O_2$ was not effective in removing dentinal smear layer. 3. 20-second conditioning of Dentin Conditioner (GC Inter. Corp) resulted in the removal of a significant amount of the smear layer without removing the tubular plugs and dissolving the peritubular dentin. 4. Scotchprep removed the smear layer very effectively. But at the same time it dissolved the peritubular dentin. 5. Irrespective of the uses of the silicon carbide abrasive paper or the carbide bur the morphological changes of dentin surfaces treated with the same conditioning agents were similar.

• Advances in materials Research
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• v.1 no.2
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• pp.129-146
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• 2012

Polycrystalline diamond is an ideal material for parts with micro-holes and has been widely used as dies and cutting tools in automotive, aerospace and woodworking industries due to its superior wear and corrosion resistance. In this research paper, the modeling and simultaneous optimization of multiple performance characteristics such as material removal rate and surface roughness of polycrystalline diamond (PCD) with ultrasonic machining process has been presented. The fuzzy logic and taguchi's quality loss function has been used. In recent years, fuzzy logic has been used in manufacturing engineering for modeling and monitoring. Also the effect of controllable machining parameters like type of abrasive slurry, their size and concentration, nature of tool material and the power rating of the machine has been determined by applying the single objective and multi-objective optimization techniques. The analysis of results has been done using the MATLAB 7.5 software and results obtained are validated by conducting the confirmation experiments. The results show the considerable improvement in S/N ratio as compared to initial cutting conditions. The surface roughness of machined surface has been measured by using the Perthometer (M4Pi, Mahr Germany).

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.5
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• pp.76-81
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• 2014

The Engineering ceramics have some excellent properties as materials for modern mechanical and electrical components. It is, however, not easy to polish them efficiently because they are strong and hard. This study is carried out to obtain a mirror surface on engineering ceramics by surperfinishing with high efficiency. To achieve this, we conducted a series of polishing experiments using representative engineering ceramics, such as $Al_2O_3$, SiC, $Si_3N_4$ and $ZrO_2$, using diamond abrasive film from the perspective of oscillations peed, the rotational speed of the workpiece, contact roller hardness, contact pressure and feed rate. Furthermore, the polishing efficiency and characteristics for engineering ceramics are discussed on the basis of optimal polishing time and surface roughness. Our results confirmed that efficient superfinishing conditions and polishing characteristics of engineering ceramics can be determined.

• Transactions on Electrical and Electronic Materials
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• v.8 no.1
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• pp.26-31
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• 2007

The goal of this study is to determine if High Pressure Micro Jet (HPMJ) conditioning can be used as a substitute for, or in conjunction with, conventional diamond pad conditioning. Five conditioning methods were studied during which 50 ILD wafers were polished successively in a 100-mm scaled polisher and removal rate (RR), coefficient of friction (COF), pad flattening ratio (PFR) and scanning electron microscopy (SEM) measurements were obtained. Results indicated that PFR increased rapidly, and COF and removal rate decreased significantly, when conditioning was not employed. With diamond conditioning, both removal rate and COF were stable from wafer to wafer, and low PFR values were observed. SEM images indicated that clean grooves could be achieved by HPMJ pad conditioning, suggesting that HPMJ may have the potential to reduce micro scratches and defects caused by slurry abrasive particle residues inside grooves. Regardless of different pad conditioning methods, a linear correlation was observed between temperature, COF and removal rate, while an inverse relationship was seen between COF and PFR.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.4
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• pp.9-16
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• 2003

In this study, the decision of dressing time for diamond wheel was analyzed by observing with acoustic emission signals and surface roughness, and also obtained the machining characteristics by weibull distribution plot for the values of bending strength. From the experimental study, it was possible to predict the time of re-dressing for the diamond grinding wheel with the analysis of acoustic emission signals and surface roughness values, and following conclusions were obtained. The root-mem-square values of acoustic emission signals were obtained low as the increased of table speed for different abrasive grain size. This is caused by the lack of grinding power which is not able to get rid of all real grinding mass of depth as the table speed is increased. The values of bending strength for ground $Si_3 N_4$ specimens were decreased for gain size of #400 than that of #60, but it was found that the surface roughness values for gain size of #60 were better than that of #400. As compared the shape parameter of weibull distribution plot for the values of bending strength, it was found that the reliability of bending strength for grain size of #60 increased than that of #400.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.10a
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• pp.136-144
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• 1992

