Process Capability Optimization of Ball Bonding Using Response Surface Analysis in Light Emitting Diode(LED) Wire Bonding (반응 표면 분석법을 이용한 Light Emitting Diode(LED) wire bonding 용 Ball Bonding 공정 최적화에 관한 연구)
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- Journal of the Korea Academia-Industrial cooperation Society
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- v.18 no.4
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- pp.175-182
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- 2017