• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.18 no.5
• /
• pp.449-454
• /
• 2009

This paper presents an experimental study on the failure characteristics of SnAgCu lead-free solder balls. To estimate the effect of Ag, three types of SnAgCu balls are first prepared by varying the weight percent of Ag(1.0, 3.0, 4.0 wt%) and then analyzed by reliability tests such as thermal shock, high speed ball shear, and drop tests. Thermal shock test reveals that the higher the weight percent of Ag is, the longer the fatigue lift becomes. To the contrary, high speed ball-shear test and drop test show that the shear strength and the fracture toughness of solder balls are inversely proportional to the weight percent of Ag, respectively, Reasons for these observations will be further investigated In the future work.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.24 no.8
• /
• pp.636-640
• /
• 2011

The lead-free $0.98(Na_{0.5},K_{0.5})NbO_3-0.02Ba(Zr_{0.52},Ti_{0.48})O_3$-(hereafter NKN-BZT) CuO, ZnO-doped ceramics were prepared using a conventional mixed oxide method. NKN-BZT ceramics doped CuO, ZnO have superior structural and electrical properties than pure NKN-BZT ceramics. For the NKN-BZT-ZnO ceramics sintered at $1,120^{\circ}C$, piezoelectric constant ($d_{33}$) of sample showed the optimum values of 172 pC/N. The $0.98(Na_{0.5},K_{0.5})NbO_3-0.02Ba(Zr_{0.52},Ti_{0.48})O_3$-ZnO ceramics are a promising candidate for lead-free piezoelectric materials.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.24 no.8
• /
• pp.632-635
• /
• 2011

Additions (ZnO, CuO) doped $0.98(Na_{0.5}K_{0.5})NbO_3-0.02Li(Sb_{0.17}Ta_{0.83})O_3$ (0.98NKN-0.02LST-x) lead free piezoelectric ceramics have been fabricated by ordinary sintering technique. The effects of additions doping on the dielectric, piezoelectric, and ferroelectric properties of the ceramics were mainly investigated. X-ray diffraction of the sample appeared orthorhombic phase. The specimen doped with additions exhibits enhanced electrical properties ($d_{33}$= 153 pC/N). These results indicate that the 0.98NKN-0.02LST-x ceramics is a promising candidate for lead-free piezoelectric ceramics for applications such as piezoelectric actuators, harmonic oscillator and so on.

• Journal of Korea Trade
• /
• v.23 no.3
• /
• pp.84-104
• /
• 2019

Purpose - This paper explains why free trade agreements (FTAs) are more popular than customs unions (CUs) in respect of tariff coordination. Design/methodology - This paper employs an equilibrium theory of trade agreements with tariff coordination. I set up three-country partial equilibrium model with competing exporters. Domestic and exporting firms decide their optimal production under given tariffs and each country levies its tariff under the trade agreements. I found stability of implicit tariff coordination and preference of each country between an FTA and a CU. Findings - I demonstrate that two FTA members can keep their external tariffs higher than separately decided external tariffs by keeping the status-quo. This implicit tariff coordination can benefit each member through trade diversion. In a CU, each member country must have a common optimal external tariff and it must incur costs because each country may seek different external tariffs for their own national welfare. The benefit of implicit coordination in an FTA and the cost of explicit coordination in a CU account for the popularity of the FTA. Originality/value - This paper uses the idea of implicit tariff coordination in trade agreements. In a CU, tariff coordination is explicit and mandatory. All member countries must have a single common external tariff for each good. On the other hand, in an FTA, each country establishes its external tariff with the goal of maximizing its own welfare. However, each country can also coordinate "implicitly" by keeping the status-quo after establishing an FTA.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2005.05a
• /
• pp.138-138
• /
• 2005

• Journal of the Korean institute of surface engineering
• /
• v.42 no.5
• /
• pp.232-239
• /
• 2009

