• 제목/요약/키워드: DXF(Drawing exchange Format)

검색결과 10건 처리시간 0.026초

간단한 DXF파일에 워터마크삽입과 추출에 관한 연구 (A study on the insertion & extraction for the simple DXF File Watermark)

  • 강환일;김갑일;정철균;이성의;박경용;박귀태
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 D
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    • pp.2777-2781
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    • 2001
  • This paper presents an algorithm of the watermark insertion and extraction on the vector image. Most parts of the vector image consist of the array of the coordinate values. The vector watermarking method by Sakamoto et al [1] uses the mask within which all the coordinate values of all the vertices are changed depending on the value of the watermark. The proposed algorithm is the change of the vector image file instead of the change of the coordinate values on the vector image. We use the Drawing Exchange Format (DXF) files since the DXF file is one of the general files in the field of the vector image.

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GML Map Visualization on Mobile Devices

  • Song, Eun-Ha;Jeong, Young-Sik
    • Journal of Information Processing Systems
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    • 제6권1호
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    • pp.33-42
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    • 2010
  • GIS can only be applied to certain areas by storing format. It is subordinate to a system when displaying geographic information data. It is therefore inevitable for GIS to use GML that supports efficient usage of various geographic information data and interoperability for integration and sharing. The paper constructs VisualGML that translates currently-used geographic information such as DXF (Drawing Exchange Format), DWG (DraWinG), or SHP (Shapefile) into GML format for visualization. VisualGML constructs an integrated map pre-process module, which filters geographic information data according to its tag and properties, to provide the flexibility of a mobile device. VisualGML also provides two major GIS services for the user and administrator. It can enable visualizing location search. This is applied with a 3-Layer POI structure for the user. It has trace monitoring visualization through moving information of mobile devices for the administrator.

GIS와 CALS/EC 시스템의 자료 교환 포맷 연구 (Study of the Data Exchange Format of GIS and CALS/EC System)

  • 이상길;정종철
    • Spatial Information Research
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    • 제12권2호
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    • pp.151-163
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    • 2004
  • 연구는 KOSDIC(Korea Standard of Drawing Information in Construction)과 GIS데이터의 효율적인 연계를 위한 도면 교환 포맷 표준개발에 관한 것으로 CAD도면을 매개로 한 KOSDIC과 GIS데이터의 연계 방안에 관한 것이다 제1차 NGIS사업의 일환으로 전국 수치지도가 CAD데이터로 구축되었고, 개발된 수치지도를 이용하여 지자체를 중심으로 GIS사업이 활발히 추진되면서, UIS, LIS, EIS, AM/FM 등 각종 분야와 지리정보 시스템(geographic information science)이 연계되고 있다. 이러한 추세에서 지리정보시스템은 공간정보를 기반으로 여러분야에 걸쳐 활발히 구축되고 있으며, 여러 시스템들과의 연계에서 데이터 교환의 표준화가 중요하게 부각되고 있다. 그러나 GIS의 수치지도는 CAD도면의 지형도로 만들어져 있어 GIS포맷으로 변환(DWG→DXF→SHP)하여 공간자료로 활용될때 변환과정에서 오류나 문제점이 많이 발생하여 변환 성공률이 높지 못한 문제점을 가지고 있다. 또한, 객체기반으로 생성되는 CAD도면의 사상들은 Point와 Line feature로 이루어져 있기 때문에 Point, Line, Polygon feature를 요소로 하는 GIS시스템에서 Polygon feature의 변환이 불가능하여 데이터의 통합과 표준화에 가장 큰 장애로 대두되고 있다. 따라서, 본 연구에서는 CAD도면을 GIS포맷으로 변환시킬때 발생하는 문제점을 해소하기 위한 방안을 모색해보고자 한다. 이는 향후 KOSDIC과 GIS간의 효율적인 데이터 연계방안 뿐만 아니라 여러 데이터간의 표준화 연구에 많은 도움이 될 것이다.

