• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.714-719
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• 2004

Controlling the cure depth of the Fa1260T photopolymer enhances the quality of a microstructure and minimizes its size in microstereolithography. In this work, variation of cure depth of the Fa1260T photopolymer is investigated while the concentration of a photopolymerization inhibitor as a radical quencher was varied. The energy source inducing photopolymerization was a He-Cd laser and a motorized stage controled the laser beam path accurately. The effects of process variables such as laser beam power and scan speed on the cure depth were examined. Optimum conditions for the minimum cure depth were determined as laser power of 230 W and scan speed of 40-50 m/s at the concentration of the radical quencher of 5％. The minimum cure depth at the optimal condition was 14 m. The feasibility of the fabrication of microstructures such as a microcup, microfunnel, and microgrid of 100 m size is demonstrated using Super IH process.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.7
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• pp.1563-1572
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• 1995

The on-line cure monitoring during the cure process of fiber reinforced resin matrix composite material is important for the better quality and productivity. Among several cure monitoring methods, the dielectrometry that uses electrodes as its sensor is known to be the most promising method. In this study, the sensitivity of the dielectric sensor for the on-line cure monitoring was analyzed by finite element method and compared to the experimental results. Using the analytical results, the equation for the capacitance of the sensor was derived. Also, the optimal sensor design method was suggested after analyzing several different sensor shapes.

• Polymer(Korea)
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• v.26 no.6
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• pp.728-736
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• 2002

The thermal and dielectric properties of unsaturated polyester resin system during cure were analyzed under Isothermal conditions. Both $varepsilon$′ and $varepsilon$" decreased and dipole relaxation was observed under isothermal conditions during cure. The ionic conductivity decreased linearly with the conversion according to the Kienle-Rate equation (ln($varepsilon$"$_{ionic}$we$_{0}$)=C$_{r}$$alpha$+C$_{0}$) up to $alpha$=0.15, after which it aparted from the relationship due to the entanglement of polymer chains. The effect of ionic conductivity was revealed to be larger than that of dipole motion during the whole cure through the electrical modulus analysis. Although dielectric motion was analyzed with Debye model, it was observed only at a narrow time region of middle stage of cure. In order to estimate the dielectric properties during the whole cure, the Havriliak-Negami model was considered and modified with the strong effect of ionic conductivity. The changes of $varepsilon$′ and $varepsilon$" were well estimated with this modified Havriliak-Negami model.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.22-28
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• 2000

The fiber reinforced composite materials is widely used in aircraft, space structures and robot arms because of high specific strength and high specific modulus. The on-line cure monitoring during the cure process of the composite materials has become an important research area for the better quality and productivity. In this paper, the dielectric circuit of the wheatstone bridge type for measuring the dissipation factor was designed and manufactured. Also, the dielectric sensor for the cure monitoring of the high temperature composites was developed. The residual thermal stresses of the dielectric sensor were analyzed by the finite element method and its dielectric characteristics under high temperature were evaluated. The on-line cure monitoring of the BMI resin was performed using the wheatstone bridge type circuit and developed high-temperature dielectric sensor.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.19-26
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• 2017

The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

• Composites Research
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• v.30 no.3
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• pp.202-208
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• 2017

Resin transfer molding (RTM) is a mass production process that allows the fabrication of composites ranging in size from small to large. Recently, fast curing resins with a curing time of less than about 10 minutes have been used in the automotive and aerospace industries. The viscosity of resin is bound up with the degree of cure, and it can be changed rapidly in the fast-cure resin system during the mold filling process. Therefore, it is advantageous to experimentally measure and evaluate the degree of cure because it requires much effort to predict the flow characteristics and cure of the fast curing resin. DMA and dielectric technique are the typical methods to measure the degree of cure of composite materials. In this paper, the resin flow and degree of cure were measured through the multi-channel dielectric system. A total of 8 channels of dielectric sensors were used and resin flow and degree of cure were measured and compared with each other under various pressure conditions.

