• Title/Summary/Keyword: DC reactive sputtering

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Optimal Sputtering Parameters of Transparent Conducting ITO Films Deposited on PET SUbstates

  • Kim, Hyun-Hoo;Shin, Sung-ho
    • Transactions on Electrical and Electronic Materials
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    • v.1 no.2
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    • pp.23-27
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    • 2000
  • Indium in oxide(ITO) films have been deposited on PET and glass substrates by DC reactive magnetron sputtering without post-deposition thermal treatment, The high quality for microstructure, electrical and optical properties of the as-deposited ITO films on unheated substrates is dominated by the sputtering parameters, The influence of the working gas pressure, DC power and oxygen partial pressure has been systematically investigated, The lowest DC power, and oxygen partial pressure has been systematically investigated, The lowest resistivity of ITO films deposited on PET substrates was 6$\times$10$^{-4}$ $\Omega$cm. It has been obtained at a working pressure of 3 mTorr and DC power of 30 W. The sheet resistance and optical transmittance of these film were 22 $\Omega$/square and 84% respectively. The best values of figures of merit for the electrical and optical characteristics such as T/ $R_{sh}$ and $T^{10}$ / $R_{sh}$ are approximately 38.1 and 7.95($\times$10$^{-3}$ $\Omega$$^{-1}$ ), respectively.

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Anti-Reflection Coating Application of SixOy-SixNy Stacked-Layer Fabricated by Reactive Sputtering (반응성 스퍼터링으로 제작된 SixOy-SixNy 적층구조의 반사방지 코팅 응용)

  • Gim, Tzang-Jo;Lee, Boong-Joo;Shina, Paik-Kyun
    • Journal of the Korean Vacuum Society
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    • v.19 no.5
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    • pp.341-346
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    • 2010
  • In this paper, anti-reflection coating was investigated for decreasing the reflection in visible range of 400~650 [nm] through four staked layers of $Si_xO_y$ and $Si_xN_y$ thin films prepared by reactive sputtering method. Si single crystal of 6 [inch] diameter was used as a sputtering target. Ar and $O_2$ gases were used as sputtering gases for reactive sputtering for the $Si_xO_y$ thin film, and Ar and $N_2$ gases were used for reactive sputtering for the $Si_xN_y$ thin film. DC pulse power of 1900 [W] was used for the reactive sputtering. Refractive index and deposition rate were 1.50 and 2.3 [nm/sec] for the $Si_xO_y$, and 1.94 and 1.8 [nm/sec] for the $Si_xN_y$ thin film, respectively. Considering the simulation of the four layer anti-reflection coating structure with the above mentioned films, the $Si_xO_y-Si_xN_y$ stacked four-layer structure was prepared. The reflection measurement result for that structure showed that a "W" shaped anti-reflection was obtained successfully with a reflection of 1.7 [%] at 550 [nm] region and a reflection of 1 [%] at 400~650 [nm] range.

Microstructure, Crystal Structure and Mechanical Properties of VN Coatings Using Asymmetric Bipolar Pulsed dc Sputtering (비대칭 바이폴라 펄스 스퍼터법으로 증착된 VN 코팅막의 미세구조, 결정구조 및 기계적 특성에 관한 연구)

  • Chun, Sung-Yong;Jeong, Pyeong-Geun
    • Journal of the Korean institute of surface engineering
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    • v.49 no.5
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    • pp.461-466
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    • 2016
  • Nanocrystalline vanadium nitride (VN) coatings were deposited using asymmetric bipolar pulsed dc sputtering to further understand the influence of the pulsed plasmas on the crystal structure, microstructure and mechanical properties. Properties of VN coatings were investigated with FE-SEM, XRD and nanoindentation. The results show that, with the increasing pulse frequency and decreasing duty cycle, the coating morphology changed from a porous columnar to a dense structure, with finer grains. Asymmetric bipolar pulsed dc sputtered VN coatings showed higher hardness, elastic modulus and residual compressive stress than dc sputtered VN coatings. The results suggest that asymmetric bipolar pulsed dc sputtering technique is very beneficial for the reactive sputtering deposition of VN coatings.