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모바일 GIS 를 위한 XML 변환 (XML Transformation for Mobile GIS)

  • 신홍섭;오세만
    • 한국정보처리학회:학술대회논문집
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    • 한국정보처리학회 2002년도 춘계학술발표논문집 (하)
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    • pp.1041-1044
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    • 2002
  • 1990 년대 이후 NGIS(National Geographic Information System) 사업의 시작과 함께 활성화 되기 시작한 GIS 는 1990 년대 말 인터넷의 급속한 보급으로 인하여 비약적인 발전을 거듭하였다. 근래에 들어, 무선 인터넷의 확산과 함께 모바일 GIS 가 등장하게 되었으나, 기관이나 기업의 서로 상이한 GIS 데이터베이스는 중복투자와 함께 데이터베이스간의 이질성을 초래하였다. 본 논문에서는 국립지리원에서 제공하는 DXF(Drawing exchange Format) 형식의 국가기본 수치 지도를 지리정보의 저장과 전달을 위해 OGC(Open GIS Consortium)에서 제안한 GML(Geographic Markup Language)로 변환하는 시스템을 제안한다. 클라이언트로부터 위치정보와 축척정보를 입력받아 검색범위를 설정한 후, 검색된 DXF 를 GML 로 변환하여 클라이언트로 전송하고, 클라이언트는 전송 받은 GML 문서를 모바일 C 로 구현된 GML 파서를 통해 변환하여 모바일 디바이스의 화면에 출력하고, 사용자 상호작용을 수행한다.

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Improvement of Computer-Aided Manufacturing (CAM) Software for Laser Machining

  • Bayesteh, Abdoleza;Ko, Junghyuk;Ahmad, Farid;Jun, Martin B.G.
    • 한국생산제조학회지
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    • 제24권4호
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    • pp.374-385
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    • 2015
  • In this paper, effective and user friendly CAM software is presented that automatically generates any three dimensional complex toolpaths according to a CAD drawing. In advanced manufacturing, often it is essential to scan the sample following a complex trajectory which consists of short (few microns) and multidirectional moves. The reported CAM software offers constant velocity for all short trajectory elements and provides an efficient shift of tool path direction in sharp corners of a tool trajectory, which is vital for any laser, based precision machining. The software also provides fast modification of tool path, automatic and efficient sequencing of path elements in a complicated tool trajectory, location of reference point and automatic fixing of geometrical errors in imported drawing exchange files (DXF) or DWG format files.

A Study on the Development of Computer Aider Die Design System for Lead Frame of Semiconductor Chip

  • Kim, Jae-Hun
    • International Journal of Precision Engineering and Manufacturing
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    • 제2권2호
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    • pp.38-47
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    • 2001
  • This paper decribes the development of computer-aided design of a very precise progressice die for lead frame of semiconductor chip. The approach to the system is based on knowledgr-based rules. Knowledge of fie이 experts. This system has been written in AutoLISP using AutoCAD ona personal computer and the I-DEAS drafting programming Language on the I-DEAS mater series drafting with on HP9000/715(64) workstation. Data exchange between AutoCAD and I-DEAS master series drafting is accomplished using DXF(drawing exchange format) and IGES(initial graphics exchange specification) files. This system is composed of six main modules, which are input and shape treatment, production feasibility check, strip layout, data conversion, die layout, and post processing modules. Based on Knowledge-based rules, the system considers several factors, such as V-notches, dimple, pad chamfer, spank, cavity punch, camber, coined area, cross bow, material and thickness of product, complexities of blank geometry and punch profiles, specifications of available presses, and the availability of standard parts. As forming processes and the die design system using 2D geometry recognition are integrated with the technology of process planning, die design, and CAE analysis, the standardization of die part for lead frames requiting a high precision process is possible. The die layout drawing generated by the die layout module s displayed in graphic form. The developed system makes it possible to design and manufacture lead frame of a semiconductor more efficiently.

