• 대한금속재료학회지
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• 제49권3호
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• pp.211-220
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• 2011

To improve the low ductility and high strain-rate sensitivity in Sn-Bi based solder alloys, the influences of the minor additions of alloying elements (Ag, Mn, In) were investigated. The strain-stress curves of various Sn-40Bi(-X) alloys, including a pre-suggested Sn-40Bi-0.1Cu composition were measured using a tensile testing machine. As a result, the elongation and ultimate tensile strength (UTS) values were compared. The small addition (0.5 wt.%) of Ag significantly enhanced the ductility and high strain-rate sensitivity of the alloys at strain rates of $10^{-4}$ to $10^{-2}\;s^{-1}$ mainly due to the increase and refinement of eutectic lamellar structures. The microstructure change increased the area of grain boundaries, thus ameliorating the grain boundary sliding mode. It was also found that Mn is an effective element in enhancing the ductility, especially at the strain rates of $10^{-3}$ to $10^{-2}\;s^{-1}$ The enhancement is likely attributed to the fine and homogeneous microstructure in the alloys containing Mn.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 추계 기술심포지움 초록집
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• pp.24-24
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• 2004

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.66-66
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• 2009

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites(diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature 940 $^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• Journal of Welding and Joining
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• 제28권3호
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• pp.49-58
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• 2010

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• 대한금속재료학회지
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• 제47권12호
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• pp.842-851
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• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.27-36
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• 2007

본 논문에서는 다양한 조성의 주석-은-구리 합금계 솔더볼과 ENIG 및 Cu-OSP 패드와의 계면 반응에 대해 연구하였다. ENIG 패드와 미량의 Sb이 첨가된 합금 솔더와의 계면 반응 시 다른 솔더에 비해 매우 얇은 100 nm 내외의 두께를 가진 P-rich Ni layer가 형성되었다. 미량의 Ni이 첨가된 합금 솔더와 Cu-OSP 금속 패드와의 계면 반응 시에는 다른 솔더와는 달리 균일한 두께의 $Cu_6Sn_5$ 금속간화합물이 형성되었으며 추가 리플로우 시에 금속간화합물 입자가 거의 성장하지 않았다. 또한 $150^{\circ}C$의 장시간 열처리 시에 다른 솔더에 비해 매우 얇은 두께의 $Cu_3Sn$ 금속간화합물이 형성되었다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.791-797
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• 2002

This paper introduces the partial melting process for solder application and characterization of its feasibility using Sn-Ag, and Sn-Cu solder alloys. ill order to show that the liquid phase in the semi-liquid state maintains the similar wettability as single-phase liquid, the wetting balance tests are conducted with varying temperatures and compositions. Also, as a new soldering technology, the microstructural and mechanical test were investigated. The results from this research indicate that the partial melting can yield satisfactory sider joints as long as the liquid phase acquires sufficient chemical activity. At a condition where the partial melting is effective, a direct correlation between the wettability and the surface tension is found to exist.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 춘계학술발표대회 개요집
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• pp.246-249
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• 2002

• 한국주조공학회지
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• 제34권2호
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• pp.49-53
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• 2014

In commercial Zr-Nb-Cu-Ni-Al amorphous alloys, expensive element, Zr, was substituted to Sn which was cheaper one, and then, glass forming ability, compressive strength and hardness of them were estimated. Even though the Sn was added up to 1.5%, resulting phase was not changed to the crystalline form. It was confirmed by X-ray diffraction and thermal analyses. In the X-ray profiles, there were no peaks for crystalline phases and typical halo pattern for amorphous phase was appeared at the diffraction angle of $35^{\circ}{\sim}45^{\circ}$. Thermal analyses also showed that the Sn modified alloys were corresponded to the amorphous standards where ${\delta}T$(= Tx - Tg) and Trg(= Tg/Tm) affecting to the amorphous forming ability were more than 50K and 0.60 respectively. Compressive strengths were 1.77 GPa, 1.63 GPa, 1.65 GPa and 1.77 GPa for 0%Sn, 0.5%Sn, 1.0%Sn and 1.5%Sn respectively. Hardnesses of the Sn modified alloys were decreased from 752 Hv to 702 Hv in 1.0%Sn and recovered to 746 Hv in 1.5%Sn.

• 한국주조공학회지
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• 제20권2호
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• pp.116-121
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• 2000

Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.