• Journal of Korean Society of Coastal and Ocean Engineers
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• v.26 no.6
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• pp.359-366
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• 2014

This paper considered optimization method of appending a shape on a disc in an attempt to improve core functions, which are inherent in flow characteristics. The paper also verifies the optimization method of appendage shape with a Class 150 200A Butterfly valve. Then the design of experiment (DOE) with an orthogonal array is performed to analyze the effect of form parameters by grey relational analysis and analysis of mean (ANOM). And this study sets flow coefficient as an object functions for optimization, and the conventional disc model and the optimal appendage shape on disc model are compared by computational fluid analysis. The paper concludes that an optimal appendage shape on disc model achieves wider usability by a wider operating range.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2006.06b
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• pp.331-336
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• 2006

The rail clamp is the device to prevent that a crane slips along rails due to the wind blast as well as to locate the crane in the set position for loading and unloading containers. The wedge type rail clamp should be designed to consider the structural instability and the durability because it compresses both rail side with large clamping force by the wedge working as the wind speed increases. In this research, there are two methods which are design of experiment and variation technology in used commercial software and shape optimization was performed. The optimum results obtained by the two methods are compared and examined.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.434-435
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• 2012

Plasma enhanced chemical vapor deposition (PECVD) silicon dioxide thin films have many applications in semiconductor manufacturing such as inter-level dielectric and gate dielectric metal oxide semiconductor field effect transistors (MOSFETs). Fundamental chemical reaction for the formation of SiO2 includes SiH4 and O2, but mixture of SiH4 and N2O is preferable because of lower hydrogen concentration in the deposited film [1]. It is also known that binding energy of N-N is higher than that of N-O, so the particle generation by molecular reaction can be reduced by reducing reactive nitrogen during the deposition process. However, nitrous oxide (N2O) gives rise to nitric oxide (NO) on reaction with oxygen atoms, which in turn reacts with ozone. NO became a greenhouse gas which is naturally occurred regulating of stratospheric ozone. In fact, it takes global warming effect about 300 times higher than carbon dioxide (CO2). Industries regard that N2O is inevitable for their device fabrication; however, it is worthwhile to develop a marginable nitrous oxide free process for university lab classes considering educational and environmental purpose. In this paper, we developed environmental friendly and material cost efficient SiO2 deposition process by substituting N2O with O2 targeting university hands-on laboratory course. Experiment was performed by two level statistical design of experiment (DOE) with three process parameters including RF power, susceptor temperature, and oxygen gas flow. Responses of interests to optimize the process were deposition rate, film uniformity, surface roughness, and electrical dielectric property. We observed some power like particle formation on wafer in some experiment, and we postulate that the thermal and electrical energy to dissociate gas molecule was relatively lower than other runs. However, we were able to find a marginable process region with less than 3% uniformity requirement in our process optimization goal. Surface roughness measured by atomic force microscopy (AFM) presented some evidence of the agglomeration of silane related particles, and the result was still satisfactory for the purpose of this research. This newly developed SiO2 deposition process is currently under verification with repeated experimental run on 4 inches wafer, and it will be adopted to Semiconductor Material and Process course offered in the Department of Electronic Engineering at Myongji University from spring semester in 2012.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.17 no.11
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• pp.1043-1049
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• 2007

Data transfer rate and storage capacity are main criteria of the performance of the optical disk drive. The highest data transfer rate and the largest storage capacity is most desirable. To increase these performances, the actuator of the optical disk drive should have a high servo bandwidth to compensate the vibration of an optical disk. The servo bandwidth is limited by some flexible modes of the actuator, thus it is essential to increase the natural frequencies of the flexible modes. In this paper, we suggested a moving magnet type actuator having high frequencies of the flexible modes. Generally, the moving magnet type actuator has an advantage to increase the natural frequencies of the flexible modes because the moving magnet type actuator has simple structure and the Young's modulus of magnet is high. However, large moving mass and inefficiency of EM(electromagnetic) circuit cut down driving sensitivities of the actuator. To improve driving sensitivities, we designed the model with the closed electromagnetic circuit for tracking direction. In addition, driving sensitivities and the natural frequencies of the flexible modes were improved by using DOE(design of experiments) for electromagnetic circuit and modifying the lens holder.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.175-182
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• 2017

In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.9
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• pp.1161-1166
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• 2010

Tapered roller bearings are core components of rotating machine parts and are simultaneously subjected to axial and radial loads. Life-shortening effect was particularly evident in the case of tapered roller bearings used in the input and output shafts of transmission; this shortening of life was a result of excessive axial pre-load, which is common in the transmission assembly line. In this study, we derived an equation for evaluating the life of tapered roller bearings subjected to excessive pre-load by using accelerated life test data. The DOE(Design Of Experiment) method and FEA(Finite Element Analysis) was used for determining the condition for performing an accelerated life test. This equation for evaluating the service life of the bearings was derived by analyzing the Weibull distribution of the test results. Using the derived equation the life evaluated was 6-7 times longer than that evaluated by the conventional $L_{10}$ bearing-life equation. The results of this study will be helpful in predicting the life of tapered roller bearings subjected to excessive pre-load and in designing reliable rotating machines.

• Design & Manufacturing
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• v.11 no.2
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• pp.1-8
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• 2017

In this study, we applied microcellular foaming injection molding process to improve the performance of system air-conditioner drain fan which had been produced by injection molding process and studied the optimization of process conditions through 6-sigma process and response surface method (RSM) to reduce weight and deformation of products. Additive type, melt temperature, mold temperature, and injection screw shape were selected as the factor affecting the weight and deformation of the products by carrying out analysis of trivial many through ANOVA and design of experiment (DOE) method. Among the effect factor, we set the addictive type to Long G/F and screw shape to foaming screw which had the highest level of weight reduction and deformation reduction. The amount of foaming agent gas was set at 60 ml, which was the limit beyond which the weight of product did not decrease any more. For melt temperature and mold temperature, we studied the conditions where both weight and deformation were minimized using the RSM. As a result, we set the melt temperature to $250^{\circ}C$, fixed mold temperature to $20^{\circ}C$, and moving mold temperature to $40^{\circ}C$. The improvement effect was analyzed by appling the selected optimal conditions to the production process using the microcellular foaming injection molding. The results showed that the mean weight of product was measured to be 1,420g which was 19% lower than that measured in the current process. The standard deviations of the weights were found to be similar to those in the current process and it showed a low dispersion. The mean deformation was measured to be 0.9237mm, which represented a 57% reduction compared to the mean deformation in the current process, and the standard deviation decreased from 0.3298mm to 0.1398mm. Moreover, we analyzed the process capability for deformation, and the results showed that the short-term process capability increased from 2.73 to 6.60 which was even higher than targeted level of 6.0.