• Title/Summary/Keyword: Curable Resin

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Mechanical Characteristics of CF Laminated Prepreg with UV-thermal Dual Curable Epoxy Resin (광·열경화형 수지를 이용한 탄소섬유 프리프레그의 물리적 특성)

  • Sim, Ji-hyun;Kim, Ji-hye;Park, Sung-min;Koo, Kwang-hoe;Jang, Key-wook;Bae, Jin-seok
    • Textile Coloration and Finishing
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    • v.29 no.1
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    • pp.37-44
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    • 2017
  • An issue of major concern in the utilization of laminated composites based epoxy resin is associated with the occurrence of delaminations or interlaminar cracks, which may be related to manufacturing defects or are induced in service by low-velocity impacts. A strong interfacial filament/brittle epoxy resin bonding can, however, be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of shear stress. To improve this drawback of the epoxy resin, UV-thermal dual curable resin were developed. This paper presents UV-thermal dual curable resin which were prepared using epoxy acrylate oligomer, photoinitiators, a thermal-curing agent and thermoset epoxy resin. The UV curing behaviors and characteristics of UV-thermal dual curable epoxy resin were investigated using Photo-DSC, DMA and FTIR-ATR spectroscopy. The mechanical properties of UV-thermal dual curable epoxy resin impregnated CF prepreg by UV curable resin content were measured with Tensile, Flextural, ILSS and Sharpy impact test. The obtained results showed that UV curable resin content improves the epoxy toughness.

The Physical Properties of UV-curable Resin for the Restoration of Glass Cultural Properties and Its Application in Conservation Treatment (유리제 문화재 복원용 광경화성 수지의 물성 연구 및 적용)

  • Lee, Hae Soon;Na, Ah Young
    • Conservation Science in Museum
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    • v.21
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    • pp.1-16
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    • 2019
  • This study investigated the material properties of UV-curable Resin in order to identify stable materials for use in the restoration of glass cultural properties. Tested samples were based on acrylic UV-curable Resin (SECURE CP-7321®), to which urethane UV-curable Resin (FLGPCL04 Clear®) was added in 10% increments to produce eleven samples. The results showed that all eleven samples had similar properties in terms of refractive index, density, adhesive strength, and anti-yellowing. But the surface hardness and compressive strength were optimal and effective for maintaining the shape of artifacts after restoration treatment when the proportion of urethane resin was in the range of 10-20%. Based on these findings, the mixing sample [acrylic UV-curable Resin(9) : urethane UV-curable Resin(1)] was applied in the conservation treatment of a glass cultural propertie (Hwangbuk 519) excavated from the North Mound of Hwangnamdaechong, Tomb in Gyeongju.

Development of Build-up Printed Circuit Board Manufacturing Process Using Rapid Prototyping Technology and Screen Printing Technology (쾌속조형과 스크린 인쇄기술을 이용한 빌드업인쇄회로기판의 제조공정기술개발)

  • 조병희;정해도;정해원
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.2
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    • pp.130-136
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    • 2000
  • Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

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A Study of Dot Characteristics in Dot Patterns (망점 형태에 따른 망점 특성에 관한 연구)

  • 차재영
    • Journal of the Korean Graphic Arts Communication Society
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    • v.15 no.2
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    • pp.107-115
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    • 1997
  • The ultraviolet(UV)-curable materials are widely used in inks and coatings. In this paper is designed to develop materials having flexibility and functionality with UV-curable acrylate monomer and alkyd resin. At first, phase diagram is prepared for miscibility of UV -curable acrylate monomer with alkyd resin. Also the gel fraction and dynamic viscosity are measured to curing speed of mixing system. In results, it has been demonstrated that miscibility and curing speed are greatly influenced by alkyd resin content.

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A Study on Micro-patterning used the UV-Curable Resin (UV경화성 수지를 이용한 미세패턴 형성에 관한 연구)

  • 남수용
    • Journal of the Korean Graphic Arts Communication Society
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    • v.19 no.2
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    • pp.68-78
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    • 2001
  • UV-curable resin has the properties of quick-drying, thigh productivity at low temperature, energy savint, space saving, solventless, non-polluting and low-stinking, and thus, UV-curing system has been widely used in the fields of printing inks, adhesives, paints and coating agents. This study has been executed to micro-patterning used UV-curable resin, The micro-patterning properties of this photoresist were investigated under irradiation of UV light low pressure mercury lamp. When the exposed photoresist film was developed by pure water developer, the resolution of this photoresist was about 50$\mu\textrm{m}$.