• THE INTERNATIONAL COMMERCE & LAW REVIEW
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• v.12
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• pp.253-276
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• 1999

CISG articles 34 and 37 clearly allow the seller to cure any nonconformity in documents of sale or performance prior to the date for delivery if it does not cause the buyer unreasonable inconvenience or unreasonable expense. CISG article 48 allows a seller to cure the performance even after the date for delivery if it does not cause the buyer unreasonable delay, unreasonable inconvenience or unreasonable uncertainty of reimbursement by the seller of expenses advanced by the buyer. The wording any failure to perform is broad enough to include a delay. The seller's right to cure relates to all his obligations. The seller may remedy 'any failure to perform his obligations'. This language is broad enough to include a defect in documents. In some cases the fact that the seller is able and willing to remedy the non-conformity of the goods without inconvenience to the buyer, may mean that there would be no fundamental breach unless the seller failed to remedy the non-conformity within an appropriate time. It cannot generally be said what unreasonable inconvenience means. This can only be decided on a case-by-case basis. The seller must bear the costs involved in remedying a failure to perform. The curing of a failure to perform may have influence on the amount of the damage claimed. Insofar as the seller has the right to cure, the buyer is in that case obliged to accept the cure. If he refuses to do so, he can neither avoid the contract nor declare a reduction in price. This rule clearly shows the underlying concept of the CISG, to keep to the contract, if possible. Should the buyer requires delivery of substitute goods and the seller offers repair, it depends on the expense each case. The buyer must receive the request or notice by the seller. The relationship between the seller's right to cure and the buyer's right to avoid the contract is unclear. The buyer's right to avoid the contract should not nullify the seller's right to cure if the offer is reasonable. In addition, whether a breach is fundamental should be decided in the right of the seller's offer to cure.

• Elastomers and Composites
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• v.47 no.3
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• pp.254-258
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• 2012

Material characteristics and the prediction of life time of polyacrylic rubber (ACM) for automotive engine gasket were studied. Two kinds of ACM rubber compounds, having chlorine cure-site and carboxyl cure-site, were made with optimum formulations and the properties of each materials were examined. As a test results for the thermal properties and compression set, which are very important in the application for the automotive engine gasket, the compound using ACM with carboxyl cure-site was evaluated as having a better characteristics than that of ACM with chlorine cure-site. Arrhenius relationship based on time-temperature superposition principle (TTSP) was obtained through the accelerated heat aging test to predict the useful life-time for the compound using ACM with carboxyl cure-site.

• Korean Journal of Materials Research
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• v.3 no.3
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• pp.215-222
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• 1993

Malononitrile(MN) as a reactive additive was added to Diglycidyl ether of bisphenol A (DGEBA)/Methylene dianiline (MDA) system in order to modify a thermosetting epoxy resin. Cure ki. netics and cure mechanism of this modified system were investigated by using DSC(differential scanning calorimetry) and FT-IR(fourier transform infrared spectrometry). Cure kinetics gave an information that the DGEBA/MDA system modified with MN should cure at over $110^{\circ}C$ after curing at about $80^{\circ}C$ for the complete curing. The activation energy of the first cure was nearly constant and that of the second cure was increased as the MN content was increased. Cure mechanism for the system was investigated with the samples cured every $30^{\circ}C$, from $80^{\circ}C$ to $170^{\circ}C$, for Ihr. It was known that the cure reactions of the epoxy-diamine system were composed of PA -E, SA - E and E-OH reactions. Beside these three reactions, in the DGEBA/MDA/MN system PA-CN and CN-OH reaction was found.

• Elastomers and Composites
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• v.33 no.4
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• pp.281-289
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• 1998

Tensile properties including Young's modulus and tear strength were measured for four different rubber compounds; natural rubber(NR), styrene-butadiene copolymer(SBR), ethylene-propylene diene monomer (EPDM), and brominated isobutylene-p-methyl-styrene copolymer(BIMS) as a function of temperature and degree of cure. To see the effect of over cure, a measurement was made of the tensile strength and swelling behavior of the over-cured rubber compounds. Young's modulus, E, was found to have linear dependency on the degree of cure for all rubber compounds. EPDM and BIMS showed the highest and lowest slopes, respectively. The slope of NR and SBR lay between EPDM and BIMS. Tear strength, Gc, decreased in the order of NR>BIMS>SBR>EPDM. As the cure time was extended the degree of cure of NR and SBR decreased, while that of BIMS increased. EPDM showed little change in the degree of cure.