• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.

• Applied Biological Chemistry
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• v.47 no.1
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• pp.113-119
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• 2004

Persistence of the triazole fungicides, bitertanol and tebucnazole was investigated after their application at recommended and double rate on greenhouse-grown peppers. The half-life of bitertanol and tebuconazole on peppers at recommended and double rate was $5.2{\sim}6.1$ and $4.6{\sim}5.2$ days, respectively. Half-lives of bitertanol and tebuconazole on pepper leaves $(16.8{\sim}22.5\;days)$ was longer than those in the peppers. Residual concentration of bitertanol and tebuconazole on pepper leaves 24 days after application were 10.1 and 17.5 mg/kg, respectively, and these levels were higher than MRL which had been established at 3.0 and 5.0 mg/kg in Korea. Pattern of dissipation was well fitted to the first-order kinetics. In household washing experiment with surfactant, dislodgeable portions on pepper leaves of bitertanol and tebuconazole were occupied 36% and 48% of the residues found 24 days after application.

• Journal of the Institute of Convergence Signal Processing
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• v.13 no.2
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• pp.99-105
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• 2012

The focus of this paper is a proposal for a computationally efficient dynamic subcarrier allocation (DSA) algorithm for orthogonal frequency-division multiple access (OFDMA) systems. The proposed DSA algorithm considerably reduces the computational complexity and the amount of channel quality information (CQI) compared to amplitude craving greedy (ACG) algorithms, which use full CQI. At the same time, the performance of the proposed algorithm closely appear to ACG algorithms. Moreover, the authors present a new bandwidth-assignment algorithm produced by modifying bandwidth assignment based on the signal-to-noise ratio (BABS). This modified BABS algorithm enables the proposed DSA algorithm to produce a strong outage performance gain over the conventional scheme.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.21-28
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• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.