• 제목/요약/키워드: Defect Density

검색결과 464건 처리시간 0.03초

Dichlorosilane Gas를 이용한 High Temperature Oxide Thin Film의 특성 (Characteristics of High Temperature Oxide Thin Film Using Dichlorosilane Gas)

  • 이승석;이석희;김종철;박헌섭;오계환
    • 한국진공학회지
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    • 제1권1호
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    • pp.190-197
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    • 1992
  • In this study we have investigated physical and electrical properties of high temperature oxide (HTO) thin film using dichlorosilane (DCS) gas. This film had low etch rate and excellent step coverage, and its characteristics of Si-O bond were similar to those of thermal oxide. I-V curves also showed similar electrical properties to those of thermally grown oxide (SiO2) while time dependent dielectric breakdown (TDDB) results revealed 1/4 value of thermal oxide. However, defect density was measured to be much lower value than that of thermal oxide.

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Science and Technology on MgO Protecting Materials for ac Plasma Displays

  • Uchiike, Heiju;Hirakawa, Takayoshi
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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    • pp.705-709
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    • 2005
  • In order to clarify the heat annealing process for Magnesium Oxide (MgO), cathodoluminescent (CL) analysis was performed. Our results in the present work prove that the heat annealing has effects on not only removing water from the surface of MgO, but also increasing density of O and Mg defect pairs. It is the first work that the influence of annealing process on physical properties of the vacuum evaporated MgO thin films by using CL spectra.

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비정질 As-Ge-Te 스위칭 소자의 전기적 및 마이크로파 주파수 특성 (Electrical and Microwave properties of Amorphous As-Ge-Te devices)

  • 이병석;천석표;이현용;이영종;정홍배
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 하계학술대회 논문집 C
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    • pp.1016-1018
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    • 1995
  • In this paper, we studied the electrical and the microwave properties of the amorphous $As_{10}Ge_{15}Te_{75}$ thin film. The electrical properties of a-$As_{10}Ge_{15}Te_{75}$ thin film were examined d.c. and a.c. bias with annealing condition. As the result of the electrical properties, we observed the physical characteristics of a-$As_{10}Ge_{15}Te_{75}$ thin film such as the density of defect states, characteristic relaxation time, localized density of states, and localized wave function by using CBH and QMT model. We also examined the microwave conduction properties before and after d.e. switching.

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STI CMP 공정의 신뢰성 및 재현성에 관한 연구 (A Study on the Reliability and Reproducibility of 571 CMP process)

  • 정소영;서용진;김상용;이우선;장의구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.25-28
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    • 2001
  • Recently, STI(Shallow Trench Isolation) process has attracted attention for high density of semiconductor device as a essential isolation technology. Without applying the conventional complex reverse moat process, CMP(Chemical Mechanical Polishing) has established the Process simplification. However, STI-CMP process have various defects such as nitride residue, torn oxide defect, damage of silicon active region, etc. To solve this problem, in this paper, we discussed to determine the control limit of process, which can entirely remove oxide on nitride from the moat area of high density as reducing the damage of moat area and minimizing dishing effect in the large field area. We, also, evaluated the reliability and reproducibility of STI-CMP process through the optimal process conditions.

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Microstructural Analysis of Directionally Solidified Materials Obtained via Line-Scan SLS of Si Films

  • Chung, U.J.;Limanov, A.B.;Wilt, P.C. Van Der;Chitu, A.M.;Im, James S.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1744-1749
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    • 2006
  • Line-scan SLS of thin Si films permits the attainment of low-defect-density Si films with a directionally solidified microstructure. This paper deals with: (1) identifying and examining the structural defects that are found in the resultant material, (2) how the spatial variations in the type and density of the observed defects may potentially affect the overall uniformity of the resulting devices, and (3) some technical options that may be applied in order to potentially alleviate the situation.

