• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1268-1270
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• 1993

In this study, the characteristics of Si-$SiO_2$ interface and its degradation in short channel SONOSFET nonvolatile memory devices, fabricated by 1Mbit CMOS process($1.2{\mu}m$ design rule), with $65{\AA}$ blocking oxide layer, $205{\AA}$ nitride layer, and $30{\AA}$ tunneling oxide layer on the silicon wafer were investigated using the charge pumping method. For investigating the Si-$SiO_2$ interface characteristics before and after write/erase cycling, charge pumping current characteristics with frequencies, write/erase cycles, as a parameters, were measured. As a result, average Si-$SiO_2$ interface trap density and mean value of capture cross section were determined to be $1.203{\times}10^{11}cm^{-2}eV^{-1}\;and\;2.091{\times}10^{16}cm^2$ before write/erase cycling, respectively. After cycling, when the write/erase cycles are $10^4$, average $Si-SiO_2$ interface trap density was $1.901{\times}10^{11}cm^{-2}eV^{-1}$. Incresing write/erase cycles beyond about $10^4$, Si-$SiO_2$ interface characteristics with write/erase cycles was increased logarithmically.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.390.2-390.2
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• 2016

Single crystalline indium-tin-oxide (ITO) nanowires (NWs) were grown by sputtering method. A thin Ni film of 5 nm was coated before ITO sputtering. Thermal treatment forms Ni nanoparticles, which act as templates to diffuse Ni into the sputtered ITO layer to grow single crystalline ITO NWs. Highly optical transparent photoelectric devices were realized by using a transparent metal-oxide semiconductor heterojunction by combining of p-type NiO and n-type ZnO. A functional template of ITO nanowires was applied to this transparent heterojunction device to enlarge the light-reactive surface. The ITO NWs/n-ZnO/p-NiO heterojunction device provided a significant high rectification ratio of 275 with a considerably low reverse saturation current of 0.2 nA. The optical transparency was about 80% for visible wavelengths, however showed an excellent blocking UV light. The nanostructured transparent heterojunction devices were applied for UV photodetectors to show ultra fast photoresponses with a rise time of 8.3 mS and a fall time of 20 ms, respectively. We suggest this transparent and super-performing UV responser can practically applied in transparent electronics and smart window applications.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.65-69
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• 2004

Screen printing it one of the most popular methods for the fabrication of catalytic layer in electrode of polymer electrolyte membrane fuel cells (PEMFCs) due to its convenience and adaptability. This paper suggests an improved screen-printing method, which is rather simple suppressing the swelling trouble without additive process and competitive with very low Pt loading in comparison with the previous methods. Particularly, the gasket unified MEA made better performances than the other especially at high current area due to blocking effect on the gas leakage during the operation. These methods give us more simplified and faster fabrication chances.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.10
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• pp.822-827
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• 2000

The Si-SiO$_2$interface trap and nitride bulk trap distribution of SONOSFET(polysilicon-oxide-nitride-oxide-semiconductor field effect transistor) NVSM (nonvolatile semiconductor memory) cell is investigated by single junction charge pumping method. The device was fabricated by 0.35㎛ standard logic fabrication process including the ONO stack dielectrics. The thickness of ONO dielectricis are 24$\AA$ for tunnel oxide, 74 $\AA$ for nitride and 25 $\AA$ for blocking oxide, respectively. By the use of single junction charge pumping method, the lateral profiles of both interface and memory traps can be calculated directly from experimental charge pumping results without complex numerical simulation. The interface traps were almost uniformly distributed over the whole channel region and its maximum value was 7.97$\times$10$\^$10/㎠. The memory traps were uniformly distributed in the nitride layer and its maximum value was 1.04$\times$10$\^$19/㎤. The degradation characteristics of SONOSFET with write/erase cycling also were investigated.

