• Journal of the Korean Society for Heat Treatment
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• v.14 no.1
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• pp.17-21
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• 2001

The effects of Cr content above its solubility limit and thermomechanical treatment on tensile strength and electrical conductivity of Cu-Cr alloys were studied to obtain optimum Cr content exhibiting a high tensile strength without degradation of electrical conductivity. The increase in Cr content above the solubility limit increased tensile strength of Cu-Cr alloys without deterioration of the electrical conductivity. The electrical conductivity was not affected by cold rolling. The electrical conductivity of a Cu-3.5%Cr alloy subjected to cold rolling ${\rightarrow}$ aging treatment ($450^{\circ}C{\times}1hr$) ${\rightarrow}$ cold rolling was equal to that of the alloy subjected to cold rolling ${\rightarrow}$ aging treatment. However, the tensile strength of the alloy subjected to the former thermomechanical treatment was superior to that of the alloy subjected to the latter thermomechanical treatment at all the deformation degrees.

• Korean Journal of Soil Science and Fertilizer
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• v.11 no.2
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• pp.119-126
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• 1979

Rice seeds, suweon 264, were germinated under 5 levels of toxic heavy metals, Cd(0, 0.05, 0.5, 5, 20ppm), Cu(0, 0.05, 0.5, 5, 20, ppm), Cr(0, 0.5, 1, 5, 10ppm), Ni(0, 0.5, 1, 5, 10ppm), Co(0, 0.5, 1, 5, 10ppm), Zn(0, 0.5, 5, 20, 40, ppm), Pb(0, 0.5, 5, 20, 40ppm) and Mn(0, 1, 10, 25, 50, ppm) in culture solution, and then grown with supplying culture solution contained respective concentrations. Germination and growth response to the toxic heavy metals were studied. Results obtained are as follows : 1) The germination injury of rice seeds by excess concentration of toxic heave metal in culture solution occured in Cd and Cu; below 0.05 ppm, Ni; below 0.5 ppm, Mn; below 1.0 ppm, Co and Cr; 0.5-1.0 ppm, and 0.5-5 ppm, Zn and Pb. Thereby, in the order of degrees of the elements toxicity to germination, they were arranged as follows : Cd>Cu>Ni>Co>Cr>Mn>Zn$$\geq_-$$Pb. 2) Toxic heavy metal concentrations in culture solution, which result in decreasing dry weight due to the injury of excess concentration of treated elements, were Cd: below 0.05 ppm, Ni, Cr and Co; below 0.5 ppm, Cu and Zn; 0.5-5 ppm, Pb; 5-20 ppm and Mn; 10-25 ppm. The order was Ni>Cd>Cr>Co>Cu$$\geq_-$$Zn>Pb>Mn. 3) The critical contents of Cd, Ni, Pb, Cu, Zn, Mn, and Co in dry matter, Which result in decreasing dry weight, were considered to be 0.05-15.5, 1.50-25.0, 24.0-28.0, 26.5-62.5, 470-645.0, 231.0-500.0 and below 15.0 ppm, respectively. 4) The contents of Cr, Co, Cd, Pb, Ni, Cu and Zn in dry matter by 0.5 ppm treatment concentration of each heavy metals was trace, 15.0, 17.5, 24.0, 25.0, 84.5 and 470.0 ppm, respectively. Thereby, in the order of each element to uptaked by rice seedlings, they were arranged as follow; Zn>Cu>Ni>Pb>Cd>Co>Cr. 5) The hazardous concentrations of root activity by toxic heavy metals in culture solution were Cd; below 0.05, Cu; 0.05-0.5, Cr; below 0.5, Ni; 0.5-1.0, Co; 0.5-1.0, Zn; above 0.5, Pb; 0.5-5.0 and Mn; 1.0-10.0 ppm. The hazardous degree of root activity by toxic heave metals was in the order of Cd>Cu>Cr>Zn>Ni>Co>Pb>Mn.

• Journal of the Korean Chemical Society
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• v.53 no.3
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• pp.293-301
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• 2009

Analytical results of a fixed concentration of Pb, Cd and Cr in the synthetic copper standard solution (RMs) for using the matrix no matched standard calibration curve at various wavelength by ICP showed that accuracy (140 $\sim$ 1,070% in case of Pb) is very poor at all wavelengths because of the Cu matrix effect. Analytical results of a fixed concentration of Pb, Cd and Cr in the different concentration solutions of Cu showed that found values were on the increase or decrease as the rate of a regular equation as the concentration of Cu was increased. Accuracies by the Cu matching method in the analysis of Pb, Cd and Cr in the synthetic copper standard solution (RMs) were higher than 99.9%.

