• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.8
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• pp.869-876
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• 2011

It is important to analyze the dynamic behavior of counter-rotating rigid/deformable rolls in the roll-coating process, because the stability of the process is affected by the dynamic characteristics. In the present study, the effects of material property, angular velocity, and gap size on the contact pressure and contact shape of the deformable roll are numerically investigated. The behavior of two rolls with a negative gap was analyzed using the finite element method, and the material property of the deformable roll was applied with the Mooney-Rivlin coefficients of the hyper-elastic model. The contact shape is affected by the gap size, and the contact pressure mainly depends on the stiffness of the deformable roll and the gap size. To maintain a negative gap between two rolls, controls such as load and displacement controls must be used. The results indicate that displacement control can reduce the instability.

• ETRI Journal
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• v.44 no.1
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• pp.147-154
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• 2022

We demonstrate a new double-layer structure for stretchable interconnects, where the top surface of a serpentine polyimide support is coated with a thin eutectic gallium-indium liquid metal layer. Because the liquid metal layer is constantly fixed on the solid serpentine body in this liquid-on-solid structure, the overall stretching is accomplished by widening the solid frame itself, with little variation in the total length and cross-sectional area of the current path. Therefore, we can achieve both invariant resistance and infinite fatigue life by combining the stretchable configuration of the underlying body with the freely deformable nature of the top liquid conductor. Further, we fabricated various types of double-layer interconnects as narrow as 10 ㎛ using the roll-painting and lift-off patterning technique based on conventional photolithography and quantitatively validated their beneficial properties. The new interconnecting structure is expected to be widely used in applications requiring high-performance and high-density stretchable circuits owing to its superior reliability and capability to be monolithically integrated with thin-film devices.