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GIS 데이터를 이용한 차량 시뮬레이터용 도로 구축에 관한 연구 (Construction of Roads for Vehicle Simulator Using GIS Map)

  • 임형은;성원석;황원걸;주승원
    • 한국정밀공학회지
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    • 제21권4호
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    • pp.88-94
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    • 2004
  • Recently, vehicle simulators are widely used to evaluate driver's responses and driver assistance systems. It needs much effort to construct the virtual driving environment for a vehicle simulator. In this study, it is described how to make effectively the roads and the driving environment for a vehicle simulator. The GIS (Geographic Information System) is used to construct the roads and the environment effectively. Because the GIS is the integrated system of geographical data, it contains useful data to make virtual driving environment. First, the outline and centerline of roads is abstracted from the GIS. From the road outline, the road width is calculated. Using the centerline, the grid model of roads is constructed. The final graphic model of roads is constructed by mapping road image to the grid model according to the number of lanes and the kind of surface. Data of buildings from the GIS are abstracted. Each shape and height of buildings is determined according to kind of buildings, the final graphic model of buildings is constructed. Then, the graphic model of roadside tree is also constructed. Finally, the driving environment for driving simulator is constructed by converting the three graphic models with the graphic format of Direct-X and by joining the three graphic models.

파인블랭킹 금형의 개념설계 자동화에 관한 연구 (A Study on the Development of a Computer Aided Conceptual Die Dosing System for Fine Blanking)

  • 곽태수;최철현;서명규;배원병
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2001년도 춘계학술대회 논문집
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    • pp.71-76
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    • 2001
  • This paper describes a research work of developing system for conceptual die design system for Fine blanking. The method of approaching to the system is based on the knowledge-based rules. Knowledge for the system is formulated from experimental results and the empirical knowledge of field experts. This system has been written in VisualLISP on the AutoCAD using a personal computer and in Microsoft Visual Basic ver.6.0. Transference of data is accomplished by DXF (Drawing Exchange Format) method. This system consists of six modules, which are cognition of a drawing, cognition of shear length, calculation of shear force, materials properties database, determination of degree of difficulty of the product, determination of approximate life of punch and die modules. Results carried out in each module will provide efficiency to the designer and the manufacturer of die for Fine blanking. But the main focus of this system is the design of die for Fine blanking in the level of general concept. In order to use powerful tool in this field, developed system will be studied continuously.

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반도체 리드 프레임의 금형설계 자동화 시스템 개발에 관한 연구 (A Study on the Development of Computer Aided Die Design System for Lead Frame, Semiconductor)

  • 최재찬;김병민;김철;김재훈;김창봉
    • 한국정밀공학회지
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    • 제16권6호
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    • pp.123-132
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    • 1999
  • This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from pasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64). Transference of data between AutoCAD and I-DEAS Master Series Drafting is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of five modules, which are input and shape treatment, production feasibility check, strip-layout, data-conversion and die-layout modules. The process planning and Die design system is designed by considering several factors, such as complexities of blank geometry, punch profiles, and the availability of a press equipment and standard parts. This system provides its efficiecy for strip-layout, and die design for lead frame, semiconductor.

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반도체 리드 프레임 제조를 위한 프로그레시브 금형의 CAD/CAM 시스템 개발 (Development of Progressive Die CAD/CAM System for Manufacturing Lead Frame, Semiconductor)

  • 최재찬;김병민;김철;김재훈;김창봉
    • 한국정밀공학회지
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    • 제16권12호
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    • pp.230-238
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    • 1999
  • This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from plasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64) and tool kit on the ESPRIT. Transference of data among AutoCAD, I-DEAS Master Series Drafting, and ESPRIT is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of six modules, which are input and shape treatment, production feasibility check, strip-layout, die-layout, modelling, and post-processor modules. The system can design process planning and Die design considering several factors and generate NC data automatically according to drawings of die-layout module. As forming process of high precision product and die design system using 2-D geometry recognition are integrated with technology of process planning, die design, and CAE analysis, standardization of die part in die design and process planning of high pression product for semiconductor lead frame is possible to set. Results carried out in each module will provide efficiencies to the designer and the manufacturer of lead frame, semiconductor.

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