• Korean Journal of Optics and Photonics
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• v.14 no.5
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• pp.509-514
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• 2003

Mach-Zehnder interferometric wavelength converters with monolithically integrated semiconductor optical amplifiers (SOA's) have been fabricated and characteristics of wavelength conversion at 10 Gb/s have been investigated for wavelength span of 40 nm. The devices have been achieved by using a butt-joint combination of buried ridge structure type SOA's and passive waveguides. In the integration, a new method has been applied that removes p+InP cladding layer leading to high propagation loss and forms simultaneously the current blocking and the cladding layer using undoped InP. The module packaging has been achieved by using a titled fiber array for effective coupling into the tilted waveguide in the wavelength converter. Using the module, wavelength conversion with power penalty lower than 1 ㏈ at 10 Gb/s has been demonstrated for wavelength span of 40 nm. In addition, it is show that the module can provide 2R (re-amplification, re-shaping) operation by demonstrating the conversion with the negative penalty.

• Progress in Superconductivity and Cryogenics
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• v.22 no.3
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• pp.7-12
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• 2020

Electromechanical properties of REBCO CC tapes are known to be limited by defects (cracks) that form in the brittle REBCO layer. These defects could be inherently acquired during the CC tapes' manufacturing process, such as slitting, and which can be initiated at the CC tapes' edges. If propagated and long enough, they are believed to cause critical current degradation and can substantially decrease the delamination strength of CC tapes. Currently, commercially available CC tapes from various manufacturers utilize different growth techniques for depositing the REBCO layers on the substrates in their CC tapes preparation. Their epitaxial techniques, unfortunately, cannot perfectly avoid the formation of particles, in which sometimes acts as current blocking defects, known as outgrowths. Collective research regarding the composition, size, and formation of these particles for various CC tapes with different deposition techniques are particularly uncommon in a single study. Most importantly, these particles might interact in one way or another to the existing cracks. Therefore, systematic investigation on the interactions between the cracks' development mechanism and particles on the REBCO superconducting layers of practical CC tapes are of great importance, especially in the design of superconducting devices. Here, a proper etching process was employed for the CC tapes to expose and observe the REBCO layers, clearly. The scanning electron microscope, field emission scanning microscope, and energy-dispersive x-ray spectroscopy were utilized to observe the interactions between cracks and particles in various practical CC tapes. Particle compositions were identified whether as non-superconducting or superconducting and in what manner it interacts with the cracks were studied.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.477-477
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• 2008

For more than three decades, the gate dielectrics in CMOS devices are $SiO_2$ because of its blocking properties of current in insulated gate FET channels. As the dimensions of feature size have been scaled down (width and the thickness is reduced down to 50 urn and 2 urn or less), gate leakage current is increased and reliability of $SiO_2$ is reduced. Many metal oxides such as $TiO_2$, $Ta_2O_4$, $SrTiO_3$, $Al_2O_3$, $HfO_2$ and $ZrO_2$ have been challenged for memory devices. These materials posses relatively high dielectric constant, but $HfO_2$ and $Al_2O_3$ did not provide sufficient advantages over $SiO_2$ or $Si_3N_4$ because of reaction with Si substrate. Recently, $HfO_2$ have been attracted attention because Hf forms the most stable oxide with the highest heat of formation. In addition, Hf can reduce the native oxide layer by creating $HfO_2$. However, new gate oxide candidates must satisfy a standard CMOS process. In order to fabricate high density memories with small feature size, the plasma etch process should be developed by well understanding and optimizing plasma behaviors. Therefore, it is necessary that the etch behavior of $HfO_2$ and plasma parameters are systematically investigated as functions of process parameters including gas mixing ratio, rf power, pressure and temperature to determine the mechanism of plasma induced damage. However, there is few studies on the the etch mechanism and the surface reactions in $BCl_3$ based plasma to etch $HfO_2$ thin films. In this work, the samples of $HfO_2$ were prepared on Si wafer with using atomic layer deposition. In our previous work, the maximum etch rate of $BCl_3$/Ar were obtained 20% $BCl_3$/ 80% Ar. Over 20% $BCl_3$ addition, the etch rate of $HfO_2$ decreased. The etching rate of $HfO_2$ and selectivity of $HfO_2$ to Si were investigated with using in inductively coupled plasma etching system (ICP) and $BCl_3/Cl_2$/Ar plasma. The change of volume densities of radical and atoms were monitored with using optical emission spectroscopy analysis (OES). The variations of components of etched surfaces for $HfO_2$ was investigated with using x-ray photo electron spectroscopy (XPS). In order to investigate the accumulation of etch by products during etch process, the exposed surface of $HfO_2$ in $BCl_3/Cl_2$/Ar plasma was compared with surface of as-doped $HfO_2$ and all the surfaces of samples were examined with field emission scanning electron microscopy and atomic force microscope (AFM).

