• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2021년도 추계학술대회
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• pp.290-291
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• 2021

플라스틱 소재 자동차 부품의 도장 공정에서 불량은 다양한 원인과 현상으로 기인하는데, 온도, 습도, 미세먼지 등 기상환경 조건의 변화에 따라 불량률이 변화하는 연관성을 분석하였다. 실제 도장업체에서 1년 동안 수집한 종류별, 원인별 불량률과 기상환경의 상관성을 머신러닝 기법에 의해 학습하고 시험하여 특정의 기상환경에서 불량률을 예측하였다. 그 결과 실먼지로 인한 불량은 98%, 흐름에 대한 불량은 90%의 불량을 예측하여 모델의 성능을 입증하였다.

• 전자공학회논문지A
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• 제32A권8호
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• pp.126-132
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• 1995

The electrical stress of short channel polycrystalline silicon (poly-Si) thin film transistor (TFT) has been investigated. The device characteristics of short channel poly-Si TFT with 5$\mu$m channel length has been observed to be significantly degraded such as a large shift in threshold voltage and asymmetric phenomena after the electrical stress. The dominant degradation mechanism in long channel poly-Si TFT's with 10$\mu$m and 20$\mu$m channel length respectively is charage trappling in gate oxide while that in short channel device with 5.mu.m channel length is defect creation in active poly-Si layer. We propose that the increased defect density within depletion region near drain junction due to high electric field which could be evidenced by kink effect, constitutes the important reason for this significant degradation in short channel poly-Si TFT. The proposed model is verified by comparing the amounts of the defect creation and the charge trapping from the strechout voltage.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 금형가공 심포지엄
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• pp.125-131
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• 2002

Surface defects in injection molded parts are due to the unsteady flow of polymer melt which are related to the geometries of cavity and gate, the operational conditions of injection and the rheological properties of polymer. In this study we have examined jetting phenomena in injection molding process for three kinds of PCs which have different molecular weight and structure, PBT and PC/ABS alloy with several injection speeds. We have used various cavity shapes that are tensile, flexural and impact test specimens with various gate and cavity thicknesses. Through this study we have observed that the formation of surface defect associated with jetting during filling stage in injection molding is strongly related to die swell. This means that the jetting is strongly affected by the elastic property rather than the viscous property in viscoelastic characteristics of molten polymer. Large die swell would eliminate jetting however, the retardation of die swell would stimulate jetting. In the point of mold design, reducing the thickness ratio of cavity to gate can reduce or eliminate jetting and associated surface defects regardless of magnitude of elastic property. It also enlarges process window that can produce steady flow of polymer melt in injection molding.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 추계학술대회 논문집
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• pp.364-367
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• 2007

In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

• 산업경영시스템학회지
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• 제44권1호
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• pp.60-70
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• 2021

Recently, with the development of technologies for the fourth industrial revolution, convergence and complex technology are being applied to aircraft, electronic home appliances and mobile devices, and the number of parts used is increasing. Increasing the number of parts and the application of convergence technologies such as HW (hardware) and SW (software) are increasing the No Defect Found (NDF) phenomenon in which the defect is not reproduced or the cause of the defect cannot be identified in the subsequent investigation systems after the discovery of the defect in the product. The NDF phenomenon is a major problem when dealing with complex technical systems, and its consequences may be manifested in decreased safety and dependability and increased life cycle costs. Until now, NDF-related prior studies have been mainly focused on the NDF cost estimation, the cause and impact analysis of NDF in qualitative terms. And there have been no specific methodologies or examples of a working-level perspective to reduce NDF. The purpose of this study is to present a practical methodology for reducing NDF phenomena through data mining methods using quantitative data accumulated in the enterprise. In this study, we performed a cluster analysis using market defects and design-related variables of mobile devices. And then, by analyzing the characteristics of groups with high NDF ratios, we presented improvement directions in terms of design and after service policies. This is significant in solving NDF problems from a practical perspective in the company.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.305-306
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• 2002

In this paper, the endurance life of the rolling bearings with defective balls and their failure (flaking) phenomena are presented. It was found that the lives of ball bearings with defective balls were shorter than that of calculated L10 life as well as that of normal bearings in spite of the using standard bearing components. Although the bearings were assembled with defective balls, whereas the other parts were qualified new ones, the main failures were occurred on the inner ring raceways. Moreover, the failures were on the center of the groove curvature and the severity of failure is similar to the order of initial defect depth of the balls. These shows that the defects on the bearings can affect the life of tribologically contacted mating parts.

• 소성∙가공
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• 제3권1호
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• pp.23-37
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• 1994

The upper bound element technique(UBET) is used to analyze the final stage of the axisymmetric forward extrusion. Kinematically admissible velocity field involving curved surface of velocity discontinuity is assumed. The required power to arise the piping defect is obtained and is compared with Aviture's solution a the same condition. Conditions for inception of the cavity and development of the pipe are predicted. The internal radius of the pipe and critical length of billet are also determined. Experiments are carried out for extrusion with lead specimens to investigate the piping phenomena. The theoretically predicted results showed reasonably good agreement with the experimental observation.

• 대한기계학회논문집B
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• 제30권5호
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• pp.397-404
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• 2006

Effects of surface defect distribution on flame instability during flame-surface interaction are experimentally investigated. To examine chemical quenching phenomenon which is caused by radical adsorption and recombination processes on the surface, thermally grown silicon oxide plates with well-defined defect density were prepared. ion implantation technique was used to control the number of defects, i.e. oxygen vacancies. In an attempt to preferentially remove oxygen atoms from silicon dioxide surface, argon ions with low energy level from 3keV to 5keV were irradiated at the incident angle of $60^{\circ}$. Compositional and structural modification of $SiO_2$ induced by low-energy $Ar^+$ ion irradiation has been characterized by Atomic Force Microscopy (AFM) and X-ray Photoelectron Spectroscopy (XPS). It has been found that as the ion energy is increased, the number of structural defect is also increased and non-stoichiometric condition of $SiO_x({\le}2)$ is enhanced.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.282-283
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• 2006

The transport phenomena of arsenic (As) doped amorphous selenium(a-Se:As) thin film for digital X-ray conversion material has been reported. The effect of As addition on the carrier mobility and recombination lifetime in a-Se:As sample has been measured using the moving photo-carrier grating (MPG) technique. An Increase in hole mobility and recombination was observed when 0.3% arsenic, was added into a-Se sample, whereas electron mobility decrease with arsenic addition due to the defect density. The fabricated a-Se:03% As device exhibited the highest X-ray sensitivity.

• 한국정밀공학회지
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• 제30권12호
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• pp.1295-1301
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• 2013

The cause of flow mark defect is known as non-uniform temperature of mold surface when the flow front meets the cold cavity. The exact definition and classification of Flow mark is not clear because the mechanism of flow mark is not figured out till now. Any injection molding analysis software can not predict the flow mark phenomena. To solve weldline and flow mark defects, the gate thickness is reduced to increase the melt front velocity and the melt front velocity of the flow mark area is increased from 82.3mm/s to 104.7mm/s. In addition, the bulk temperature of the flow mark area is increased from $178.3^{\circ}C$to $215.2^{\circ}C$ by adding a cold slug well. The flow mark phenomena can be greatly reduced by increasing the flow front velocity and elevating the bulk temperature.