• Title/Summary/Keyword: DCEES epoxy resin

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Thermal Properties and Fracture Toughness of Bisphenol-Based DGEBA/DGEBS Epoxy Blend System (Bisphenol계 DGEBA/DGEBS 에폭시 블렌드 시스템의 열적 특성 및 파괴인성)

  • 박수진;김범용;이재락;신재섭
    • Polymer(Korea)
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    • v.27 no.1
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    • pp.33-39
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    • 2003
  • In this study, the bisphenol-based DGEBA/GEBS blend systems were studied in cure kinetics, thermal stabilities, and fracture toughness of the casting specimen. The content of DGEBA/DCEBS was varied in 100 : 0, 90 : 10, 80 : 20, 70 : 30, and 60 : 40 wt%. The cure activation energies ($E_a$) of the blend systems were determined by Ozawa's equation. The thermal stabilities, including initial decomposed temperature (IDT), temperatures of maximum rate of degradation ($T_{max}$), and integral procedural decomposition temperature (IPDT) of the cured specimen were investigated by thermogravimetric analysis (TGA). For the mechanical interfacial properties of the specimens, the critical stress intensity factor ($K_{IC}$) test was performed and their fractured surfaces were examined by using a scanning electron microscope (SEM). As a result, $E_a$, IPDT, and $K_{IC}$ show maximum values in the 20 wt% DGEBS content compared with the neat DGEBA resins. This was probably due to the fact that the elevated networks were farmed by the introduction of sulfonyl groups of the DCEBS resin.