• Title/Summary/Keyword: Deposition reduction

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A Study on the Grain Growth and Structure Properties of LPCVD Films Using $Si_2H_6$ GAS ($Si_2H_6$를 이용한LPCVD 실리콘 박막의 결정 성장 및 구조적 성질에 관한 연구)

  • 홍찬희;박창엽
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.40 no.7
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    • pp.670-674
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    • 1991
  • This paper presents the material properties of LPCVD silicon films formed using Si2H6 gas at various deposition temperatures. To study the structural properties depending on the deposition temperature, XRD, EBD and TEM analyses were used. The maximum grain size in this experiment was obtained at the deposition temperature of 485ø C. It is discussed that LPCVD films formed below the deposition temperature of 485ø C are promising for low temperature TFT applications. The enhancement of the film characteristics results from the reduction of grain boundary density. We also observed that the film properties of Si2H6 at 600ø C was quite different from those of Si H4 at 600ø C. It has shown that the grain structure from a TEM analysis was elliptical and not dependent on the deposition temperature.

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Optimization of the Material and Structure of Component Parts for Reducing the Number of Impurity Particles in CVD Process

  • Kim, Won Kyung;Woo, Ram;Roh, Jong Wook
    • Journal of the Korean Ceramic Society
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    • v.56 no.3
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    • pp.277-283
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    • 2019
  • We have examined minimization of the number of impurity particles by replacing the load-lock chamber materials of the chemical vapor deposition equipment through optimization of the pumping method in the deposition chamber. In order to reduce the number of impurity particles in the chamber, the load-lock spacer material was changed from monomer casting nylon to Torlon. Furthermore, we controlled the pumping speed and number of pumping ports, which resulted in a reduction in the impurity particle generation from 2.67% to 0.52%. This study revealed that the selection of the material for the parts of a chemical vapor deposition chamber can minimize particle generation, thereby presenting a method of optimization method of the chemical vapor deposition chamber.

Reduction Effect for Deposition in Navigation Channel with Vegetation Model (식생모형에 의한 항로매몰 저감 특성)

  • Lee, Seong-Dae;Kim, Seong-Deuk;Kim, Ick-Hyun
    • Journal of Navigation and Port Research
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    • v.36 no.8
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    • pp.659-664
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    • 2012
  • Coastal vegetaion consists of rooted flowering marine plants that provide a variety of ecosystem services to the coastal areas they colonize. The attenuation of waves and sediments stabilization are often listed among these services. From this point of view, artificial vegetation model is an effective method of controlling sea bed and stabilization without damaging the landscape or the stability of the coastaline. In this study, numerical and hydraulic physical test for predicting deposition proces of a navigation channel caused by wave action is proposed. In the numerical model, we develop a numerical model for describing the wave attenuation and sediment transport in a navigation channel with a vegetation area. In addition, hydraulic model tests is performed in a navigation channel with irregular waves to examine the effect of vegetation in relation to deposition reduction in navigation channel. A comparison between the results of hydraulic and numerical tests shows resonable agreement.

Effect of Deposition Time and Pressure on Properties of Selective CVD-W by $SiH_4$ Reduction ($SiH_4$ 환원에 의한 Selective CVD-W막 특성에 대한 증착시간과 압력의 효과)

  • Lee, Chong-Mu;Lee, Kang-Uk;Park, Sun-Hoo
    • Korean Journal of Materials Research
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    • v.1 no.4
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    • pp.177-183
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    • 1991
  • Change of the properties of selective CVD-W by $SiH_4$ reduction with the variation of deposition time and pressure has been investigated. The lime required for covering the who)to Si substrate by tungsten at $300^{\circ}C$ under the pressure of 100mtorr is approximately 30 seconds. The film thickness tends to increase linearly in the early stage of deposition process and parabolically later, sheer resistance of the film tends to decrease rapidly initially, and slowly later with deposition time. Tungsten grain size does not change much, but grain boundary becomes hazy in the pressure range of 50-300mtorr. Also no ${\beta}-W$ but only ${\alpha}-W$ was found in this pressure range. The deposition rate and electrical resistivity of tungsten tend to increase wish increasing pressure. The results of AES analysis show that pressure does not much affect Si/W ratio of the tungsten film and silicidation at the W/Si interface.

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Fabrication of Metal-Semiconductor Interface in Porous Silicon and Its Photoelectrochemical Hydrogen Production

  • Oh, Il-Whan;Kye, Joo-Hong;Hwang, Seong-Pil
    • Bulletin of the Korean Chemical Society
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    • v.32 no.12
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    • pp.4392-4396
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    • 2011
  • Porous silicon with a complex network of nanopores is utilized for photoelectrochemical energy conversion. A novel electroless Pt deposition onto porous silicon is investigated in the context of photoelectrochemical hydrogen generation. The electroless Pt deposition is shown to improve the characteristics of the PS photoelectrode toward photoelectrochemical $H^+$ reduction, though excessive Pt deposition leads to decrease of photocurrent. Furthermore, it is found that a thin layer (< 10 ${\mu}m$) of porous silicon can serve as anti-reflection layer for the underlying Si substrate, improving photocurrent by reducing photon reflection at the Si/liquid interface. However, as the thickness of the porous silicon increases, the surface recombination on the dramatically increased interface area of the porous silicon begins to dominate, diminishing the photocurrent.