• Journal of the Korean Vacuum Society
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• v.15 no.2
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• pp.216-222
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• 2006

In this paper, we investigated the effect of hydrogen-plasma (H-plasma) treatment on the electrical and optical properties of a quantum dot infrared photodetector (QDIP) with a 5-stacked InAs dots in an InGaAs/GaAs well structure and $Al_{0.3}Ga_{0.7}As/GaAs$ SL (superlattice) current blocking layer. It has been observed that H-plasma treatment didn't affect the band structure of QDIP. It has been also observed that the H-plasma treatment on the QDIP not only enhance the electrical property of QDIP by curing the defect channels in $Al_{0.3}Ga_{0.7}As/GaAs$ SL but also introduce defects in QDIP structure. The H-plasma treatment for 10 min with 20 W of RF power provided the lowest dark current, which made it possible to measure the photo-current (PC) of QDIP whose PC was not detectable without the H-plasma treatment due to the high dark current.

• Atmosphere
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• v.17 no.1
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• pp.87-99
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• 2007

Simulation results of Asian Dust Aerosol Model (ADAM) for the period of April 7-9, 2006 were analyzed, comparing with observed PM10 data. ADAM simulated around ten times lower than on-site PM10 concentration in the source regions: Zhurihe, Tongliao, Yushe, Dalian and Huimin. As the result of this low concentration, transported amounts of Asian Dust were under-estimated as well. In order to quantify a forecasting accuracy, Bias and RMSE were calculated. Even though remarkably negative Biases and high RMSEs were observed, ADAM simulation had followed well up the time of dust outbreak and a transported path. However, the emission process to generate dust from source regions requires a great enhancement. The PM10 concentration at the surface reached up to $2,300{\mu}gm^{-3}$ at Baeknyoungdo and Seoul (Mt. Gwanak), up to $1,750{\mu}gm^{-3}$ at KGAWO about 18:00 LST in April 8, respectively; however, ADAM did not simulate the same result on its second peak. It is considered that traveling Asian dust might have been lagged over the Korean peninsula by the blocking of surface high pressure. Moreover, the current RDAPS's 30 km grid resolution (which ADAM adopts as the meteorological input data) might not adequately represent small-scale atmospheric motions below planetary boundary layer.

• Journal of Environmental Science International
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• v.9 no.3
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• pp.215-221
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• 2000

The relationship between the distribution of sea surface temperature(SST) and dinoflagellate(Cochlodinium polykrikoides) bloom areas were studied. The SST data were derived from the infrared channels of AVHRR(Advanced Very High Resolution Radiometer) sensor on NOAA(National Oceanic and Atmospheric Administration) 12 and 14 satellites during 1995-1998. The initial water temperature at C. polykrikoides bloom was about 21${\circ}C$ at the coastal areas of the South Sea and along the shore of the East Sea of Korea during the summer season of 1995. The northern limit of red tides was coincident with that of 21${\circ}C$ isothermal line in the East Sea. The red tides that initially bloomed at the coast of Pohang on September 21, 1995 moved to the coast of Uljin on September 26, 1995. The skipped appearance of the red tides in the areas between Pohang and Uljin was due to the East Korean Warm Current, which was moving offshore from Pohang to approach to Uljin. The cold water which was formed by tidal front in the western coast of the South Sea and by upwelling water from deep layer in the southeastern coast of the Korean peninsula played a role in blocking the spreading of red tides during summer season in 1997 and 1998. In conclusion, the distribution of red tides appeared to be dependent on the initial water temperature at red tides bloom. The SST at the red tides varied from 21${\circ}C$ to 25${\circ}C$; 21${\circ}C$, 23${\circ}C$, 24 and 24-25${\circ}C$ in 1995, 1996, 1997 and 1998, respectively.