• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.17 no.11
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• pp.1043-1049
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• 2007

Data transfer rate and storage capacity are main criteria of the performance of the optical disk drive. The highest data transfer rate and the largest storage capacity is most desirable. To increase these performances, the actuator of the optical disk drive should have a high servo bandwidth to compensate the vibration of an optical disk. The servo bandwidth is limited by some flexible modes of the actuator, thus it is essential to increase the natural frequencies of the flexible modes. In this paper, we suggested a moving magnet type actuator having high frequencies of the flexible modes. Generally, the moving magnet type actuator has an advantage to increase the natural frequencies of the flexible modes because the moving magnet type actuator has simple structure and the Young's modulus of magnet is high. However, large moving mass and inefficiency of EM(electromagnetic) circuit cut down driving sensitivities of the actuator. To improve driving sensitivities, we designed the model with the closed electromagnetic circuit for tracking direction. In addition, driving sensitivities and the natural frequencies of the flexible modes were improved by using DOE(design of experiments) for electromagnetic circuit and modifying the lens holder.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.175-182
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• 2017

In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.23 no.8
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• pp.759-769
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• 2013

Electronic equipment has been applied to virtually every area associated with commercial, industrial, and military applications. Specifically, electronics have been incorporated into avionics components installed in aircraft. This equipment is exposed to dynamic loads such as vibration, shock, and acceleration. Especially, avionics components installed in a helicopter are subjected to simultaneous sine and random base excitations. These are denoted as sine on random vibrations according to MIL-STD-810F, Method 514.5. In the past, isolators have been applied to avionics components to reduce vibration and shock. However, an isolator applied to an avionics component installed in a helicopter can amplify the vibration magnitude, and damage the chassis, circuit card assembly, and the isolator itself via resonance at low-frequency sinusoidal vibrations. The objective of this study is to investigate the dynamic characteristics of an avionics component installed in a helicopter and the structural dynamic modification of its tray plate without an isolator using both a finite element analysis and experiments. The structure is optimized by dynamic loads that are selected by comparing the vibration, shock, and acceleration loads using vibration and shock response spectra. A finite element model(FEM) was constructed using a simplified geometry and valid element types that reflect the dynamic characteristics. The FEM was verified by an experimental modal analysis. Design parameters were extracted and selected to modify the structural dynamics using topology optimization, and design of experiments(DOE). A prototype of a modified model was constructed and its feasibility was evaluated using an FEM and a performance test.