• Title/Summary/Keyword: Decoupling Capacitance

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BST Thin Film Multi-Layer Capacitors

  • Choi, Woo Sung;Kang, Min-Gyu;Ju, Byeong-Kwon;Yoon, Seok-Jin;Kang, Chong-Yun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.319-319
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    • 2013
  • Even though the fabrication methods of metal oxide based thin film capacitor have been well established such as RF sputtering, Sol-gel, metal organic chemical vapor deposition (MOCVD), ion beam assisted deposition (IBAD) and pulsed laser deposition (PLD), an applicable capacitor of printed circuit board (PCB) has not realized yet by these methods. Barium Strontium Titanate (BST) and other high-k ceramic oxides are important materials used in integrated passive devices, multi-chip modules (MCM), high-density interconnect, and chip-scale packaging. Thin film multi-layer technology is strongly demanded for having high capacitance (120 nF/$mm^2$). In this study, we suggest novel multi-layer thin film capacitor design and fabrication technology utilized by plasma assisted deposition and photolithography processes. Ba0.6Sr0.4TiO3 (BST) was used for the dielectric material since it has high dielectric constant and low dielectric loss. 5-layered BST and Pt thin films with multi-layer sandwich structures were formed on Pt/Ti/$SiO_2$/Si substrate by RF-magnetron sputtering and DC-sputtering. Pt electrodes and BST layers were patterned to reveal internal electrodes by photolithography. SiO2 passivation layer was deposited by plasma-enhanced chemical vapor deposition (PE-CVD). The passivation layer plays an important role to prevent short connection between the electrodes. It was patterned to create holes for the connection between internal electrodes and external electrodes by reactive-ion etching (RIE). External contact pads were formed by Pt electrodes. The microstructure and dielectric characteristics of the capacitors were investigated by scanning electron microscopy (SEM) and impedance analyzer, respectively. In conclusion, the 0402 sized thin film multi-layer capacitors have been demonstrated, which have capacitance of 10 nF. They are expected to be used for decoupling purpose and have been fabricated with high yield.

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Modified Modular Multilevel Converter with Submodule Voltage Fluctuation Suppression

  • Huang, Xin;Zhang, Kai;Kan, Jingbo;Xiong, Jian
    • Journal of Power Electronics
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    • v.17 no.4
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    • pp.942-952
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    • 2017
  • Modular multilevel converters (MMCs) have been receiving extensive research interest in high/medium-voltage applications due to its modularity, scalability, reliability, high-voltage capability, and excellent harmonic performance. Submodule capacitors are usually rather bulky because they have to withstand fundamental frequency voltage fluctuations. To reduce the capacitance of these capacitors, this study proposes a modified MMC with an active power decoupling circuit within each submodule. The modified submodule contains an auxiliary half bridge, with its capacitor split in two. Also, the midpoints of the half bridge and the split capacitors are connected by an inductor. With this modified submodule, the fundamental frequency voltage fluctuation can be suppressed to a great extent. The second-order voltage fluctuation, which is the second most significant component in submodule voltage fluctuations, is removed by the proper control of the second-order circulating current. Consequently, the submodule capacitance is significantly reduced. The viability and effectiveness of the proposed new MMC are confirmed by the simulation and experimental results. The proposed MMC is best suited for medium-voltage applications where power density is given a high priority.

Room-Temperature Fabrication of Barium Titanate Thin Films by Aerosol Deposition Method (에어로졸데포지션법을 이용한 $BaTiO_3$ 박막의 상온 코팅)

  • Oh, Jong-Min;Nam, Song-Min
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.31-31
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    • 2008
  • 고주파 잡음 발생과 고집적화 문제 해결을 위해 고용량 디커플링 캐패시터를 기판에 내장하는 연구가 활발히 진행되고 있다. 본 연구에서는 초고주파 환경에서 고용량 기판 내장형 디커플링 캐패시터로의 응용을 위해 $BaTiO_3$박막을 에어로졸 데포지션 법을 이용하여 12~0.2 ${\mu}m$의 두께로 제조하였고 그 유전특성을 조사하였다. 그결과, 1 MHz에서 permittivity가 70, loss tangent은 3% 이하였으며, capacitance density는 $1{\mu}m$의 두께에서 59 nF/$cm^2$이었다. 하지만, 박막의 두께가 $1{\mu}m$ 이하에서는 XRD를 통해 결정성이 확인 되었음에도 큰 누설전류로 인해 유전특성을 확인할 수 없었다. 이 누설전류의 발생 원인을 조사하기 위해 $BaTiO_3$박막의 표면의 미세구조를 SEM으로 관찰한 결과 여러 결함들이 확인되었으며, 또한 전극 직경의 크기를 1.5 mm에서 0.33 mm로 작게 변화시킴으로서 그 유전특성을 조사하여 박막의 불균일성과 박막화의 가능성을 확인하였다.

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Development of Polymer Slip Tactile Sensor Using Relative Displacement of Separation Layer (분리층의 상대 변위를 이용한 고분자 미끄럼 촉각 센서 개발)

  • Kim, Sung-Joon;Choi, Jae-Young;Moon, Hyung-Pil;Choi, Hyouk-Ryeol;Koo, Ja-Choon
    • The Journal of Korea Robotics Society
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    • v.11 no.2
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    • pp.100-107
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    • 2016
  • To realize a robot hand interacting like a human hand, there are many tactile sensors sensing normal force, shear force, torque, shape, roughness and temperature. This sensing signal is essential to manipulate object accurately with robot hand. In particular, slip sensors make manipulation more accurate and breakless to object. Up to now several slip sensors were developed and applied to robot hand. Many of them used complicate algorithm and signal processing with vibration data. In this paper, we developed novel principle slip sensor using separation layer. These two layers are moved from each other when slip occur. Developed sensor can sense slip signal by measuring this relative displacement between two layers. Also our principle makes slip signal decoupled from normal force and shear force without other sensors. The sensor was fabricated using the NBR(acrylo-nitrile butadiene rubber) and the Ecoflex as substrate and a paper as dielectric. To verify our sensor, slip experiment and normal force decoupling test were conducted.

A Novel Input and Output Harmonic Elimination Technique for the Single-Phase PV Inverter Systems with Maximum Power Point Tracking (최대출력추종 제어를 포함한 단상 태양광 인버터를 위한 새로운 입출력 고조파 제거법)

  • Amin, Saghir;Ashraf, Muhammad Noman;Choi, Woojin
    • Proceedings of the KIPE Conference
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    • 2019.07a
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    • pp.207-209
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    • 2019
  • This paper proposes a grid-tied photovoltaic (PV) system, consisting of Voltage-fed dual-active-bridge (DAB) dc-dc converter with single phase inverter. The proposed converter allows a small dc-link capacitor, so that system reliability can be improved by replacing electrolytic capacitors with film capacitors. The double line frequency free maximum power point tracking (MPPT) is also realized in the proposed converter by using Ripple Correlation method. First of all, to eliminate the double line frequency ripple which influence the reduction of DC source capacitance, control is developed. Then, a designing of Current control in DQ frame is analyzed and to fulfill the international harmonics standards such as IEEE 519 and P1547, $3^{rd}$ harmonic in the grid is directly compensated by the feedforward terms generated by the PR controller with the grid current in stationary frame to achieve desire Total Harmonic Distortion (THD). 5-kW PV converter and inverter module with a small dc-link film capacitor was built in the laboratory with the proposed control and MPPT algorithm. Experimental results are given to validate the converter performance.

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