• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.20 no.1
• /
• pp.170-178
• /
• 2019

Recently, as the interest in energy savings has increased, there has been increasing use of LED lighting, which is an eco-friendly device that replaces high energy consuming fluorescent lamps and incandescent lamps. In the case of a high output LED, however, the life time is shortened due to deterioration caused by heat generation. As a solution to this problem, this paper evaluated the LED life extension effect by increasing the convective heat transfer coefficient of the heat sink surface for LED packaging. A roughing process was carried out using sandpaper and sand blasting. The changes in surface roughness and surface area after each surface treatment process were evaluated quantitatively and the convective heat transfer coefficient was measured. When sandblasting and sandpaper were used to roughen the aluminum surface, a higher convection heat transfer coefficient was obtained compared to the untreated case, and a high heat dissipation efficiency of 82.76% was obtained in the sandblast treatment. Therefore, it is expected that the application of heat dissipation to the heat sink will extend the lifetime of the LED significantly and economically by increasing the heat efficiency.

• Smart Media Journal
• /
• v.8 no.1
• /
• pp.43-50
• /
• 2019

As numerous devices are connected through a wireless network, there exist many studies conducted to efficiently connect the devices. While earlier studies often use clustering for efficient device management, there is a load-intensive cluster node which may lead the entire network to be unstable. In order to solve this problem, we propose a scheduling model for centralized unequal chain clustering for efficient management of sensor nodes. For the cluster configuration, this study is based on the cluster head range and the distance to the base station(BS). The main vector projection technique is used to construct clustering with concentricity where the positions of the base stations are not the same. We utilize a multiple radio access interface, multiple-input multiple-output (MIMO), for data transmission. Experiments show that cluster head energy consumption is reduced and network lifetime is improved.

• Korean Journal of Remote Sensing
• /
• v.14 no.3
• /
• pp.223-231
• /
• 1998

Ocean Scanning Multispectral Imager (OSMI) is a payload on the Korean Multi-Purpose SATellite (KOMPSAT) to perform worldwide ocean color monitoring for the study of biological oceanography. The instrument images the ocean surface using a whisk-broom motion with a swath width of 800 km and a ground sample distance (GSD) of less than 1 km over the entire field-of-view (FOV). The instrument is designed to have an on-orbit operation duty cycle of 20% over the mission lifetime of 3 years with the functions of programmable gain/offset and on-orbit image data storage. The instrument also performs sun calibration and dark calibration for on-orbit instalment calibration. The OSMI instrument is a multi-spectral imager covering the spectral range from 400 nm to 900 nm using a Charge Coupled Device (CCD) Focal Plane Array (FPA). The ocean colors are monitored using 6 spectral channels that can be selected via ground commands after launch. The instrument performances are fully measured for 8 basic spectral bands centered at 412, 443, 490, 510, 555, 670, 765 and 865 nm during ground characterization of instalment. In addition to the ground calibration, the on-orbit calibration will also be used for the on-orbit band selection. The on-orbit band selection capability can provide great flexibility in ocean color monitoring.

• Smart Media Journal
• /
• v.11 no.9
• /
• pp.21-29
• /
• 2022

Ultra Violet(UV) is gradually being replaced with LED instead of general UV lamps. However, the light efficiency of UV LED is still lower than that of the general lamp, and the light efficiency is also low. Due to the current environment and technical problems of UV lamps, the LED replacements are gradually being made. In this study, a new package design and analysis were performed to increase the lifetime and performance of UV LEDs. A new packaging for UV LED were designed and implemented. The new packaging for UV LED was constructed to improve light efficiency. And the electrical and optical characteristics were analyzed respectively. To improve the optical efficiency in UV LED package, the Al has been used based on high reflectivity and applying the optimal lens focusing. Compared to the existing silver Ag, the light efficiency was improved by about 30% or more, and it was confirmed that the light output degradation characteristic was improved by about 10% in the newly applied optical device chip.

• Journal of the Korean Vacuum Society
• /
• v.15 no.1
• /
• pp.89-96
• /
• 2006

Recent ULSI and multilevel structure trends in microelectronic devices minimize the line width down to less than $0.25{\mu}m$, which results in high current densities in thin film interconnections. Under high current densities, an EM(electromigration) induced failure becomes one of the critical problems in a microelectronic device. This study is to improve thin film interconnection materials by investigating the EM characteristics in Ag, Cu, Au, and Al thin films, etc. EM resistance characteristics of Ag, Cu, Au, and Al thin films with high electrical conductivities were investigated by measuring the activation energies from the TTF (Time-to-Failure) analysis. Optical microscope and XPS (X-ray photoelectron spectroscopy) analysis were used for the failure analysis in thin films. Cu thin films showed relatively high activation energy for the electromigration. Thus Cu thin films may be potentially good candidate for the next choice of advanced thin film interconnection materials where high current density and good EM resitance are required. Passivated Al thin films showed the increased MTF(Mean-time-to-Failure) values, that is, the increased EM resistance characteristics due to the dielectric passivation effects at the interface between the dielectric overlayer and the thin film interconnection materials.