Adhesion of Cu on Polycarbonate with the Condition of Surface Modification and DC-Bias Sputtering Deposition (폴리카보네이트에서의 표면개질 조건과 DC-Bias Sputtering 증착에 따른 Cu 밀착성)

  • 배길상;엄준선;이인선;김상호;고영배;김동원
    • Journal of the Korean institute of surface engineering
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    • v.37 no.1
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    • pp.5-12
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    • 2004
  • The enhancement of adhesion for Cu film on polycarbonate (PC) surface with the $Ar/O_2$ gas plasma treatment and dc-bias sputtering was studied. The plasma treatment with this reactive mixture changes the chemical property of PC surface into hydrophllic one, which is shown by the variation of contact angle with surface modification. The micro surface roughness that also gives the high adhesive environment is increased by the $Ar/O_2$ gas plasma treatment. These results were observed distinctly from the atomic force microscopy (AFM). The negative substrate dc-bias effect for the Cu adhesion on PC was also investifated. Accelerated $Ar^{+}$ lons in sheath area of anode bombard the bare surface of PC during initial stage of dc bias sputtering. PC substrate. therefore, has severe roughen and hydrophilic surface due to the physical etching process with more activated functional group. As dc-bias sputtering process proceeds, morphology of Cu film shows better step coverage and dense layer. The results of peel test show the evidence of superiority of bias sputtering for the adhesion between metal Cu and PC.C.

Growing Behavior of Nanocrystalline TiN Films by Asymmetric Pulsed DC Reactive Magnetron Sputtering (비대칭 펄스 DC 반응성 마그네트론 스퍼터링으로 증착된 나노결정질 TiN 박막의 성장거동)

  • Han, Man-Geun;Chun, Sung-Yong
    • Journal of the Korean Ceramic Society
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    • v.48 no.5
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    • pp.342-347
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    • 2011
  • Nanocrystalline TiN films were deposited on Si(100) substrate using asymmetric pulsed DC reactive magnetron sputtering. We investigated the growing behavior and the structural properties of TiN films with change of duty cycle and pulsed frequency. Grain size of TiN films were decreased from 87.2 nm to 9.8 nm with decrease of duty cycle. The $2{\theta}$ values for (111) and (200) crystallographic planes of the TiN films were also decreased with decrease of duty cycle. This shift in $2{\theta}$ could be attributed to compressive stress in the TiN coatings. Thus, the change of plasma parameter has a strong influence not only on the microstructure but also on the residual stresses of TiN films.

Crystal Structure, Microstructure and Mechanical Properties of NbN Coatings Deposited by Asymmetric Bipolar Pulsed DC Sputtering

  • Chun, Sung-Yong;Im, Hyun-Ho
    • Journal of the Korean Ceramic Society
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    • v.54 no.1
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    • pp.33-37
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    • 2017
  • Single phase niobium nitride (NbN) coatings were deposited using asymmetric bipolar pulsed dc sputtering by varying pulse frequency and duty cycle of pulsed plasmas. Crystal structure, microstructure, morphology and mechanical properties were examined using XRD, FE-SEM, AFM and nanoindentation. Upon increasing pulse frequencies and decreasing duty cycles, the coating morphology was changed from a pyramidal-shaped columnar structure to a round-shaped dense structure with finer grains. Asymmetric bipolar pulsed dc sputtered NbN coatings deposited at pulse frequency of 25 kHz is characterized by higher hardness up to 17.4 GPa, elastic modulus up to 193.9 GPa, residual compressive stress and a smaller grain size down to 27.5 nm compared with dc sputtered NbN coatings at pulse frequency of 0 kHz. The results suggest that the asymmetric bipolar pulsed dc sputtering technique is very beneficial to reactive deposition of transition-metal nitrides such as NbN coatings.

