• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.58 no.8
• /
• pp.1559-1565
• /
• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• Applied Chemistry for Engineering
• /
• v.21 no.5
• /
• pp.527-531
• /
• 2010

The optimized sheet for EMI shielding was prepared by metal power with Fe series. Then various metal powders were deposited on the sheet by PVD method. Moreover, the PVdF nanofiber membrane was used to compare the characteristic of EMI shielding efficiency of various metal powders. The electrical property was measured by the 4-point probe method. The result from EDS confirmed that the metal powder existed on the sheet. EMI shielding efficiency was analysed by EMI shielding measurement apparatus. The lowest electrical resistance, $641.95{\Omega}{wcdot}cm$, was obtained with $1000\;{\AA}$ deposition of Cu on the sheet. It was revealed that the EMI shielding efficiency increased with increase of the metal deposition thickness. The sheet deposited by Cu with $1000\;{\AA}$ showed the highest EMI shielding efficiency, 32.5 dB.

• Composites Research
• /
• v.33 no.4
• /
• pp.191-197
• /
• 2020

In this study, a hybrid metals such as copper (Cu) and nickel (Ni) coated carbon fibers (Ni-Cu/CFs) was prepared by wet laid method to develop a randomly oriented sheet material for high-efficiency electromagnetic interference shielding with the enhanced durability. The prepared sheet materials show a high electromagnetic interference shielding efficiency of 69.4 to 93.0 dB. In addition, the hybrid metals coated Ni-Cu/CFs sheets showed very high durability with harsh chemical/thermal environments due to the effective corrosive and mechanical resistances of Ni surface. In this context, the Ni-Cu/CF sheet possesses longer service life than the Cu/CF sheet, that is, 1.7 times longer.

• Transactions on Electrical and Electronic Materials
• /
• v.13 no.4
• /
• pp.185-187
• /
• 2012

Ga doped ZnO (GZO)/copper (Cu) bi-layered film was deposited on glass substrate by RF and DC magnetron sputtering and then the effect of the Cu bottom layer on the optical, electrical and structural properties of GZO films were considered. As-deposited 100 nm thick GZO films had an optical transmittance of 82% in the visible wavelength region and a sheet resistance of 4139 ${\Omega}/{\Box}$, while the GZO/Cu film had optical and electrical properties that were influenced by the Cu bottom layer. GZO films with 5 nm thick Cu film show the lower sheet resistance of 268 ${\Omega}/{\Box}$ and an optical transmittance of 65% due to increased optical absorption by the Cu metallic bottom layer. Based on the figure of merit, it can be concluded that the thin Cu bottom layer effectively increases the performance of GZO films as a transparent and conducting electrode without intentional substrate heating or a post deposition annealing process.

• Journal of the Korean institute of surface engineering
• /
• v.22 no.2
• /
• pp.47-54
• /
• 1989

The effects of intermetallic compound growt on the sheet resistance and soldreability as functions of the aging time, the temperature, and the conditions of substrates have been investi-gated in the electroplallic compound (mainy Cu6Sn5and Ni3Sn4) and the number of phase interface increased, the sheet resistance increased. Spread tests showed that the solderability was dereased with the intermetallic compounds growth and increased with the thickness of electroplated Sn. The surface morphology or agin size of the compound layer singificantly affect the solderability. The solderability of Sn/Ni system was superiot to Sn/Ni system was sperior to that of Sn/Cu system and the intermetallic compounds growth was solwer in the former system.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.19 no.2
• /
• pp.282-287
• /
• 2010

This paper gives a description of an experimental study of the ultrasonic welding of metals. In ultrasonic metal welding, high frequency vibrations are combined with pressure to join two materials together quickly and securely, without producing significant amount of heat. Ultrasonic metal welder consists of Transducer, Booster, and horn that are designed very accurately to get the natural frequencies and vibration mode. In this study, The horn was designed and analyzed the natural frequency by the modal analysis and harmonic analysis. And using a fiber optic sensor, we measured the amplitude and analyzed the Fast Fourier Transformed result. Using the horn, Ultrasonic metal welding between Cu sheet and Cu sheet of 0.1mm thickness was accomplished under the optimal conditions of static pressure 0.15MPa, vibration amplitude 30% and welding time of 0.28s. This result can be used for ultrasonic metal welding in manufacturing industry.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.11 no.2
• /
• pp.66-72
• /
• 2012

Ultrasonic metal welder is consisted of power supply, transducer, booster, and horn. Precise designing is required since each part's shape, length and mass can affect driving frequency and vibration mode. This paper gives a description of an experimental study of the ultrasonic welding of metals. A horn suitable for 40,000Hz was attached to the ultrasonic metal welder in order to weld Cu sheet. The Cu sheet welding was done with different amplitude, pressure and welding time, and its maximum tension was measured. Maximum tension of 177.99N was obtained when the pressure was 2.5bar, amplitude was 80%, and welding time was 0.34sec. Therefore, excessive welding condition negatively influences maximum tension measurement result.

• Journal of the Korean Ceramic Society
• /
• v.32 no.5
• /
• pp.601-607
• /
• 1995

The bond strength between the low-firing-substrate and Cu conductor depended on the softening point and the amount of frit added to the metal paste. The addition of 3 wt% frit (softening point: 68$0^{\circ}C$) to the metal paste resulted in the improvement of bond strength, which was approximately 3 times higher (3kg/$\textrm{mm}^2$) than that of non frit condition. It was also found that fracture surface shifted to the ceramic substrate in the interface region. These phenomena were attributed to the frit migration into the metal-ceramic interface. It was thought that the migration of glass frit occurred extensively when the softening point of glass firt was 68$0^{\circ}C$. The sheet resistance of Cu conductor remained constant by the addition of 4 wt% frit regardless of softening point of frit. For all samples with more than 4 wt% frit, the sheet resistance increased abruptly.

• Journal of the Korean Society for Heat Treatment
• /
• v.17 no.5
• /
• pp.293-298
• /
• 2004

For the application of heat sink device, the green sheets of powder of W-XCu and Mo-XCu composites were fabricated by tape casting technique. The mixing ratio of powder and binder was 6:4. The green sheet was shrinked up to 10~20% after sintering and the maximum relative density was above 95%. Thermal conductivity and Thermal expansion systematically increased with increasing Cu contents. The maximum thermal conductivity of W-20wt.%Cu was about 206[W/mK].

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.3
• /
• pp.45-50
• /
• 1999

Copper has been widely used for the electronic parts, and especially spot welded one for the leads of condenser or resistor. However, copper is generally hard to be spot welded because of its low electrical resistivity. For this experiment, Sn-37%Pb solder which has relatively higher resistivity was coated on the Cu-sheet to improve the spot weldability of copper. As the experimental variables welding pressure was varied from 100 to 200kgf, welding time from 20 to 50ms, and welding current from 100 to 2500A. Experimental results showed that the solder coated Cu-sheet can be spot welded under the conditions of 400~2200A welding current, 100~200kgf pressure and 20-50ms welding time. The tensile shear strength of the spot welded joint increased with welding current up to the critical current, and after the critical value decreased with current.