• 한국분말재료학회지
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• 제20권1호
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• pp.33-36
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• 2013

A bulk metallic glass-forming alloy, $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ metallic glass powders was used for good commercial availability and good formability in supercooled liquid region. In this study, the Ni-based metallic glass was synthesized using by high pressure gas atomized metallic glass powders. In order to create a bulk metallic glass sample, the $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ metallic glass powders with ball-milled Ni-based amorphous powder with 40%vol brass powder and Cu powder for 20 hours. The composite specimens were prepared by Spark Plasma Sintering for the precursor. The SPS was performed at supercooled liquid region of Ni-based metallic glass. The amorphous structure of the final sample was characterized by SEM, X-ray diffraction and DSC analysis.

• 대한금속재료학회지
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• 제49권5호
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• pp.411-418
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• 2011

The current study investigates the electroplating characteristics of Sn-Cu eutectic micro-bumps electroplated on a Si chip for flip chip application. Under bump metallization (UBM) layers consisting of Cr, Cu, Ni and Au sequentially from bottom to top with the aim of achieving Sn-Cu bumps $10\times10\times6$ ${\mu}m$ in size, with 20${\mu}m$ pitch. In order to determine optimal plating parameters, the polarization curve, current density and plating time were analyzed. Experimental results showed the equilibrium potential from the Sn-Cu polarization curve is -0.465 V, which is attained when Sn-Cu electro-deposition occurred. The thickness of the electroplated bumps increased with rising current density and plating time up to 20 mA/$cm^2$ and 30 min respectively. The near eutectic composition of the Sn-0.72wt%Cu bump was obtained by plating at 10 mA/$cm^2$ for 20 min, and the bump size at these conditions was $10\times10\times6$ ${\mu}m$. The shear strength of the eutectic Sn-Cu bump was 9.0 gf when the shearing tip height was 50% of the bump height.

• 한국식품영양과학회지
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• 제12권4호
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• pp.305-309
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• 1983

수종(數種)의 핵산구성성분(核酸構成成分), 아미노산(酸), 요소유도체(尿素誘導體)와 같은 생리활성물질(生理活性物質) 및 함질소화합물(含窒素化合物)의 DNA에 대한 작용(作用)과 그 작용(作用)에 무기(無機)ion의 영향을 검토(檢討)하였다. PTU, Cys-SH는 금속(金屬) ion없이도 DNA 절단능력(切斷能力)을 가지고 있었고, Tyr, Phe, Trp는 $CuSO_4$존재(存在) 하(下)에서 약한 DNA damage 유기작용(誘起作用)이 있었으며 5mM 이상의 Cys-SH와 $500{\mu}M$ $CuSO_4$의 혼합액(混合液)은 강(强)한 DNA 절단작용(切斷作用)을 나타냈다. $Sn^{2+}$를 제외한 $500{\mu}M$의 무기염(無機鹽)은 DNA에 대한 절단능력이 없었으나, $Cu^{2+}$, $Ni^{2+}$, $Mn^{2+}$, $Zn^{2+}$, $Sn^{2+}$ 등은 수종(數種)의 아미노산(酸)의 DNA breaking action에 영향을 미치고 있음을 확인(確認)되었다.

• 한국분말재료학회지
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• 제12권6호
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• pp.406-412
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• 2005

This work is to present a new synthesis of metallic glass (MG)/metallic glass (MG) composites using gas atomization and spark plasma sintering (SPS) processes. The MG powders of $Cu_{54}Ni_6Zr_{22}Ti_{18}$ (CuA) and $Ni_{59}Zr_{15}Ti_{13}Nb_7Si_3Sn_2Al_1$(NiA) as atomized consist of fully amorphous phases and present a different thermal behavior; $T_g$ (glass transition temperature) and $T_x$ (crystallization temperature) are 716K and 765K for the Cu base powder, but 836K and 890K for the Ni base ones, respectively. SPS process was used to consolidate the mixture of each amorphous powder, being $CuA/10\%NiA\;and\;NiA/10\%CuA$ in weight. The resultant phases were Cu crystalline dispersed NiA matrix composites as well as NiA phase dispersed CuA matrix composites, depending on the SPS temperatures. Effect of the second phases embedded in the MG matrix was discussed on the micro-structure and mechanical properties.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.77-85
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• 2004

플라즈마 리플로우 솔더링에서 솔더볼의 접합성을 향상시키기 위해 UBM(Under Bump Metallization)을 Ar-10vol%$H_2$플라즈마로 클리닝하는 방법을 연구하였다. UBM층은 Si 웨이퍼 위에 Au(두께; 20 nm)/ Cu(4 $\mu\textrm{m}$)/ Ni(4 $\mu\textrm{m}$)/ Al(0.4 $\mu\textrm{m}$)을 웨이퍼 측으로 차례대로 증착하였다. 무연 솔더로는Sn-3.5wt%Ag, Sn-3.5wt%Ag-0.7wt%Cu를 사용하였고 Sn-37wt%Pb를 비교 솔더로 사용하였다. 지름이500 $\mu\textrm{m}$인 솔더 볼을 플라즈마 클리닝 처리를 한 UBM과 처리하지 않은 UBM위에 놓고, Ar-10%$H_2$플라즈마 분위기에서 플럭스 리스 솔더링하였다. 이 결과는 플럭스를 사용하여 대기 중에서 열풍 리플로우한 결과와 비교하였다. 실험 결과, 플라즈마 클리닝 후 플라즈마 리플로우한 솔더의 퍼짐율이 클리닝 하지 않은 플라즈마 솔더링보다 20-40%정도 더 높았다. 플라즈마 클리닝 후 플라즈마 리플로우한 솔더 볼의 전단 강도는 약58-65MPa로, 플라즈마 클리닝 하지 않은 플라즈마 리플로우보다 60-80%정도 높았으며, 플럭스를 사용한 열풍 리플로우보다는 15-35%정도 높았다. 따라서 Ar-10%$H_2$가스를 사용하여 UBM에 플라즈마 클리닝하는 공정은 플라즈마 리플로우 솔더 볼의 접합강도를 향상시키는데 상당한 효과가 있는 것으로 확인되었다.

