• Title/Summary/Keyword: Cupric Ions

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EFFECT OF CUPRIC AND FERRIC IONS ON BONDING OF MMA/TBBO RESIN TO DENTIN (동 및 철이온이 MMA/TBBO레진의 상아질 접착에 미치는 영향)

  • Park, Jin-Hoon
    • Restorative Dentistry and Endodontics
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    • v.18 no.2
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    • pp.423-430
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    • 1993
  • The purpose of this study was to investigate the effect of ferric and ferric ions contained in phosphoric acid solution as a pretreatment solution on bonding of MMA/TBBO resin to dentin. Each of 1 % and 3 % ferric chloride. cupric chloride. cupric sulfate. and cupric nitrate was mixed into 10% phosphoric acid solution and pretreated dentin surface of bovine anterior teeth for 30 seconds followed- by water rinse and dry. Tensile bond strength was determined after bonding of pretreated dentin with MMA/TBBO resin by use of brush-on ;technique and storing for 24 hours in 3it distilled water. The amount of cupric ions adsorbed on pretreated dentin surface was detected by Wave-Dispersion X-ray microanalyzer for different groups of each pretreatment solution containing cupric salts. The pretreatment with cupric ions contained in 10% phosphoric acid solution was effective to increase bonding strength of MMA/TBBO resin to dentin but not in case of ferric ions. The pretreatment with 3 % cupric chloride and cupric nitrate both enhanced significant increase in bonding strength compared to the control group of 10% phosphoric acid solution(p<0.05). Cupric ions measured in pretreated dentin surface was higher in 3 % cupric chloride group than in 1% cupric chloride group, but couldn't find distinct relationship from the results of this experiment between the amount of adsorbed cupric ions according to the kind of cupric salts and the bonding strength value.

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Standard Transfer Free Energy of Sodium and Cupric Ions in Water-Acetylacetone Solvent System (물-아세틸아세톤 용매계에서 나트륨이온과 구리이온의 표준이동 자유에너지)

  • Lee Heung Lark;Park Jong-Taek
    • Journal of the Korean Chemical Society
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    • v.36 no.5
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    • pp.632-637
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    • 1992
  • Standard transfer free energies of sodium and cupric perchlorates in water-acetylacetone solvent system have been determined by electromotive force measurements of galvanic cell and these energies of sodium and cupric ions in this solvent system have been evaluated by the tetrabutylammonium tetraphenylborate assumption as the extrathermodynamic procedure. Standard transfer free energy values of sodium and cupric ions from water to acetylacetone solvent were 5.09 and 4.16 kcal/mol at 25${\circ}C$, respectively. These values mean that acetylacetone is much weaker donor solvent to sodium and cupric ions than water. The standard transfer free energy value of cupric ion from water to mixture solvents which contain small amount of acetylacetone is changed by an unusual form. This is because of the chelate formation effect of acetylacetone to cupric ion.

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Adsorption of Cupric Ions on Chitosan (키토산을 이용한 중금속(Cu2+) 흡착)

  • Kim, Tae Young;Kim, Kyoung Jin;Moon, Hee;Yang, Jai Ho
    • Applied Chemistry for Engineering
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    • v.10 no.2
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    • pp.268-274
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    • 1999
  • The chitosan solution was prepared by dissolving chitosan into 2 wt % aqueous acetic acid solution and then chitosan beads were made by sol-gel method. The average molecular weight and the degree of deacetylation of the chitosan used here were determined to be $8.2{\times}10^5$ and 85%, respectively. chitosan beads were highly porous which was confirmed by SEM photography and BET. Adsorption equilibrium of $Cu^{2+}$ on porous chitosan beads could be represented by Sips equation. The diffusion of cupric ions in the chitosan beads could be explained by pore and surface diffusion mechanisms. Adsorption dynamics of $Cu^{2+}$ in fixed-bed could be simulated by linear driving force approximation (LDFA). It was proven that porous chitosan beads manufactured in this work are good adsorbents for the removal of $Cu^{2+}$.

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Investigation on the Effect of Organic Additives on the Electroformed Cu Deposits with Micro-patterns (유기물 첨가제가 마이크로 패턴 구리 전주 도금에 미치는 영향 연구)

  • Lee, Joo-Yul;Kim, Man;Lee, Kyu-Hwan;Yim, Seong-Bong;Lee, Jong-Il
    • Journal of the Korean institute of surface engineering
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    • v.43 no.1
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    • pp.1-6
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    • 2010
  • The effect of organic additives, 1-(3-sulfoproyl)-2-vinylpyridineium hydroxide (SVH) and thiourea (TU), on the precision copper electrodeposition was investigated with optical, electrochemical and x-ray diffraction techniques. It was found that SVH played a r ole as a n accelerator and TU as an i nhibitor during the electroreduction of cupric ions in acidic Cu electroplating solution. Through electrochemical measurements, TU showed more strong interaction with cupric ions than SVH and dominated overall Cu electroplating process when both additives were present in the solution. In the case of three dimensional Cu electrodeposition on the 20 ${\mu}m$-patterned Ni substrates, SVH controlled the upright growth of Cu electrodeposits and so determined its flatness, while TU prohibited the lateral spreading of Cu in the course of pulse-reverse pulse current adaptation. With microscopic observation, we obtained the optimum organic additives composition, that is, 100 ppm SVH and 200 ppm TU during the current pulsation.

