• Title/Summary/Keyword: Curing kinetics

Search Result 70, Processing Time 0.031 seconds

Kinetics of Anhydride Curing of Epoxy : Effect of Chain Length of Anhydride (에폭시 무수화물 경화의 동력학적 연구: 무수화물의 사슬 길이 효과)

  • Chung, I.;Lee, J.
    • Elastomers and Composites
    • /
    • v.40 no.1
    • /
    • pp.3-11
    • /
    • 2005
  • The ruling kinetics of epoxy resins with 3 different kinds or alkenylsuccinic anhydride (ASA) having C-8, C-12, and C-16 pendant side chain length with two different catalysts was studied by using differential scanning calorimetry (DSC). Nonisothermal and isoconversional method has been used for characterizing the effect of the pendant side chain length in the curing process. Results or nonisothermal method showed that there was no significant difference in the effect of the pendant side chain length of ASA. But isoconversional analysis showed that the value of the activation energy for the initiation reaction or C-8, C-12, and C-16 were $61.7{\sim}57.7kJ/mol$, $63.0{\sim}57.3 kJ/mol$, and $130.4{\sim}94.2 kJ/mol$, respectively, depending on the catalyst used. The values of activation energy for the initiation is different as reported value of 20 kJ/mol which indicating the difference in the effect of the pendant side chain length of ASA in the initial stage of the reaction.

Curing Kinetics of Amine Terminated Polyetherimide/Epoxy Resin Blends and Its Application on the High Toughness Composites (Amine terminated polyetherimide/Epoxy 블렌드의 경화공정과 고강인성 복합재료에의 응용)

  • 김민영;김성호;이광기;김원호;안병현
    • Proceedings of the Korean Society For Composite Materials Conference
    • /
    • 2001.10a
    • /
    • pp.49-52
    • /
    • 2001
  • The investigation of cure kinetics, morphology, and fracture toughness studies on epoxy resin/amine terminated PEI/Anhydride system were performed by differential scanning calorimetry and scanning electron microscopy. Modified autocatalystic kinetics model was applied by isothermal scan test. The fracture toughness for the neat epoxy resin was 2.15 MPa m0.5 and the fracture toughness was improved 45% as neat epoxy resin system. The generation of secondary phase of AT-PEI was observed and its size was grown up by increasing contents of PEI.

  • PDF

Thermal Behavior of Silver Paste to Improve Reliability and Image Quality of LCoS Panel

  • Chen, Yu-Hsien;Huang, I-Chen;Huang, Li-Chen;Wang, Jiun-Ming;Chen, Kun-Hong;Liu, Kuang-Hua;Li, Huai-An;Lo, Yu-Cheng;Liu, Pei-Yu
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2006.08a
    • /
    • pp.1398-1401
    • /
    • 2006
  • Silver paste curing process is very important in LCoS panel manufacture because incomplete curing process will cause poor bonding strength and increase resistance. The imperfection situation results in poor reliability and the variation of the common voltage, respectively. The change of the common voltage causes image flicker. According to Kinetics, we acquire activation energy by using dynamic DSC and compare two kinds of silver paste. From the result of isothermal DSC, we get optimum curing parameters to solve the flicker problem caused of incomplete curing of the silver paste.

  • PDF

Microwave Effect on Curing of Waterborne Polyurethane

  • Lee, Hoi-Kwan;Fang, Chris. Y.;Pantano, Carlo. G.;Kang, Won-Ho
    • Bulletin of the Korean Chemical Society
    • /
    • v.32 no.3
    • /
    • pp.961-963
    • /
    • 2011
  • Spin-coated waterborne polyurethane to protect glass surface from environmental attacks was cured by using microwave heating. The effect of microwave heating on the reaction kinetics, chemical durability, and transmittance of polyurethane was investigated. In comparison to the conventional heating the results show that the microwave heating substantially accelerates the curing process of waterborne polyurethane and the total time for the completion of the reaction is only 1/7 of that in the conventional process. The microwave cured sample showed an excellent caustic resistance compared to conventional cured one. It means that microwave heating produces dense structure during curing process. The dense structure does not affect to the transmittance in the visible region.

A cure process modeling of LED encapsulant silicone (LED 패키징용 실리콘의 경화공정 모델링)

  • Song, Min-Jae;Kim, Heung-Kyu;Kang, Jeong Jin;Kim, won-Hee
    • Design & Manufacturing
    • /
    • v.6 no.1
    • /
    • pp.84-89
    • /
    • 2012
  • Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.