Recently, Silicon Nitrde ceramic is regarded as the representative engineering ceramic with the excellent mechanical properties and many functions for mechanical components and parts among various kinds of ceramics in the mechanical industry. But, during the manufacturing of engineering ceramics, there is many volumetric shrinkage coupled with a distortion of the parts which is produced. Due to the requirement for high accuracy of size, form, and surface finish of the components, machining is needed surely. Nowdays, grinding with a resin bond type diamond wheels has been generally applied to machining of the engineering ceramics in the whole world because that it can be conveniently proceeded for workers to dress of tool and made with high reliability in producing factories among many bond type super-abrasive wheels yet. It is important task for attaining prescribed mechanical components with high reliability to observe the grinding mechanism of ceramics as like generation of cracks and chipping of material during process. Because they considerably effects on the strength characteristic of machined mechanical components. In this study, various surface grinding experiments using resin bond type diamond wheels are carried out for Silicon Nitride ceramic. Grinding mechanism of ceramics is observed experimentally and the relationship with various conditions is also attained. Form this experimental study, some useful machining data and information to determine proper machining condition for grinding of Silicon Nitride ceramic is obtained.

• Journal of Astronomy and Space Sciences
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• v.21 no.2
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• pp.141-152
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• 2004

Optics fabrication process for precision space optical parts includes bound abrasive grinding, loose abrasive lapping and polishing. The traditional bound abrasive grinding with bronze bond cupped diamond wheel leaves the machine marks of about $20{mu}m$ rms in height and the subsurface damage of about 1 ${mu}m$ rms in height to be removed by subsequent loose abrasive lapping. We explored an efficient quantitative control of precision CNC grinding. The machining parameters such as grain size, work-piece rotation speed and feed rate were altered while grinding the work-piece surfaces of 20-100 mm in diameter. The input grinding variables and the resulting surface quality data were used to build grinding prediction models using empirical and multi-variable regression analysis. The effectiveness of such grinding prediction models was then examined by running a series of precision CNC grinding operation with a set of controlled input variables and predicted output surface quality indicators. The experiment achieved the predictability down to ${pm}20$ nm in height and the surface roughness down to 36 nm in height. This study contributed to improvement of the process efficiency reaching directly the polishing and figuring process without the need for the loose abrasive lapping stage.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.6
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• pp.225-229
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• 2011

Most of the silicon cutting methods using the multi-wire with the slurry injection have been used for wafers of the crystalline solar cell. But the productivity of slurry injection cutting type falls due to low cutting speeds. Also, the direct contact with the metal wire and silicon block increases the concentration of metallic impurities in the wafer's surface. In addition, the abrasive silicon carbide (SiC) generates pollutants. And production costs are rising because it does not re-use the worn wire. On the other hand, the productivity of the cutting method using the diamond coated wire is about 2 times faster than the slurry injection cutting type. Also, the continuous cutting using the used wire of low wear is possible. And this is a big advantage for reduced production costs. Therefore, the cutting method of the diamond coated wire is more efficient than the slurry injection cutting technique. In this study, each cutting type is analyzed using the surface characteristics of the solar wafer and will describe the effects of the manufacturing process of the solar cell. Finally, we will suggest improvement methods of the solar cell process for using the diamond cutting type wafer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.42-45
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• 2002

General wheel mark in mono-crystalline silicon wafer finding is able to be expected because it depends on radius ratio and angular velocity ratio of wafer and wheel. The pattern is predominantly determined by the contour of abrasive grits resulting from a relative motion. Although such a wheel mark is made uniform pattern if the process parameters are fixed, sub-surface defect is expected to be distributed non-uniformly because of characteristic of mono-crystalline silicon wafer that has diamond cubic crystal. Consequently it is considered that this phenomenon affects the following process. This paper focused on kinematic analysis of wafer grinding process and simulation program was developed to verify the effect of process variables on wheel mark. And finally, we were able to predict sub-surface defect distribution that considered characteristic of mono-crystalline silicon wafer

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.355-359
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• 2001

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel grinding ceramic materials. Normal component of grinding resistance of $AI_2O_3$ was less then that of $Si_3N_4$ and $ZrO_2$. It is because the resistance for grain shedding is less then that for layer formation. For the case of $Si_3N_4$ and $ZrO_2$, as the grain mesh number of wheel increases, the surface roughness decreases. For the case of $AI_2O_3$, the surface roughness does not decreases. For the case of $Si_3N_4$ and $ZrO_2$, grinding is carried out by abrasive wear processes. For the case of $AI_2O_3$, grinding is carried out by grain shedding process.