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설계공간 최적화를 이용한 뼈 성장 모사 (A Simulation Method for Bone Growth Using Design Space Optimization)

  • 장인권;곽병만
    • 대한기계학회논문집A
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    • 제30권6호
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    • pp.722-727
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    • 2006
  • Bone fracture healing is one of the important topics in biomechanics, demanding computation simulations due to the difficulty of obtaining experimental or clinical results. In this study, we adopt the design space optimization method which was established by the authors as a tool for the simulation of bone growth using its evolutionary characteristics. As the mechanical stimulus, strain energy density is used. We assume that bone tissues over a threshold strain energy density will be differentiated and bone tissues below another threshold will be resorbed. Under compression and torsion as loadings, the filling process of the defect is well illustrated following the given mechanical criterion. It is shown that the design space optimization is an excellent tool for simulating the evolutionary process of bone growth, which has not been possible otherwise.

광소자로 사용되는 ZnTe박박의 결정성에 따른 결함 관찰 (Crystallinity and Internal Defect Observation of the ZnTe Thin Film Used by Opto-Electronic Sensor Material)

  • Kim, B.J.
    • 한국표면공학회지
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    • 제35권5호
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    • pp.289-294
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    • 2002
  • ZnTe films have been grown on (100) GaAs substrate with two representative problems. The one is lattice mismatch, the other is thermal expansion coefficients mismatch of ZnTe /GaAs. It claims here, the relationship of film thickness and defects distribution with (100) ZnTe/GaAs using hot wall epitaxy (HWE) growth was investigated by transmission electron microscopy (TEM). It analyzed on the two-sort side using TEM with cross-sectional transmission electron microscopy (XTEM) and high-resolution electron microscopy (HREM). Investigation into the nature and behavior of dislocations with dependence-thickness in (100) ZnTe/ (100) GaAs hetero-structures grown by transmission electron microscopy (TEM). This defects range from interface to 0.7 $\mu\textrm{m}$ was high density, due to the large lattice mismatch and thermal expansion coefficients. The defects of low density was range 0.7$\mu\textrm{m}$~1.8$\mu\textrm{m}$. In the thicker range than 1.8$\mu\textrm{m}$ was measured hardly defects.

목재판상류 변형에 관한 연구 (A Study on Warping of Panel Products)

  • 김수원;강호양
    • 한국가구학회지
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    • 제13권1호
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    • pp.19-25
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    • 2002
  • Modern furniture is mostly made of panel products such as a glue-up panel, a particle board and a medium density fiberboard(MDF). Warping is a major defect of these panel products resulting in degrading final products. In this study the factors related to the warping of a glue-up panel and MDF were investigated by comparing the physical properties of warped specimens with those of the unwarped. The differences between the moisture contents measured on the both surfaces of specimens were found to mainly influence the warping of glue-up panel specimens whether conditioned or not. The average oven-dry density of warped glue-up panel specimens was definitely higher than that of the unwarped at l% significance level. For MDF the influencing factor on warping has not been revealed yet, however it was found that the conditioning reduced the number of warped specimens.

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Epitaxial Growth of $\beta$-SiC Thin Films on Si(100) Substrate without a Carburized Buffer Layer

  • Wook Bahng;Kim, Hyeong-Joon
    • The Korean Journal of Ceramics
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    • 제3권3호
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    • pp.163-168
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    • 1997
  • Most of heteroepitaxial $\beta$-SiC thin films have been successfully grown on Si(100) adapting a carburizing process, by which a few atomic layers of substrate surface is chemically converted to very thin SiC layer using hydrocarbon gas sources. Using an organo-silicon precursor, bis-trimethylsilymethane (BTMSM, [$C_7H_{20}Si_2$]), heteropitaxial $\beta$-SiC thin films were successfully grown directy on Si substrate without a carburized buffer layer. The defect density of the $\beta$-SiC thin films deposited without a carburized layer was as low as that of $\beta$-SiC films deposited on carburized buffer layer. In addition, void density was also reduced by the formation of self-buffer layer using BTMSM instead of carburized buffer layer. It seems to be mainly due to the characteristic bonding structure of BTMSM, in which Si-C was bonded alternately and tetrahedrally (SiC$_4$).

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