• Journal of Korea Multimedia Society
• /
• v.10 no.10
• /
• pp.1347-1355
• /
• 2007

A sensor network is composed of a large number of tiny devices, scattered and deployed in a specified regions. Each sensing device has processing and wireless communication capabilities, which enable it to gather information from the sensing area and to transfer report messages to a base station. The energy-efficient routing paths are established when the base station requests a query, since each node has several characteristics such as low-power, constrained energy, and limited capacity. The established paths are recovered while minimizing the total transmit energy and maximizing the network lifetime when the paths are broken. In this paper, we propose a routing algorithm that each sensor node reports its adjacent link information to the sink node when a sink node broadcasts a query. The sink node manages the total topology and establishes routing paths. This algorithm has a benefit to find an alternative path by reducing the negotiating messages for establishing paths when the established paths are broken. To reduce the overhead of collection information, each node has a link information before reporting to the sink. Because the node recognizes which nodes are adjacent. The proposed algorithm reduces the number of required messages, because sensor nodes receive and report routing messages for establishment at the beginning of configuring routing paths, since each node keeps topology information to establish a routing path, which is useful to report sensing tasks in monitoring environments.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.4
• /
• pp.1-13
• /
• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.421-422
• /
• 2011

The first part is about development of a liquid target for a neutron source, which is designed to overcome many of the limitations of traditional beam-target neutron generators by utilizing a liquid target neutron source. One of the most critical aspects of the beam-target neutron generator is the target integrity under the beam exposure. A liquid target can be a good solution to overcome damage to the target such as target erosion and depletion of hydrogen isotopes in the active layer, especially for the one operating at high neutron fluxes with no need for water cooling. There is no inherent target lifetime for the liquid target neutron generator when used with continuous refreshment of the target surface exposed to the energetic beam. In this work, liquid target containing hydrogen has been developed and tested in vacuum environment. Potentially, liquid targets could allow a point neutron source whose spatial extension is on the order of 1 to $10{\mu}m$. And the second is about the vacuum ultraviolet (VUV) spectrometer which is designed as a five-channel spectral system for ITER main plasma measurement. To develop and verify the design, a two-channel prototype system was fabricated with No. 3 (14.4 nm~31.8 nm) and No. 4 (29.0 nm~60.0 nm) among the five channels. For test of the prototype system, a hollow cathode lamp is used as a light source. The system is composed of a collimating mirror to collect the light from source to slit, and two holographic diffraction gratings with toroidal geometry to diffract and also to collimate the light from the common slit to detectors. The two gratings are positioned at different optical distances and heights as designed. To study the appropriate detector for ITER VUV system, two different electronic detectors of the back-illuminated charge coupled device and the micro-channel plate electron multiplier were installed and the performance has been investigated and compared in the same experimental conditions. The overall system performance was verified by measuring the spectrums.

• The Journal of the Institute of Internet, Broadcasting and Communication
• /
• v.13 no.5
• /
• pp.209-220
• /
• 2013

Handover is the technology to minimize data lose of mobile devices and make continuous communication possible even if the device could be moved from one digital cell site to another one. That is, it is a function that enables the mobile user to avoid the disconnection of phone conversations when moving from a specific mobile communication area to another. Today, there are a lot of ongoing researches for fast and efficient hand-over, in order to address phone call's delay and disconnection which are believed to be the mobile network's biggest problems, and these should essentially be resolved in all mobile networks. Thanks to recent technology development in mobile network, the LTE network has been commercialized today and it has finally opened a new era that makes it possible for mobile phones to process data at high speed. In LTE network environment, however, a new authentication key must be generated for the hand-over. In this case, there can be a problem that the authentication process conducted by the hand-over incurs its authentication cost and delay time. This essay suggests an efficient key caching hand-over method which simplifies the authentication process: when UE makes hand-over from oMME to nMME, the oMME keeps the authentication key for a period of time, and if it returns to the previous MME within the key's lifetime, the saved key can be re-used.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.36 no.5
• /
• pp.500-504
• /
• 2023

In this study, the heteroepitaxial thin film growth of β-Ga₂O₃ was studied according to the position of the susceptor in mist-CVD. The position of the susceptor and substrate was moved step by step from the center of the hot zone to the inlet of mist in the range of 0~50 mm. It was confirmed that the average thickness increased to 292 nm (D1), 521 nm (D2), and 580 nm (D3) as the position of the susceptor moved away from the center of the hot zone region. The thickness of the lower region of the substrate is increased compared to the upper region. The surface roughness of the lower region of the substrate also increased because the nucleation density increased due to the increase in the lifetime of the mist droplets and the increased mist density. Therefore, thin film growth of β-Ga₂O₃ in mist-CVD is performed by appropriately adjusting the position of the susceptor (or substrate) in consideration of the mist velocity, evaporation amount, and temperature difference with the substrate, thereby determining the crystallinity of the thin film, the thickness distribution, and the thickness of the thin film. Therefore, these results can provide insights for optimizing the mist-CVD process and producing high-quality β-Ga₂O₃ thin films for various optical and electronic applications.