  • PDF

Curing Behavior of Epoxy Resins Using Aminolysis Products of Waste Polyurethanes as Hardeners

  • Lee, Dai-Soo;Hyun, Song-Won;Seo, Seung-Wook;Kim, Kyoung-Jong
    • Proceedings of the IEEK Conference
    • /
    • 2001.10a
    • /
    • pp.738-741
    • /
    • 2001
  • We carried out aminolyses of various rigid polyurethane foams (PUFs) using diethylene triamine and studied application of the aminolysis products as hardners of epoxy resins. Diglycidyl ether of bisphenol A was used for the study on the curing behavior of epoxy resin with the aminolysis product employing differential scanning calorimeter. Curing reaction of the epoxy resin is generally known to be autocatalytic second order reaction. We found that the curing reaction of the epoxy resin with the aminolysis product of rigid PUF did not show autocatalytic characteristics but followed the n-th order kinetics. The activation energy of the curing reaction of the epoxy resin with the aminolysis product of rigid PUF made from sugar based polyol was slightly lower than that of the epoxy resin with aminolysis product of rigid with made from amine based polyol.

  • PDF

Cure Kinetics of a Bisphenol-A Type Vinyl-Ester Resin Using Non-Isothermal DSC

  • Ahn, WonSool
    • Elastomers and Composites
    • /
    • v.53 no.1
    • /
    • pp.1-5
    • /
    • 2018
  • In the current research, the curing kinetics of a mixture system consisting of a Bisphenol-A type vinyl ester resin and styrene monomer was studied. Methylethylketone peroxide and cobalt octoate were used as the polymerization initiator and accelerator respectively. Thermograms with several different heating rates were obtained using non-isothermal differential scanning calorimetry. Activation energy values analyzed by the Flynn-Wall-Ozawa isoconversional method showed a three-step change with conversion ${\alpha}$: a slight decrease initially for ${\alpha}$ < 0.1, a constant value of 47.9 kJ/mol in the range 0.1 < ${\alpha}$ < 0.7, and a slow increase for 0.7 < ${\alpha}$. When assuming a constant activation energy of 47.9 kJ/mol, an autocatalytic model of the Sestak-Berggren equation was considered as the proper mathematical model of the conversion function, indicating an overall order of 1.2.

Kinetics of the water absorption in GGBS-concretes: A capillary-diffusive model

  • Villar-Cocina, E.;Valencia-Morales, E.;Vega-Leyva, J.;Antiquera Munoz, J.
    • Computers and Concrete
    • /
    • v.2 no.1
    • /
    • pp.19-30
    • /
    • 2005
  • We study the kinetics of absorption of water in Portland cement concretes added with 60, 70 and 80% of granulated blast furnace slag (GGBS) cured in water and at open air and preheated at 50 and $100^{\circ}C$. A mathematical model is presented that allows describing the process not only in early ages where the capillary sorption is predominant but also for later and long times where the diffusive processes through the finer and gel pores are considered. The fitting of the model by computerized methods enables us to determine the parameters that characterize the process: i.e., the sorptivity coefficient (S) and diffusion coefficient (D). This allows the description of the process for all times and offers the possibility to know the contributions of both, the diffusive and capillary processes. The results show the influence of the curing regime and the preheating temperature on the behavior of GGBS mortars.

Cure Characteristics of Metal Particle Filled DGEBA/MDA/SN/ zeolite Composite System for EMI Shielding

  • Cho, Young-Shin;Lee, Hong-Ki;Shim, Mi-Ja;Kim, Sang-Wook
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1999.05a
    • /
    • pp.548-551
    • /
    • 1999
  • The cure characteristics of metal particle filled DGEBA/MDA/SN/ zeolite epoxy resin composite system for EMI shielding were investigated by dynamic DSC run method and FT-lR spectroscopy. As the heating rate increased, the peak temperature on dynamic DSC curve increased because of the rapid cure reaction. From the straight line of the Kissinger plot, the curing reaction activation energy and pre-exponential factor could be obtained. As the post-curing time at 15$0^{\circ}C$ increased, the glass increased the glass transition temperature or the thermal stability increased. When the post curing time is too long, the system filled with metallic Al particle can be thermally oxidized by the catalytic reaction of metal filler and the thermal stability of the composite for the EMI shielding application may be decreased.

  • PDF

Study on the Curing Properties of Photo-curable Acrylate Resins (광경화성 아크릴 수지의 경화특성에 관한 연구)

  • Kim, Sung-Hyun;Chang, Hyun-Suk;Park, Sun-Hee;Song, Ki-Gook
    • Polymer(Korea)
    • /
    • v.34 no.5
    • /
    • pp.469-473
    • /
    • 2010
  • The curing mechanism and characteristics of UV curable acrylate resins were studied using Photo-DSC, FTIR, and Raman spectroscopy. Effects of chemical structures of acrylate, numbers of functional group, and UV intensity on curing kinetics were investigated with Photo-DSC. FTIR and Raman spectroscopy has been used to understand curing mechanisms and reaction conversion. In order to investigate the effect of oxygen on the photo-curing reaction, the curing process was compared between the acrylate and thiol-ene resins. The reaction conversion was found to be less than 80% for acrylate resins. The photo-curing reaction of the acrylate resin could not proceed to the end because of oxygen which acts as a reaction inhibitor while the thiol-ene resin was hardly affected from oxygen during the curing process.