• Smart Structures and Systems
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• v.32 no.4
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• pp.253-266
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• 2023

The time-reversal method is employed to improve the ability of pipeline defect detection, and a new approach of identifying the pipeline defect depth is proposed in this research. When the L(0,2) mode ultrasonic guided wave excited through a lead zirconate titinate (PZT) transduce array propagates along the pipeline with a defect, it will interact with the defect and be partially converted to flexural F(n, m) modes and longitudinal L(0,1) mode. Using a receiving PZT array attached axisymmetrically around the pipeline, the L(0,2) reflection signal as well as the mode conversion signals at the defect are obtained. An appropriate rectangle window is used to intercept the L(0,2) reflection signal and the mode conversion signals from the obtained direct detection signals. The intercepted signals are time reversed and re-excited in the pipeline again, result in the guided wave energy focusing on the pipeline defect, the L(0,2) reflection and the L(0,1) mode conversion signals being enhanced to a higher level, especially for the small defect in the early crack stage. Besides the L(0,2) reflection signal, the L(0,1) mode conversion signal also contains useful pipeline defect information. It is possible to identify the pipeline defect depth by monitoring the variation trend of L(0,2) and L(0,1) reflection coefficients. The finite element method (FEM) simulation and experiment results are given in the paper, the enhancement of pipeline defect reflection signals by time-reversal method is obvious, and the way to identify pipeline defect depth is demonstrated to be effective.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.46 no.2
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• pp.1-12
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• 2023

To make semiconductor chips, a number of complex semiconductor manufacturing processes are required. Semiconductor chips that have undergone complex processes are subjected to EDS(Electrical Die Sorting) tests to check product quality, and a wafer bin map reflecting the information about the normal and defective chips is created. Defective chips found in the wafer bin map form various patterns, which are called defective patterns, and the defective patterns are a very important clue in determining the cause of defects in the process and design of semiconductors. Therefore, it is desired to automatically and quickly detect defective patterns in the field, and various methods have been proposed to detect defective patterns. Existing methods have considered simple, complex, and new defect patterns, but they had the disadvantage of being unable to provide field engineers the evidence of classification results through deep learning. It is necessary to supplement this and provide detailed information on the size, location, and patterns of the defects. In this paper, we propose an anomaly detection framework that can be explained through FCDD(Fully Convolutional Data Description) trained only with normal data to provide field engineers with details such as detection results of abnormal defect patterns, defect size, and location of defect patterns on wafer bin map. The results are analyzed using open dataset, providing prominent results of the proposed anomaly detection framework.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.16 no.1
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• pp.245-265
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• 2022

In response to problems such as insufficient extraction information, low detection accuracy, and frequent misdetection in the field of Thangka image defects, this paper proposes a YOLOv5 prediction algorithm fused with the attention mechanism. Firstly, the Backbone network is used for feature extraction, and the attention mechanism is fused to represent different features, so that the network can fully extract the texture and semantic features of the defect area. The extracted features are then weighted and fused, so as to reduce the loss of information. Next, the weighted fused features are transferred to the Neck network, the semantic features and texture features of different layers are fused by FPN, and the defect target is located more accurately by PAN. In the detection network, the CIOU loss function is used to replace the GIOU loss function to locate the image defect area quickly and accurately, generate the bounding box, and predict the defect category. The results show that compared with the original network, YOLOv5-SE and YOLOv5-CBAM achieve an improvement of 8.95% and 12.87% in detection accuracy respectively. The improved networks can identify the location and category of defects more accurately, and greatly improve the accuracy of defect detection of Thangka images.

• IEMEK Journal of Embedded Systems and Applications
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• v.17 no.3
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• pp.129-138
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• 2022

Collecting and labeling sufficient training data, which is essential to deep learning-based visual inspection, is difficult for manufacturers to perform because it is very expensive. This paper presents a steel plate surface defect detection system with industrial-grade detection performance by training a small amount of steel plate surface images consisting of labeled and non-labeled data. To overcome the problem of lack of training data, we propose two data augmentation techniques: program-based augmentation, which generates defect images in a geometric way, and generative model-based augmentation, which learns the distribution of labeled data. We also propose a 4-step semi-supervised learning using pseudo labels and consistency training with fixed-size augmentation in order to utilize unlabeled data for training. The proposed technique obtained about 99% defect detection performance for four defect types by using 100 real images including labeled and unlabeled data.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.1
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• pp.86-93
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• 2017