Electrical and Optical Properties of Zinc Oxide Thin Films Deposited Using Atomic Layer Deposition

  • Kim, Jeong-Eun;Bae, Seung-Muk;Yang, Hee-Sun;Hwang, Jin-Ha
    • Journal of the Korean Ceramic Society
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    • v.47 no.4
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    • pp.353-356
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    • 2010
  • Zinc oxide (ZnO) thin films were deposited using atomic layer deposition. The electrical and optical properties were characterized using Hall measurements, spectroscopic ellipsometry and UV-visible spectrophotometry. The electronic concentration and the mobility were found to be critically dependent on the deposition temperature, exhibiting increased resistivity and reduced electronic mobility at low temperature. The corresponding optical properties were measured as a function of photon energy ranging from 1.5 to 5.0 eV. The simulated extinction coefficients allowed the determination of optical band gaps, i.e., ranging from 3.36 to 3.41 eV. The electronic carrier concentration appears to be related to the reduction in the corresponding band gap in ZnO thin films.

Product and Properties of Embedded Capacitor by Aerosol Deposition (Aerosol Deposition에 의한 Embedded Capacitor의 제조 및 특성 평가)

  • Yoo, Hyo-Sun;Cho, Hyun-Min;Park, Se-Hoon;Lee, Kyu-Bok;Kim, Hyeong-Joon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.313-313
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    • 2008
  • Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

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Preparation and Properties of ZnO Thin Films by Metal-Organic Chemical Vapor Deposition Using Diethylzinc Source (Diethylzinc를 Source로 사용하는 화학증착법(MOCVD)에 의한 ZnO 박막의 제조 및 물성에 관한 연구)

  • 김경준;김광호
    • Journal of the Korean Ceramic Society
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    • v.28 no.8
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    • pp.585-592
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    • 1991
  • ZnO films were deposited onto Corning glass 7059 substrate in the temperature range from $200^{\circ}C$ to $450^{\circ}C$ by chemical vapor deposition technique using the hydrolysis of Diet ylzinc (DEZ). As the deposition temperature increased from $200^{\circ}C$ to $350^{\circ}C$, the deposition rate increased with the apparent activation energy of ∼23kJ/mole. Further increase of the deposition temperature above $400^{\circ}C$, however, resulted in a reduction of the rate. It was found that ZnO film grew with a strong C-axis preferred orientation at the temperature of $400^{\circ}C$. As the deposition temperature increased, the film resistivity decreased down to ∼0.2 $\Omega$cm at $450^{\circ}C$. The electrical resistivity was governed more likely by electron concentration rather than by electron mobility. Average optical transmission of the films in the optical wavelength range of 400 nm to 900 nm was over 90% and the optical energy band gap of 3.28∼3.32 eV was obtained from the direct transition.

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The Effect of Pressure Increase on the Deposition of Tungsten by CVD using SiH4 (SiH$_4$를 이용한 텅스텐의 화학증착시 압력증가가 증착에 미치는 영향)

  • 박재현;이정중;금동화
    • Journal of the Korean institute of surface engineering
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    • v.26 no.1
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    • pp.3-9
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    • 1993
  • Chemical vapor deposited tungsten films were formed in a cold wall reactor at pressures higher (10~120torr) than those conventionally employed (<1torr). SiH4, in addition to H2, was used as the reduction gas. The effects of pressure and reaction temperature on the deposition rate and morphology of the films were ex-amined under the above conditions. No encroachment or silicon consumption was observed in the tungsten de-posited specimens. A high deposition rate of tungsten and a good step coverage of the deposited films were ob-tained at 40~80 torr and at a temperature range of $360~380^{\circ}C$. The surface roughness and the resistivity of the deposited film increased with pressure. The deposition rate of tungsten increased with the total pressure in the reaction chamber when the pressure was below 40 torr, whereas it decreased when the total pressure ex-ceedeed 40 torr. The deposition rate also showed a maximum value at $360^{\circ}C$ regardless of the gas pressure in the chamber. The results suggest that the deposition mechanism varies with pressure and temperature, the surface reac-tion determines the overall reaction rate and (2) at higher pressures(>40 torr) or temperatures(>36$0^{\circ}C$), the rate is controlled by the dtransportation rate of reactive gas molecules. It was shown from XRD analysis that WSi2 and metastable $\beta$-W were also formed in addition to W by reactions between WF6 and SiH4.

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Organic fouling in forward osmosis (FO): Membrane flux behavior and foulant quantification

  • Xia, Shengji;Yao, Lijuan;Yang, Ruilin;Zhou, Yumin
    • Membrane and Water Treatment
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    • v.6 no.2
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    • pp.161-172
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    • 2015
  • Forward osmosis (FO) is an emerging membrane technology with potential applications in desalination and wastewater reclamation. The osmotic pressure gradient across the FO membrane is used to generate water flux. In this study, flux performance and foulant deposition on the FO membrane were systematically investigated with a co-current cross-flow membrane system. Sodium alginate (SA), bovine serum albumin (BSA) and tannic acid (TA) were used as model foulants. Organics adsorbed on the membrane were peeled off via oscillation and characterized by Fourier transform infrared (FTIR) spectroscopy and scanning electron microscopy (SEM). When an initial flux of $8.42L/m^2h$ was applied, both flux reduction and foulant deposition were slight for the feed solution containing BSA and TA. In comparison, flux reduction and foulant deposition were much more severe for the feed solution containing SA, as a distinct SA cake-layer was formed on the membrane surface and played a crucial role in membrane fouling. In addition, as the initial SA concentration increased in FS, the thickness of the cake-layer increased remarkably, and the membrane fouling became more severe.