• 한국분말재료학회지
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• 제13권5호
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• pp.351-359
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• 2006

Ni based($Ni_{57}Zr_{20}Ti_{18}Si_2Sn_3$) bulk metallic glass(BMG) powders were produced by a gas atomization process, and ductile Cu powders were mixed using a spray drying process. The Ni-based amorphous powder and Cu mixed Ni composite powders were compacted by a spark plasma sintering (SPS) processes into cylindrical shape. The relative density varied with the used SPS mold materials such as graphite, hardened steel and WC-Co hard metal. The relative density increased from 87% to 98% when the sintering temperature increased up to $460^{\circ}C$ in the WC-Co hard metal mold.

• 한국표면공학회지
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• 제36권5호
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• pp.373-378
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• 2003

With increasing environmental concerns, application of lead-free solder and fluxless soldering process have been taken attention from the electronic packaging industry. Plasma treatment is one of the soldering methods for the fluxless soldering, and it can prevent environmental pollution cased by flux. On this study fluxless soldering process under $Ar-H_2$plasma using lead free solders such as Sn-3.5 wt%Ag, Sn-3.5 wt%Ag-0.7 wt%Cu and Sn-37%Pb for a reference was investigated. As the plasma reflow has higher soldering temperature than normal air reflow, the effects of UBM(Under Bump Metallization) thickness on the interfacial reaction and bonding strength can be critical. Experimental results showed in case of the thin UBM, Au(20 nm)/Cu(0.3 $\mu\textrm{m}$)/Ni(0.4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), shear strength of the soldered joint was relatively low as 19-27㎫, and it's caused by the crack observed along the bonded interface. The crack was believed to be produced by the exhaustion of the thin UBM-layer due to the excessive reaction with solder under plasma. However, in case of thick UBM, Au(20 nm)/Cu(4 $\mu\textrm{m}$)/Ni(4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), the bonded interface was sound without any crack and shear strength gives 32∼42㎫. Thus, by increasing UBM thickness in this study the shear strength can be improved to 50∼70%. Fluxed reflow soldering under hot air was also carried out for a reference, and the shear strength was 48∼52㎫. Consequently the fluxless soldering with plasma showed around 65∼80% as those of fluxed air reflow, and the possibility of the $Ar-H_2$ plasma reflow was evaluated.

• 한국표면공학회지
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• 제49권1호
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• pp.54-61
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• 2016

Screen printing of commercially available Ag paste is the most widely used method for the front side metallization of Si solar cells. However, the metallization using Ag paste is expensive and needs high temperature annealing for reliable contact. Among many metallization schemes, Ni/Cu/Sn plating is one of the most promising methods due to low contact resistance and mass production, resulting in high efficiency and low production cost. Ni layer serves as a barrier which would prevent copper atoms from diffusion into the silicon substrate. However, Ni based schemes by electroless deposition usually have low thermal stability, and require high annealing process due to phosphorus content in the Ni based films. These problems can be resolved by adding W element in Ni-based film. In this study, Ni-W-P alloys were formed by electroless plating and properties of it such as sheet resistance, resistivity, specific contact resistivity, crystallinity, and morphology were investigated before and after annealing process by means of transmission line method (TLM), 4-point probe, X-ray diffraction (XRD), and Scanning Electron Microscopy (SEM).

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• Tribology and Lubricants
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• 제11권5호
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• pp.162-171
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• 1995

The application of reciprocating engine crankshaft bearings is of particular importance and interest among the plain bearing, not only because the sheer volume of intemal combustion engines now produced, but because the severe operating conditions they are subjected to. Demands for better performances of crankshaft bearings have provide an important impetus in the development of bearings and bearing materials. As engine design progresses toward higher outpt and higher efficiency, crankshaft bearings must perform under more seveve operating conditions. Higher load, temperature, and speed as well as lower viscosity oil are applied to the bearing sysem, resulting in a smaller minimum oil film thickness. This means more solid-solid contact between the shaft and bearing, and the bearing is exposed to more danger of seizure. Some engines may experience bearing seizure problems. However, understanding about the seizure behavior and mechanism is far from being enough. Seizure resistance of a bearing-shaft system will be affected by the properties of the shaft and bearing, especially their materials and surface texture. Commonly used engine bearing materials include Al-Pb-Si, Al-Sn-Si, Al-Sn, and Cu-Pb with Pb-Sn-Cu overlay. These materials have very different properties. They showed different behaviors dering seizure tests and seizure may occur with different mechanism for different bearing material. Shaft materials also affect the seizure resistance of the system. Surface texture of the bearing and shaft have apparent effects on the lubrication and solid-solid contact pattern, and therefore will affect the seizure behavior of the system. Bearings and shafts which are made of different materials and have different surface textures have been tested and analyzed. Their effects on seizure resistance are discussed and possible seizure mechanisms for different beatings are presented in this paper.