• Journal of the Korean institute of surface engineering
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• v.28 no.4
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• pp.219-224
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• 1995

The peel adhesion and plastic deformation in Cu-Cr alloy films, sputter-deposited onto polyimide films, have been studied as a function of Cr content in the film. The adhesion strength has been measured by T-peel test and the amount of plastic deformation in the peeled metal strip was determined qualitatively by XRD technique. Peel adhesion strength has a maximum in the film containing 22-33wt.% Cr and the peel strength of pure Cr film is lower than the maximum. The film having the highest peel strength is deformed most heavily. The effect of Cr content on the peel strength is discussed in terms of the interfacial bond strength and mechanical properties of Cu-Cr alloy film.

• Nuclear Engineering and Technology
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• v.53 no.6
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• pp.1887-1892
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• 2021

The effect of gadolinium and boron on the texture development and magnetic properties of the texture controlled 23Cr-10NiCu duplex stainless steels were studied to develop a high performance neutron and electromagnetic shielding material. The 23Cr-10NiCu base alloy is composed of 60% of austenite and 40% of ferrite, whereas, the 23Cr-10NiCu-0.5Gd-0.8B modified alloy is composed of 66% of austenite, 27% of ferrite and 7% of CrFeB intermetallic compounds. The gadolinium and boron addition to the 23Cr-10NiCu base alloy increased mechanical properties. Microstructure observation showed that the small addition of 0.5 wt% gadolinium and 0.8 wt% boron to the alloy retarded to form texture at the same hot rolling conditions, and improved the maximum magnetism, residual magnetism and coercive force about 3%, 122% and 120%, respectively.

• Applied Microscopy
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• v.28 no.3
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• pp.345-362
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• 1998

In order to the comparative morphological study of the non-ciliated and ciliated epithelial cells, and to elucidate the process of degeneration of non-ciliated epithelial cell of the ductus epididymidis, Korean striped field mouse, Apodemus agrarius coreae was examined with light and transmission electron microscopes. The morphological characteristics of non-ciliated epithelial cell, the cell types of the caput epididymidis (Cp), corpus epididymidis (Cr) and cauda epididymidis (Cu) were long-columnar, short-columnar and short-cuboudal, respectively. The mitochondria and rough endoplasmic reticulum tended to be broken as they immigrated from Cp to the Cu. The Golgi acted vigorously at the Cp, but the Golgi was inactive in Cr and Cu. The secretory vesicles and lysosomes were increased gradually from Cp to the Cu. The process of degeneration of the non-ciliated epithelial cells observed in the Cp, Cr and Cu epididymidis. The increase of the non-ciliated epithelial cells, and its degeneration were observed more often from Cp to the Cu. The morphological characteristics of the ciliated epithelial cells, the cell types of the Cp, Cr and Cu were long-columnar, short-columnar and short-cuboudal, respecptively like the non-ciliated epithelial cells. The stereocilia was long and slender at the Cp and Cr, while Cu was very short. The pinocytotic vesicles and absorptive vesicles were increased from the Cp to the Cu. Numerous disintergrated products was existed at the Cr including the Cp, but Cu were not observed. A significant amount of lysosomes existed at the Cp and Cr epithelial cells, but they were not observed in Cu epithelial cells.

• Analytical Science and Technology
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• v.8 no.3
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• pp.299-304
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• 1995

The adsorption behaviors of Ba(II), Cr(II), Fe(II) and Cu(II) on the N, N'-bispalmtoyl 1, 12-diaza-3, 4:9, 10-dibenzo-5, 8-cyclopentadecane (hexadecyl $NtnOenH_4$)-octadecylsilanized silicas(ODS) were investigated with water as the mobile phase. Binding constants for metal ions were measured in aqueous solution. The order of binding constants(K) and the degree of sorption(E) were Ba(II)$NtnOenH_4$-octadecyisiianized silicas(ODS) increased with concentration of metal ions, and the degree of adsorption was found to be affected by the cation-chelation mechanism. The experimental results showed good efficiency for separation of Cu(II) from mixtures of Ba(II), Cr(II), Fe(II) and Cu(II) in aqueous solution.

• Journal of the Korean institute of surface engineering
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• v.26 no.6
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• pp.327-333
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• 1993

The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after heat treatment at $400^{\circ}C$ for 0.5 hr and 2 hrs respectively. The adhesion of metal film onto polyimide was considerably good before heat treatment, but heat treatment re-duced the peel adhesion strength in all specimens. The reduction in adhesion in adhesion strength values in the specimens which were plated after heat treatment was mainly due to Cr-O rich pahse formed in the metal/polyimide in-terface. In the specimens which were heat treated after plating, the enhanced ductility in the metal films con-tributes the peel adhesion strength by increasing the amount of deformation in metal strips.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.104-104
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.05a
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• pp.24-24
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• 1996