• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.180-180
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• 2010

The design and implementation of high rate deposition process and anti-scratch property of silicon oxide film by PECVD with UHF power were investigated according to the effect of UHF input power with HF bias. New regime of high rate deposition of SiOx films by hybrid plasma process was investigated. The dissociation of OMCTS (C8H24Si4O4) precursor was controlled by plasma processes. SiOx films were deposited on polyethylene terephthalate (PET) and polycarbonate substrate by plasma enhanced chemical vapor deposition (PECVD) using OMCTS with oxygen carrier gas. As the input energy increased, the deposition rate of SiOx film increased. The plasma diagnostics were performed by optical emission spectrometry. The deposition rate was characterized by alpha-step. The mechanical properties of the coatings were examined by nano-indenter and pencil hardness, respectively. The deposition rate of the SiOx films could be controlled by the appropriate intensity of excited neutrals, ionized atoms and UHF input power with HF bias at room temperature, as well as the dissociation of OMCTS.

• Progress in Superconductivity and Cryogenics
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• v.23 no.3
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• pp.41-44
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• 2021

We developed an optimization process of the pulsed laser deposition method to grow epitaxial CeCoIn₅ thin films on MgF₂ substrates. The effects of different deposition parameters on film growth were extensively studied by analyzing the measured X-ray diffraction patterns. All the deposited films contained small amounts of CeIn₃ impurity phase and misoriented CeCoIn₅, for which the c-axis of the unit cell is perpendicular to the normal vector of the substrate surface. The deposition temperature, target composition, laser energy density, and repetition rate were found effective in the formation of (00l)-oriented CeCoIn₅ as well as the undesired phases such as CeIn₃, misoriented CeCoIn₅ along the (112) and (h00). Our results provide a set of deposition parameters that produce high-quality epitaxial CeCoIn₅ thin films with sufficiently low amounts of impurity phases and can serve as a reference for future studies to optimize the deposition process further.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.505-506
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• 2006

Size reduction of micro-aperture using additional deposition is presented in this study. PECVD process was used for additional deposition. Rate of deposition is different with deposition direction because corners of shadowmask membrane have a taper. Deposition into backside showed better than deposition into frontside with size reduction. Shadowmask membrane with two materials has stress because of the difference of a coefficient of thermal expansion The cantilever of membrane bend to opposite direction of deposition. Deposition to both frontside and backside could reduce inside stress.

• Journal of Digital Convergence
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• v.15 no.12
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• pp.323-331
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• 2017

In this paper, four types of deposition control processes such as temperature, pressure, input/output(I/O), and gas were replaced by the Internet of Things(IoT) to analyze the data load and sequence procedure before and after the application of it. Through this analysis, we designed the load balancing in the sensing area of the deposition process by creating the sequence diagram of the deposition process. In order to do this, we were modeling of the sensor I/O according to the arrival process and derived the result of measuring the load of CPU and memory. As a result, it was confirmed that the reliability on the deposition processes were improved through performing some functions of the equipment controllers by the IoT. As confirmed through this paper, by applying the IoT to the deposition process, it is expected that the stability of the equipment will be improved by minimizing the load on the equipment controller even when the equipment is expanded.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.183-184
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• 2010

• Journal of the Korean Society of Industry Convergence
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• v.25 no.4_2
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• pp.699-706
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• 2022

In this study, Directed energy deposition (DED) among additive manufacturing is applied to repair damaged spindle key parts of planner miller. The material of the spindle key is SCM415, and the P21 Powder is used. In order to find the optimal deposition conditions for DED equipment, a single-line deposition experiment is conducted to analysis five parameters. The laser power affects the width, and the height is a parameter affected by coaxial gas and powder gas. In addition, laser power, powder feed rate, coaxial gas, and powder gas are parameters that affect dilution. Otimal deposition is that 400 W of laser power, 4.0 g/min of powder feed rate, 6.5 L/min of coaxial gas, 3.0 L/min of powder gas and 4.5 L/min of shield gas. By setting the optimum conditions, a uniform deposition cross section in the form of an ellipse can be obtained. Damage recovery process of spindle key consists of 3D shape design of the base and deposition parts, deposition path creation and deposition process, and post-processing. The hardness of deposited area with P21 powder on the SCM415 spindle key is 336 HV for the surface of the deposition, 260 HV for the boundary area, and 165 HV for the base material.

