• 한국정밀공학회지
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• 제13권10호
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• pp.139-145
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• 1996

The machining accuracy and performance is largely influenced by the static, dynamic and thermal characteristics of spindle systems in machine tools, because the spindle system is a intermedium for cutting force from tool and machine powef from motor. Large cutting force and power are transmitted by bearing with a point or line contact. So, the spindle system is the static and dynamic weakest point in machine structure. For improvement of static stiffness of spindle system can be changed design parameters, such as diameter of spindle, stiffness of bearing and bearing span. But for dynamic stiffness, the change of the design parameters are not useful. In this paper, the combined bearing arrangement is suggested for high damping spindle system. The combined bearing arrangement is composed of tandem double back to back arrangement type ball bearins and a high damping hydrostatic bearing. The variation of static deflection and amplitude in first natural frequency is evaluated with the location of hydrostatic bearing between front and rear ball bearing. The optimized location of hydrostatic bearing for high static and dynamic stiffness is determined rapidly and exactly using the mode shape and transfer function of spindle. The calculation of damping effect on vibration by unbalance of grinding wheel and pulley in optimized spindle system is carried out to verify the validity of the combined bearing arrangement. Finally, the simulation of grinding process show that the surface roughness of workpiece with high damping spindle system is 60% better than with ball bearing spindle system.

• 한국정밀공학회지
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• 제13권6호
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• pp.59-65
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• 1996

There are many difficulties in automatic polishing for die & mold surfaces. Even though the process has been studied in the past 15 years, it has not been achieved yet, but by the process of actual hand work of well-skilled workers. A new magentic assisted polishing process, which is one of the potential methods for automation of surface finishing has been studied in the past 10 years by colleagues. The process has many merits, but on the other hand also has demerits, one being low efficiency of grindability by comparision with wheel polish. Therefore, some attempts were tried to improve the grindability by adopting electropolishing, ultra-high speed milling, 5-axis controlled machine etc... most recently by colleagues. This paper also aims to improve the efficiency of polishing by introducing the easily-polished shape surface cutting method equalizing the tool feed per revolution to the pick feed. This cutting method was experimentally confirmed to have sufficient grindability to polish milled surface (with $10{{\mu}m}$Rmax surface roughness) into mirror surface (with $0.4{{\mu}m}$Rmax surface roughness).

• Journal of Biosystems Engineering
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• 제41권4호
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• pp.408-417
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• 2016

Purpose: Yield monitoring systems are an essential component of precision agriculture. They indicate the spatial variability of crop yield in fields, and have become an important factor in modern harvesters. The objective of this paper was to review research trends related to yield monitoring sensors for grain crops. Methods: The literature was reviewed for research on the major sensing components of grain yield monitoring systems. These major components included grain flow sensors, moisture content sensors, and cutting width sensors. Sensors were classified by sensing principle and type, and their performance was also reviewed. Results: The main targeted harvesting grain crops were rice, wheat, corn, barley, and grain sorghum. Grain flow sensors were classified into mass flow and volume flow methods. Mass flow sensors were mounted primarily at the clean grain elevator head or under the grain tank, and volume flow sensors were mounted at the head or in the middle of the elevator. Mass flow methods used weighing, force impact, and radiometric approaches, some of which resulted in measurement error levels lower than 5% ($R^2=0.99$). Volume flow methods included paddle wheel type and optical type, and in the best cases produced error levels lower than 3%. Grain moisture content sensing was in many cases achieved using capacitive modules. In some cases, errors were lower than 1%. Cutting width was measured by ultrasonic distance sensors mounted at both sides of the header dividers, and the errors were in some cases lower than 5%. Conclusions: The design and fabrication of an integrated yield monitoring system for a target crop would be affected by the selection of a sensing approach, as well as the layout and mounting of the sensors. For accurate estimation of yield, signal processing and correction measures should be also implemented.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2011년도 춘계학술대회 논문집
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• pp.1709-1715
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• 2011

A track-circuit device exploits two rails as a conductor of an electrical circuit. It detects the presence or absence of the trains with variation of received level when wheel sets of the train shunt rails together. So, it plays an important role in train operation. Non-insulated audio frequency(AF) track-circuit device can separate the rails into tracks by insulated joints without physically cutting the rails. And it transmits AF signals at track boundary, of which frequency is different between adjacent tracks. It has been employed at station-to-station section of domestic high speed rail, general rail, and subway. But It was not used at station yard of complicated general railway where lots of branches exist. In this paper, we consider current development status of non-insulated AF track-circuit device for the use of station yard.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1583-1586
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• 2005

Grinding process is different from other machining processes such as turning, milling and drilling because the cutting edges in a grinding wheel doesn't have uniformity and acts differently on the workpiece at each grinding. This study focus on predicting the geometric error produced during surface grinding and selecting an optimal grinding condition to reduce the geometric error. To achieve the aim, the Taguchi design of experiments was applied and the S/N ratios of each grinding was used for evaluating the results. The predicted quantities by the S/N ratios were compared with the experimental results.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1257-1260
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• 2005

Grinding process has unique characteristics compared with other machining processes. The cutting edges of the grinding wheel don't have uniformity and act differently on the workpiece at each grinding. The response surface analysis is one of various methods for optimizing and evaluating the process parameters to achieve the desired output. In this study, the effect of the grinding parameters on outcomes of the surface grinding was analyzed experimently. To predict the grinding outcomes and to select the grinding conditions before grinding, the second-order response surface models for the grinding force and the surface roughness were developed.

• 한국정밀공학회지
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• 제17권2호
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• pp.89-96
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• 2000

This paper describes the characteristic of die finishing to obtain smooth surface using electro-chemical grinding after cutting process. Electro-chemical grinding is possible under lower load and tool wear comparing with those in the mechanical grinding. Conventionally, if the metal bonding material of the grinding wheel is directly t contacted with workpiece, the current is circulated without electrolytic phenomena. Sometimes, electrical discharge is occurred between tool and workpiece. To cope with this problem, the metal-resin bonded pellet was used in this study. This pellet is composed of optimal volume of metal and resin powders and its characteristics are changable with the each volume of powders. Finally, high efficient die finishing is realized using metal resin bonded pellet in electro-chemical grinding.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.1028-1032
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• 1995

This paper describes the manufacture of spherical and aspherical surface on glass, superalloy and ceramic components. The rotationally symmetricallenses, and the ceramic or superalloy molds with spherical shapes are mainly generated by cutting processes on CNC lathe machine or 4,5 axis CNC machining centers. Recently, spherical shape parts require more precise and efficent machining technologies for wide material range such as optical lens of the lithography device in semiconductor manufacturing processes or the high precision mold machining of anti-chemical, anti-wear materials. In this paper, we introduce a newly developed infeed grinding machine with metal with metal bonded cup type wheel and its effects on spherical surface grinding.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1897-1901
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• 2003

Recently, with the development of semiconductor technology the miniaturization of products as well as parts and the products with high precision are being required. In addition as a national competitive power is increasingly effected by micro part development through micro machining and the secure of micro machining technology, the study of micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tool under the size of 30$\mu\textrm{m}$ and machine micro holes through micro tool fabrication by grinding, the application of ELID to grinding wheel and the measurement of surface roughness for micro tool.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1787-1792
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• 2003

Recently with the development of semiconductor technology, the miniaturization of parts and products as well as their high precision is required. In addition, as the national competitiveness is increasingly affected by the development of the micro parts through micro machining technology, the study of the micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tools under the size of $20{\mu}m$ and to machine micro holes using them. The fabrication is done by grinding and the application of ELID to the grinding wheel. The surface roughness of the micro tools is measured to evaluate the study.