This study presented the effect of membrane thickness on hydrogen permeability. Microvoids on the surface of the membrane should not exist for the exact values of hydrogen permeability. Pd-Cu-Ni hydrogen alloy membranes were fabricated by Ni powder sintering, substrate plasma pretreatment, sputtering and Cu reflow process. And this leaded to void-free surface and dense film of Pd-Cu-Ni hydrogen alloy membrane. Hydrogen permeation test showed that hydrogen permeability increased from 2.7 to $15.2ml/cm^2{\cdot}min{\cdot}atm^{0.5}$ as membrane thickness decreased from 12 to $4{\mu}m$. This represented the similar trend as a hydrogen permeability of pure palladium membrane based on solution-diffusion mechanism.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.3
• /
• pp.13-19
• /
• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.2
• /
• pp.27-31
• /
• 2009

Sn whiskers can grow from the pure Sn and high Sn-based finish and cause the electrical shorts and failures. Even with the wealth of information on whiskers, we have neither the clear understanding of whisker growth nor methods for its prevention. In this study, the whisker grain roots which connected with intermetallic layer were analyzed by high-resolution transmission electron microscopy (HR-TEM). In the Sn-Cu plated leadframe (LF) that was stored at ambient condition for 540 days, filament-shaped whiskers were grown on the Sn-plated surface and ${\eta}'-Cu_6Sn_5$ precipitates were widely distributed along the grain boundaries at the Sn matrix. The measured of the lattice fringes at the ${\eta}'-Cu_6Sn_5$ was $4.71{\AA}$ at the coarse grain and $2.91{\AA}$ at the fine grain. The $Cu_3Sn$ which generates the tensile stresses was not observed. The formation of $Cu_6Sn_5$ precipitates and intermetallic layer were strongly related to whisker growth, but, the whisker growth tendency does not closely relate with the geometric morphology of irregularly grown intermetallic compound (lMC).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.27 no.10
• /
• pp.630-634
• /
• 2014

$(Na_{0.525}K_{0.4425}Li_{0.0375})(Nb_{0.9975}Sb_{0.065}Ta_{0.0375})O_3+0.3 wt%CoO$ ceramics were fabricated as a function of CuO addition by traditional solid state sintering process in order to develop excellent lead-free piezoelectric ceramics composition. The addition of CuO in the LNKNTS composition ceramics can effectively enhance the densification of the ceramics, resulting in the oxygen vacancies as hardening effect. The excellent piezoelectric properties of electromechanical coupling factor($k{\small}_P$) of 0.378, piezoelectric constant($d_{33}$) of 152 pC/N were obtained from the 1.0 mol% CuO doped LNKNTS ceramics sintered at $1,020^{\circ}C$ for 3 h.

• Journal of Korean Society of Environmental Engineers
• /
• v.22 no.10
• /
• pp.1809-1816
• /
• 2000

The catalytic combustion of methanol as a model volatile organic compound(VOC) was been investigated over metal-phthalocyanine(PC) in a fixed bed flow reactor system. The catalytic activity of Co-PC pretreated with air and methanol mixture at $450^{\circ}C$ and 60 cc/min for 1 hr was very excellent. The order of catalytic activity on methanol combustion was summarized as follows: metal free-PC < Zn-PC < Fe-PC < Cu($\alpha$)-PC < Co-PC. By TG/DTA analysis, the tendency of thermal decomposition was increased as follows: metal free-PC < Zn-PC < Cu($\alpha$)-PC < Co-PC < Fe-PC. Under this pretreatment condition, the basic structures of Co-PC, Cu($\alpha$)-PC and Fe-PC were destroyed, and the new metal oxide such as $Co_3O_4$ from Co-PC was confirmed by EA and XRD analysis. But Zn-PC and metal free-PC were retained its basic structure under this pretreatment condition. On the combustion of methanol over Co-PC, HCHO and $HCOOCH_3$ were observed as an intermediate products in the high concentration of reactant or the short contact time(W/F).