• Composites Research
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• 제16권4호
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• pp.51-58
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• 2003

접착 조인트의 안전성은 사용되는 열경화성 접착제의 경화상태에 많은 영향을 받기 때문에, 실시간으로 접착 조인트의 경화를 모니터링 할 수 있다면 조인트의 품질을 향상시킬 수 있다. 본 연구에서는 조인트의 경화 중 접학제의 소산계수를 측정하여 이를 접착제의 경화도로 환산할 수 있는 기법을 제안하였다. 접착제의 소산계수와 경화도의 관계를 실험적으로 연구하였으며, 온도와 경화도에 따라 민감하게 변하는 소산계수로부터 온도가 미치는 영향을 제거하였다. 연구결과 접착제의 소산계수는 그 경화율과 유사한 경향을 보임을 알 수 있었다.

• Composites Research
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• 제28권3호
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• pp.99-103
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• 2015

본 논문에서는 복합재료 제조공정 중 온도에 따른 경화 반응을 이해하고 열분석을 수행하였으며, 이 결과를 바탕으로 온도에 따른 수지의 경화도 및 비열의 변화를 수식화하였다. 온도에 따른 경화도와 비열은 DSC와 MDSC (Modulated DSC)를 활용하여 측정하였다. DSC와 MDSC 분석은 Isothermal과 Dynamic 조건으로 수행하여 Cure Kinetics, 유리전이온도 및 비열을 측정하고, 회기 분석 방법을 이용하여 물성거동을 수학적으로 모델링하였다.

• 펄프종이기술
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• 제38권1호통권113호
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• pp.1-8
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• 2006

To overcome troubles in strength and process of linerboard caused by raw materials, a neutral sizing which is usual in fine paper making can be considered. A new sizing agent is necessary to show good performance in a system with high conductivity and COD. In this study, fast cure type AKD was examined as a new sizing agent and compared with conventional AKD. The effects of fixing agent addition and drying condition were also investigated. Fast cure type AKD which has a higher cationicity showed better sizing degree than conventional AKD in spite of low addition level and no curing treatment. And when fixing agent of sufficient amount was added, sizing degree was improved for both AKDs. High cationicity is a crucial factor for neutral sizing of linerboard for obtaining fast and stable sizing degree. Drying with temperature over $100^{\circ}$ was desirable for developing sizing degree.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.893-894
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• 2011

• Design & Manufacturing
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• 제17권1호
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• pp.1-5
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• 2023

In multi-material injection molding, since two or more materials with different process conditions are used, it is essential to maximize process efficiency by operating the cooling or heating system to a minimum. In this study, Liquid silicone rubber (LSR) that can be cured at a low temperature suitable for the multi-material injection molding was selected and the cure behavior according to the process conditions was analyzed through differential scanning calorimetry (DSC). Dynamic measurement results of DSC with different heating rate were obtained, and through this, the total heat of reaction when the LSR was completely cured was calculated. Isothermal measurement results of DSC were derived for 60 minutes at each temperature from 80 ℃ to 110 ℃ at 10 ℃ intervals, and the final degree of cure at each temperature was calculated based on the total heat of reaction identified from the Dynamic DSC measurement results. As the result, it was found that when the temperature is lowered, the curing start time and the time required for the curing reaction increase, but at a temperature of 90 ℃ or higher, LSR can secure a degree of cure of 80% or more. However, at 80 ℃., it was found that not only had a relatively low degree of curing of about 60%, but also significantly increased the curing start time. In addition, in the case of 110 ℃, the parameters were derived from experimental result using the Kamal kinetic model.

• Journal of Welding and Joining
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• 제33권5호
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• 연구논문집
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• 통권29호
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• pp.151-162
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• 1999

In general, manufacturing processes of thermosetting composites consist of mold filling and resin cure. The important parameters used in modeling and designing mold filling are the permeability of the fibrous preform and the viscosity of the resin. To consolidate a composite, resin cure or chemical reaction plays an essential role. Cure kinetics. Therefore, is necessary to quantify the extent of chemical reaction or degree of cure. It is also important to predict resin viscosity which can change due to chemical reaction during mold filling. There exists a heat transfer between the mold and the composite during mold filling and resin cure. Cure kinetics is also used to predict a temperature profile inside composite. In this study, a new scheme which can determine cure kinetics from dynamic temperature scaning was proposed. The method was applied to epoxy resin system and was verified by comparing measurements and predictions.

• Bulletin of the Korean Chemical Society
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• 제21권6호
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• pp.628-634
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• 2000

Crosslink is the most important chemistry in a rubber vulcanizate. Degree and type of crosslinks of the vulcanizate determine its physical properties. Change of crosslink density and deformation of a rubber vulcanizate by thermal aging were studied using natural rubber (NR) vulcanizates with various cure systems (conventional, semi-EV, and EV) and different cure times (under-, optimum-, and overture). All the NR vulcanizates were deformed by the thermal aging at 60-100 $^{\circ}C.$ The higher the aging temperature is, the more degree of the deformation is. The undercured NR vulcanizates after the thermal aging were deformed more than the optimumand overcured ones. The NR vulcanizates with the EV cure system were less deformed than those with the conventional and semi-EV cure systems. The deformation of the NR vulcanizates was found to be due to change of the crosslink density of the vulcanizates. The crosslink densities of all the vulcanizates after the extraction of organic materials were also changed by the thermal ging. The sources to change the crosslink densities of the vulcanizates by the thermal aging were found to be dissociation of the existing sulfur crosslink and the formation of new crosslinks by free sulfur, reaction products of curing agents, and pendent sulfide groups.

• 대한기계학회논문집
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• 제19권2호
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• pp.527-536
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• 1995

Analysis of pultrusion process for the thermosetting composites containing volatiles was performed. Degree of cure, amount of volatile evolved and pulling force were calculated for the processing variables such as die temperature and pulling speed. Cure kinetics was modeled from the data obtained by DSC(Differential Scanning Calorimeter). The volatile evolution kinetics was modeled from the data by DSC as well as TGA(Thermo Gravimetric Analyzer). The cure kinetics and volatile evolution kinetics models were incorporated into the energy equation. The resulting governing equation was solved using finite element method. Pulling force was calculated through the analysis of pressure developed inside the pultrusion die. Experiments were performed and the data were compared with the calculated results. Good agreements were observed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1220-1223
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• 2003

The UV nanoimprint technology uses the UV light as the energy source. Because the imprint process is carried out in room temperature and low pressure, this technology has its own merits compared to the thermal nanoimprint. However, in UV nanoimprint technology, a resin which has low viscosity is essential for the improvement of accuracy. In this research, a resin (named as IMS01) which has relatively low viscosity was developed. And a measurement system was developed in order to measure the degree of cure of the resin. The measurement system which is composed of FT-IR, UV light source and optical guide can measure the degree of cure in real time. From the experimental results, it was found that the IMS01 is cured more rapidly than existing resin (PAK01).