• Title/Summary/Keyword: DER-Interconnection

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Test bed for Advanced function of Smart Inverter and Results Based on Real-Time Simulation Platform (실시간 시뮬레이터 기반의 스마트 인버터 제어기능 시험 환경 구축 및 시험 결과)

  • Sim, Junbo;Ban, Minho;Lim, Hyeonok;Cho, Seong-Soo
    • KEPCO Journal on Electric Power and Energy
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    • v.7 no.1
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    • pp.107-114
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    • 2021
  • High penetration of renewable energy generators causes unnecessary investment for power system facilities. Especially with Korean government policies such as Renewable Energy 3020 and Inter-connection support Responsibility of KEPCO for 1 MW DERs, the applications of DER interconnection in distribution system have been increasing. To save the investment, smart control functions for DERs are required and the test bed for the inverters which have not been prepared are necessary to insure DER inter-connection stability. For this, test bed for advanced functions of a smart inverter has been constructed and the tests for necessary functions have been implemented. In this paper, the test bed and environment as well as specifications are introduced and the test results for the validation of the functions are analyzed.

Increasing Hosting Capacity in KEPCO Distribution Feeders (배전선로의 분산 전원 상시 연계용량 기준 상향 타당성 연구)

  • Cho, Sung-Soo;Sim, JunBo;Lim, Hyeon-Ok;Kim, HyeonJin;Kim, Seong-Man;Ju, Sang-Do;Song, JongHyup
    • KEPCO Journal on Electric Power and Energy
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    • v.5 no.4
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    • pp.311-321
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    • 2019
  • With Korean Government's Renewable energy 3020 plan and 8th Basic plan for long-term power supply, renewable energy industries in Korea are active and catching attention from many relevant industry's relations. Especially with Interconnection guarantee policy established in Oct, 2016, DERs interconnection delay due to lack of allowable distribution hosting capacity is happening and reduction of reinforcement cost for distribution system where 70 % of DERs in South Korea are installed became one of important issues of KEPCO. Therefore, KEPCO needed to extract reasonable solutions to increase feasible hosting capacity of distribution feeders in order to reduce reinforcement cost under the condition of no matter in distribution system operation. This paper proposes feasible hosting capacity of distribution feeders that can be adopted and the status of DER installation in distribution system, PV output data, minimum load in distribution feeders as well as capacity of distribution lines have been investigated and analyzed in proof of the proposal.

Studies on the Interfacial Reaction between electroplated Eutectic Pb/Sn Flip-Chip Solder Bump and UBM(Under Bump Metallurgy) (전해 도금법을 이용한 공정 납-주석 플립 칩 솔더 범프와 UBM(Under Bump Metallurgy) 계면반응에 관한 연구)

  • Jang, Se-Yeong;Baek, Gyeong-Ok
    • Korean Journal of Materials Research
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    • v.9 no.3
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    • pp.288-294
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    • 1999
  • In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.

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Increasing Hosting Capacity of Distribution Feeders by Analysis of Generation and Consumption (배전선로 부하량 및 발전량 분석을 통한 신재생 접속허용용량 기준 상향에 대한 연구)

  • Kim, Seong-Man
    • KEPCO Journal on Electric Power and Energy
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    • v.5 no.4
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    • pp.295-309
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    • 2019
  • This paper demonstrates that the verification and analysis of the increase of hosting capacity of distributed energy resources in distribution system for the high penetration of distributed energy resources. In the case of generally designed distribution feeders in South Korea, it can host up to 10 MVA of distributed energy resources and the over voltage due to reverse power flow is prohibited beyond the range by the law of electric utility. However, it should take into consideration that there are some factors of extra hosting capacity such as generation characteristics of distributed energy resources and minimum loads that always exist to distribution system. For these reason, we choose a specific distribution system hosted 10 MVA of distributed energy resources monitored by distribution system operator and verify the impact of increasing hosting capacity such as power flow and voltage profile of distribution system. By the result, we could find that it is possible to increase the hosting capacity and define the factors to expand the hosting capacity of distributed energy resources in distribution system.