• Korean Journal of Materials Research
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• v.15 no.11
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• pp.705-710
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• 2005

NIL (nanoimprint lithography) technique has demonstrated a high potential for wafer size definition of nanometer as well as micrometer size patterns. During the replication process by NIL, the stiction between the stamp and the polymer is one of major problems. This stiction problem is moi·e important in small sized patterns. An antistiction layer prevents this stiction ana insures a clean demolding process. In this paper, we were using a TCP (transfer coupled plasma) equipment and $C_4F_8$ as a precursor to make a Teflon-like antistiction layer. This antistiction layer was deposited on a 6 inch silicon wafer to have nanometer scale thicknesses. The thickness of deposited antistiction layer was measured by ellipsometry. To optimize the process factor such as table height (TH), substrate temperature (ST), working pressure (WP) and plasma power (PP), we were using a design of experimental (DOE) method. The table of full factorial arrays was set by the 4 factors and 2 levels. Using this table, experiments were organized to achieve 2 responses such as deposition rate and non-uniformity. It was investigated that the main effects and interaction effects between parameters. Deposition rate was in proportion to table height, working pressure and plasma power. Non-uniformity was in proportion to substrate temperature and working pressure. Using a response optimization, we were able to get the optimized deposition condition at desired deposition rate and an experimental deposition rate showed similar results.

• Wind and Structures
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• v.37 no.1
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• pp.25-38
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• 2023

Due to the complexity and difficulty in meeting the multiphase flow complexity, similarity, and multiscale characteristics, the mechanism of snow drift is so complicated that the snow deposition prediction is still inaccurate and needs to be far improved. Meanwhile, the validation of prediction methods is also limited due to a lack of field-measured data about snow deposition. To this end, a field measurement activity about snow deposition around a cube with time was carried out, and the snow accumulation process was measured under blowing snow conditions in northwest China. The maximum snow depth, snow profile, and variation in snow depth around the cube were discussed and analyzed. The measured results indicated three stages of snow accumulation around the cube. First, snow is deposited in windward, lateral and leeward regions, and then the snow depth in windward and lateral regions increases. Secondly, when the snow in the windward region reaches its maximum, the downwash flow erodes the snow against the front wall. Meanwhile, snow range and depth in lateral regions have a significant increase. Thirdly, a narrow road in the leeward region is formed with the increase in snow range and depth, which results in higher wind speed and reforming snow deposition there. The field measurement study in this paper not only furthers understanding of the snow accumulation process instead of final deposition under complex conditions but also provides an important benchmark for validating prediction methods.

• Journal of ILASS-Korea
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• v.13 no.4
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• pp.193-199
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• 2008

Spray coating is a versatile surface modification technology in which coating is built-up based on the successive deposition of micron-scaled particles. Depending on the coating materials, the coatings can meet the required mechanical properties, corrosion resistance, and other properties of base materials. Spraying processes are mainly classified into thermal and kinetic spraying according to their bonding mechanism and deposition characteristics. Specifically, thermal spraying process can be further classified into many categories based on the design and mechanism of the process, such as frame spraying, arc spraying, atmospheric plasma spraying (APS), and high velocity oxygen-fuel (HVOF) spraying, etc. Kinetic spraying or cold gas dynamic spraying is a newly emerging coating technique which is low-temperature and high-pressure coating process. In this paper, overall view of thermal and kinetic spray coating technologies is discussed in terms of fundamentals and industrial applications. The technological characteristics and bonding mechanism of each process are introduced. Deposition behavior and properties of technologically remarkable materials are reviewed. Furthermore, industrial applications of spray coating technology and its potentials are prospected.

• Carbon letters
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• v.25
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• pp.25-32
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• 2018

In this study, a thermal-gradient chemical vapor infiltration (TG-CVI) process was numerically studied in order to enhance the deposition uniformity within the preform. The computational fluid dynamics technique was used to solve the governing equations for heat transfer and gas flow during the TG-CVI process for two- and three-dimensional (2-D and 3-D) models. The temperature profiles in the 2-D and 3-D models showed good agreement with each other and with the experimental results. The densification process was investigated in a 2-D axisymmetric model. Computation results showed the distribution of the SiC deposition rate within the preform. The results also showed that using two-zone heater gave better deposition uniformity.