• Title/Summary/Keyword: CuNi codeposition

Search Result 2, Processing Time 0.021 seconds

Spectroscopic and Electrochemical Study on the Citrate-based CuNi Codeposition (구연산 기반 구리-니켈 합금도금에 대한 분광학적/전기화학적 특성 연구)

  • Lee, Joo-Yul;Yim, Seong-Bong;Kim, Man;Jeong, Yong-Soo
    • Journal of the Korean institute of surface engineering
    • /
    • v.44 no.3
    • /
    • pp.117-123
    • /
    • 2011
  • We investigated the spectroscopic and electrochemical properties of the citrate-based CuNi solution at different solution pH and analyzed various surface properties of CuNi codeposition layer. By combining UV-Visible spectroscopic data with potentiodynamic polarization curves, it could be found that the complexation of $Ni^{2+}$-citrate pair was completed at lower solution pH than $Cu^{2+}$-citrate pair and was affected by the coexistent $Cu^{2+}$ ions, while the complexation between $Cu^{2+}$ ions and citrate was not sensitive to the presence of $Ni^{2+}$ ions. Also, the electron transfer from cathode to $Cu^{2+}$-citrate and$Ni^{2+}$-citrate was hindered by strong complexation between $Cu^{2+}/Ni^{2+}$ ions and citrate and so apparent codeposition current densities were reduced as the solution pH increases. CuNi codeposited layers had a higher Cu content when they were prepared at high pH solution due to the suppression of Ni deposition, and when codeposition was executed in an agitated condition due to the acceleration of mass transfer of $Cu^{2+}$ ions in the solution. Actually, solution pH had little effect on the surface morphology and deposits orientation, but greatly influenced the corrosion resistance in 3.5% NaCl solution by modifying the chemical composition of CuNi layers and so pH 3 was expected as the most suitable solution pH in the viewpoint of corrosion coatings.

Fabrication of Porous Reticular Metal by Electrodeposition of Fe/Ni Alloy for Heat Dissipation Materials (Fe/Ni 합금전착에 의한 다공성 그물군조 방열재료의 제조 연구)

  • Lee, Hwa-Young;Lee, Kwan-Hyi;Jeung, Won-Young
    • Journal of the Korean Electrochemical Society
    • /
    • v.5 no.3
    • /
    • pp.125-130
    • /
    • 2002
  • An attempt was made for the application of porous reticular metal to a heat dissipation material in semiconductor process. For this aim, the electrodeposition of Fe/Ni alloy on the porous reticular Cu has been performed to minimize the thermal expansion mismatch between Cu skeleton and electronic chip. Preliminary tests for the electrodeposition of Fe/Ni alloy layer were conducted by using standard Hull Cell to examine the effect of current density on the composition of alloy layer. It seemed that mass transfer affected significantly the composition of Fe/Ni layer due to anomalous codeposition in the electrodeposition of Fe/Ni alloy. A paddle type stirring bath, which was employed to control the mass transfer of electrolyte in the work, was found to allow the electrodeposition Fe/Ni with a precise composition. result showed that the thermal expansion of Fe/Ni alloy layer was much lower than that of pure copper. From the tests of heat dissipation by using the apparatus designed in the work the heat dissipation material fabricated in the work showed the excellent heat dissipation capacity, namely, more than two times as compared to that of pure copper plate.