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Development of Build-up Printed Circuit Board Manufacturing Process Using Rapid Prototyping Technology and Screen Printing Technology

  • Im, Yong-Gwan;Cho, Byung-Hee;Chung, Sung-Il;Jeong, Hae-Do
    • International Journal of Precision Engineering and Manufacturing
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    • v.4 no.4
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    • pp.51-56
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    • 2003
  • Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

Curing Properties of UV-ccurable Acrylate/Alkyd Resin Blends II (UV-curable Acrylate/Alkyd Resin 혼합계의 경화특성 II)

  • 남수용;이경옥;대평태문;구철회
    • Journal of the Korean Graphic Arts Communication Society
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    • v.18 no.1
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    • pp.157-166
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    • 2000
  • UV-curable resins have adventages of quick set, space saving, clean environment, and efficient use of energy. The polymerization induced phase separation has been studied to solve the problem in UV-curing of thick films and develop the new functional materials. On the exposure to UV irradiation, the dynamic elasticity properties were mesured for mixtures of alkyd resin and UV-cruable monomers which have different molecular structures and molecular weights. The curing rate increases with increasing temperature and UV intensity. In addition, The gel point is strongly influenced by temperature and UV intensity

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Sub 150nm Soft-Lithography using the monomer based thermally curable resin (Monomer based thermally curable resin을 이용한 150nm 급 Soft-Lithography)

  • Yang K.Y.;Hong S.H.;Lee H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.676-679
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    • 2005
  • Nano imprint Lithography (NIL) is regarded as one of the next-generation lithography technologies with EUV lithography, immersion lithography, Laser interference lithography. Because a Si wafer stamp and a quartz stamp, used to imprinting usually are very expensive and easily broken, it is suggested that master stamp is duplicated by PDMS and the PDMS stamp uses to imprint .For using the PDMS stamp, a thermally curable monomer resin was used for the imprinting process to lower pressure and temperature. As a result, NIL patterns were successfully fabricated.

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A Study on Curing Properties and Structures of Phase Separation for UV-Curable Resing and Alkyd Resin Blends (UV중합성 수지와 알키드 수지 혼합물의 경화특성 및 상분리 구조에 관한 연구)

  • 최정병
    • Journal of the Korean Graphic Arts Communication Society
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    • v.18 no.1
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    • pp.13-24
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    • 2000
  • UV-curable resin has the properties of quick-drying, high productivity at low temperature, energy, space saving, solventless, non-polluting and low-stinking, and thus, UV-curing system has been widely used in the fields of printing inks, adhesives, paints and coating agents. This study has been executed to develop a new functionnal material by the polymerization induced phase separation. The results obtained were as follows. As for the curing properties of the monomer/prepolymer/alkyd resin blends, it was found out that there was a peak by the polymerization induced phase separation when measuring the changes of viscosity and elasticity. It was also found out that such polymerization phase separation occurred in case that the alkyd resin contents were 20wt% and 30wt% and not found at the contents of 40wt%. Therefore, it would be desirable to maintain the contents of alkyd resin at less than 30wt% in order to use the polymerization induced phase separation.

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Development of UV curable polymer and curing characteristics estimation for UV nanoimprint (UV 나노임프린트를 위한 UV 경화성 수지 개발 및 경화 특성 평가)

  • 이진우;이승재;이응숙;정준호;조동우
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1220-1223
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    • 2003
  • The UV nanoimprint technology uses the UV light as the energy source. Because the imprint process is carried out in room temperature and low pressure, this technology has its own merits compared to the thermal nanoimprint. However, in UV nanoimprint technology, a resin which has low viscosity is essential for the improvement of accuracy. In this research, a resin (named as IMS01) which has relatively low viscosity was developed. And a measurement system was developed in order to measure the degree of cure of the resin. The measurement system which is composed of FT-IR, UV light source and optical guide can measure the degree of cure in real time. From the experimental results, it was found that the IMS01 is cured more rapidly than existing resin (PAK01).

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