DC Reactive Magnetron Co-Sputtering 방법을 이용한 Cu-TiN Composite 박막 증착

  • Jang, Jin-Hyeok;Kim, Gyeong-Hun;Kim, Seong-Min;Han, Seung-Hui
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.195.1-195.1
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    • 2013
  • Cu는 금속 박막재료로서 높은 전기전도성을 지니고 있을 뿐만 아니라 Ag, Al, Pt 등 보다 비용이 저렴하여, 높은 전기전도성을 필요로 하는 박막 재료로써 폭넓게 사용되고 있다. 그러나, 낮은 기계적 특성을 지니고 있어서 interconnect와 같은 작은 단면적의 배선재료로 사용될 경우, 높은 전류밀도에 따른 electromigration 현상에 의하여 hillock 또는 void의 형성 등 박막재료의 변형이 생기게 되어서 전자소자의 수명이 단축된다는 단점이 있다. TiN은 금속재료 못지않은 높은 전기 전도성을 지니고 있을 뿐만 아니라, 금속재료에 비하여 높은 기계적 특성과 녹는점을 지니고 있어 다양한 분야로 사용되고 있다. 본 연구에서는 Cu와 TiN composite 박막을 soda-lime glass위에 증착하여 낮은 비저항 뿐만 아니라 Cu와 비교하여 기계적 특성이 향상된 박막을 제작하고자 하였다. Cu와 TiN composite 박막 증착을 위하여 DC reactive magnetron co-sputtering 장비를 사용하였으며, Cu와 Ti 타겟 power, Ar:N2 유량비(Flow rate)을 변화시켜 Cu와 Ti의 조성비 및 TiN의 결정성을 조절하였고, 이를 통하여 박막의 TiN 조성에 따른 낮은 비저항 값과 순수한 Cu 박막과 비교하여 높은 기계적 특성을 지닌 Cu-TiN 박막을 증착하였다. Cu-TiN composite 박막의 구조 및 조성은 SEM (Scanning Electron Microscope), EDS (Energy Dispersive Spectrometer), XPS (X-ray Photoelectron Spectroscopy)장비를 사용하여 분석하였으며, 전기전도도는 4-point probe를 사용하여 측정하였고, Knoop hardness 측정방법을 사용하여 박막의 기계적 특성을 측정하였다.

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Electrical and Optical Properties of SnO$_2$: F Thin Films by Reactive DC Magnetron Sputtering Method (반응성 DC 마그네트론 스퍼터법에 의한 SnO$_2$ : F 박막의 전기광학적 특성)

  • 정영호;김영진;신재혁;송국현;신성호;박정일;박광자
    • Journal of the Korean institute of surface engineering
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    • v.32 no.2
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    • pp.125-133
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    • 1999
  • Fluorine-doped $SnO_2$ thin films were deposited on soda-lime glass substrates by reactive DC magnetron sputtering method. Crystallinity as well as electrical and optical properties of $SnO_2$ : F thin film were investigated as the variations of deposition conditions such as substrate temperature, DC Power, $O_2$ gas pressure, $SF_6$ gas pressure. $SnO_2$ : F thin film deposited with 5% $SF_6$ gas pressure showed electrical resistivities of $2.5\times10^{-3}$cm with the average optical transparency (about 80%) These electrical and optical properties were found to be related to the crystallinity of $SnO_2$ : F thin films.

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Electrical and optical properties of ZnO:Al thin films prepared by reactive sputtering method (반응성 sputtering법으로 제막된 ZnO : Al 박막의 전기.광학적 특성)

  • 유병석;유세웅;이정훈
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.6 no.4
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    • pp.480-492
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    • 1996
  • AZO (Aluminum doped Zinc Oxide) transparent conducting thin films were fabricated by reactive DC mangnetron sputtering method using zinc target containing 2 wt% of Al. Transition range with optimum transmittance and conductivity was obtained by contrlling partial pressure of reactive oxygen gas. Sputtering condition for this transition range could be kept stable by regulating the target voltage. According to XRD analysis, there was only one peak for (002) plane in AZO films and the films deposited in transition range.

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