In this paper, we propose a novel defect detection method using component tree representations of scanning electron microscopy (SEM) images. The component tree contains rich information about the topological structure of images such as the stiffness of intensity changes, area, and volume of the lobes. This information can be used effectively in detecting suspicious defect areas. A quasi-linear algorithm is available for constructing the component tree and computing these attributes. In this paper, we modify the original component tree algorithm to be suitable for our defect detection application. First, we exclude pixels that are near the ground level during the initial stage of component tree construction. Next, we detect significant lobes based on multiple attributes and edge information. Our experiments performed with actual SEM wafer images show promising results. For a $1000{\times}1000$ image, the proposed algorithm performed the whole process in 1.36 seconds.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.9
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• pp.2145-2152
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• 2013

Paper manufacturing industries have huge facilities with automatic equipments. Especially, in order to improve the efficiency of the paper manufacturing processes, it is necessary to detect the paper cutting defect effectively and to classify the causes correctly. In this paper, we review the problems of web monitoring system and web inspection system that have been traditionally used in industries for defect detection. Then we propose a novel paper cutting defect detection method based on the local binary pattern analysis and its implementation to mitigate the practical problems in industry environment. The proposed algorithm classifies the defects into edge-type and region-type and then it is shown that the proposed system works stably on the real paper cutting defect detection system.

• Proceedings of the KIEE Conference
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• 1999.07b
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• pp.668-670
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• 1999

We have developed a automatic surface inspection system for cold Rolled strips in steel making process for several years. We have experienced the various kinds of surface inspection systems, including linear CCD camera type and the laser type inspection system which was installed in cold rolled strips production lines. But, we did not satisfied with these inspection systems owing to insufficient detection and classification rate, real time processing performance and limited line speed of real production lines. In order to increase detection and computing power, we have used the Dark Field illumination with Infra_Red LED, Bright Field illumination with Xenon Lamp, Parallel Computing Processor with Area typed CCD camera and full software based image processing technique for the ease up_grading and maintenance. In this paper, we introduced the automatic inspection system and real time image processing technique using the Object Detection, Defect Detection, Classification algorithms. As a result of experiment, under the situation of the high speed processed line(max 1000 meter per minute) defect detection is above 90% for all occurred defects in real line, defect name classification rate is about 80% for most frequently occurred 8 defect, and defect grade classification rate is 84% for name classified defect.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.16 no.6
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• pp.369-377
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• 2023

In the industrial manufacturing sector, quality control is pivotal for minimizing defect rates; inadequate management can result in additional costs and production delays. This study underscores the significance of detecting texture defects in manufactured goods and proposes a more precise defect detection technique. While the DFR(Deep Feature Reconstruction) model adopted an approach based on feature map amalgamation and reconstruction, it had inherent limitations. Consequently, we incorporated a new loss function using statistical methodologies, integrated a skip connection structure, and conducted parameter tuning to overcome constraints. When this enhanced model was applied to the texture category of the MVTec-AD dataset, it recorded a 2.3% higher Defect Segmentation AUC compared to previous methods, and the overall defect detection performance was improved. These findings attest to the significant contribution of the proposed method in defect detection through the reconstruction of feature map combinations.

• Journal of the Semiconductor & Display Technology
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• v.22 no.1
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• pp.54-58
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• 2023

In this study, we compared the detection accuracy of the parameters of the scaffold failure detection model. A detection algorithm based on convolutional neural network was used to construct a failure detection model for scaffold. The parameter properties of the model were changed and the results were quantitatively verified. The detection accuracy of the model for each parameter was compared and the parameter with the highest accuracy was identified. We found that the activation function has a significant impact on the detection accuracy, which is 98% for softmax.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.12
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• pp.1094-1098
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• 2013

AVI (Automatic Vision Inspection) systems automatically detect defect features and measure their sizes via camera vision. Defect detection is not an easy process because of noises from various sources and optical distortion. In this paper the acquired images from a TFT panel are enhanced with the adoption of an HVS (Human Visual System). A human visual system is more sensitive on the defect area than the illumination components because it has greater sensitivity to variations of intensity. In this paper we modified an MTF (Modulation Transfer Function) in the Wavelet domain and utilized the characteristics of an HVS. The proposed algorithm flattens the inner illumination components while preserving the defect information intact.