Stoichiometry of Hydrazine-Bromate Reaction in Acid Media

  • Choi, Q.Won;Jung, Jin
    • Journal of the Korean Chemical Society
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    • v.15 no.4
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    • pp.183-189
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    • 1971
  • Stoichiometry of hydrazine-bromate reaction has been studied in acid media of varying compositions, elucidating the effects of bromide and chloride ions in sulfuric acid, perchloric acid, hydrochloric acid, and hydrobromic acid at varying concentrations of hydrogen ion and cupric ion. The study shows that the number of red-ox equivalent consumed by one mole of hydrazine becomes practically 4.00 if the concentrations of bromide and hydrogen ions are kept higher than 0.1M and 6M, respectively. The presence of copper tends to reduce the bromate consumption by hydrazine in an irregular manner, but such an effect becomes unimportant if the concentrations of bromide and hydrogen ions are kept sufficiently high.

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A Study of the Structure and Thermal Property of $Cu^{2+}\;and\;NH_{4}{^+}$ Ion-Exchanged Zeolite A

  • Park, Jong-Yul;Kang, Mi-Sook;Choi, Sang-Gu;Kim, Yang;Kim, Un-Sik
    • Bulletin of the Korean Chemical Society
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    • v.15 no.5
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    • pp.341-346
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    • 1994
  • The frameworks of $(Cu(NH_3)_3OH^+)_x(NH_4^+)_{12-x}-A{\cdot} zH_2O$ which were prepared by the ion-exchange of zeolite A with ammoniac cupric nitrate solution are more stable than those of $Cu_xNa_{12-2x} -A$ obtained by the ion exchange with aqueous cupric nitrate solution are more stable than those of $Cu_xNa_{12-2x} -A$ obtained by the ion exchange with aqueous cupric nitrate solution. An energetic calculation was made on the relatively stable $(CuOH^+)_2(NH_4^+)_{10}-A{\cdot} 2H_2O$ prepared by the partial evacuation of $(Cu(NH_3)_3OH^+)_2(NH_4^+)_{10}-A{\cdot} zH_2O$. The mean stabilization energies of water, OH-, and $NH_4^+$ ions are -30.23 kcal/mol, -60.24 kcal/mol, and -16.65 kcal/mol, respectively. The results of calculation were discussed in terms of framework stability. The $(Cu(NH_3)_3OH^+)_2(NH_4^+)_{10}-A{\cdot} zH_2O$ zeolite shows two step deammoniation reactions. The first deammoniation around 210 $^{\circ}$C (third DSC peak) was attributed to the decomposition of $[Cu(NH_3)_3OH^+]$ ion and the second one around 380 $^{\circ}$C (fourth DSC peak) was ascribed to the decomposition of $NH_4^+$ ion. The activation energies of the first and second deammoniation reactions were 99.75 kJ/mol and 176.57 kJ/mol, respectively.

Interaction Metal Ions with NADH Model Compounds. Cupric Ion Oxidation of Dihydronicotinamides

  • Park, Joon-Woo;Yun, Sung-Hoe;Koh Park, Kwang-Hee
    • Bulletin of the Korean Chemical Society
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    • v.9 no.5
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    • pp.298-303
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    • 1988
  • Kinetic studies on cupric ion ($Cu^{2+}$) oxidation of 1-benzyl- and 1-aryl-1,4-dihydronicotinamides (XNAH) in aqueous solution were performed. In the presence of dioxygen ($O_2$), the reaction followed first order kinetics with respect to both XNAH and $Cu^{2+}$. The oxidation reaction was found to be independent and parallel to the acid-catalyzed hydration reaction of XNAH. The catalytic role of $Cu^{2+}$ for the oxidation of XNAH in the presence of $O_2$ was attributed to $Cu^{2+}/Cu^+$ redox cycle by the reactions with XNAH and $O_2$. The second order rate constants of the Cu2+ oxidation reaction kCu, and acid-catalyzed hydration reaction $k_H$ were strongly dependent on the nature of the substituents in 1-aryl moiety. The slopes of log $k_{Cu}$ vs log $K_H$ and log $k_{Cu}$ vs ${\sigma}_p$ of the substituents plots were 1.64 and -2.2, respectively. This revealed the greater sensitivity of the oxidation reaction rate to the electron density on the ring nitrogen than the hydration reaction rate. A concerted two-electron transfer route involving XNAH-$Cu^{2+}$ complex was proposed for mechanism of the oxidation reaction.

Study on the Elution Behavior of Rare Earth Elements by Cation Exchange Resin (양이온 교환수지에 의한 희토류 원소의 용리현상에 관한 연구)

  • Ki-Won Cha;Sung-Wook Hong;Kyung-Hwan Kim
    • Journal of the Korean Chemical Society
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    • v.30 no.1
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    • pp.63-68
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    • 1986
  • Elution behavior of rare earth elements have been investigated with the EDTA solution as an eluent using cation exchange resin. Definite amount of the complexed rare earth ions at pH 8.4 is adsorbed through the cation exchanger containing cupric ion as a retaining ion and eluted with EDTA solution. The rare earth ions are eluted more rapidly in the above method than in the method in which uncomplexed rare earth ions are adsorbed on the cation exchange resin bed. In this method, the elution time and amount of eluent are saved but the resolution values also decreased a little. The elution order of complexed ion was determined in accordance with the stability constant of complexes with rare earth elements.

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