• Journal of Powder Materials
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• v.5 no.4
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• pp.258-264
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• 1998

The initial sintering behaviour of the powder injection molded (PIMed) W-l5wt%Cu nanocomposite powder was investigated. The W-Cu nanocomposite powder was produced by the mechanochemical process consisting of high energy ball-milling and hydrogen reduction of W blue powder-CuO mixture. Solid state sintering of the powder compacts was conducted at $1050^{\circ}C$ for 2~10 hours in hydrogen at mosphere. The sintering behaviour was examined and discussed in terms of microstructural developments such as W-Cu aggregate formation, pore size distribution and W grain growth. The volume shrinkage of PIM specimen was slightly larger than that of PM(conventional PM specimen), being due to fast local densification in the PIM. Remarkable decrease of carbon and oxygen in the PIM enhanced local densification in the early stage of solid state sintering process with eliminating very fine pores less than 10 nm. In addition, such local densiflcation in the PIM is presumably responsible for mitigating of W-grain growth in the initial stage.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2002.11a
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• pp.34-35
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.26.2-26.2
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• 2010

최근에는 차세대 조명용 후보광원인 고출력 백색 LED를 개발하기 위한 경쟁이 치열하며, 이를 위해 업체가 고심하고 있는 가장 큰 문제 중의 하나가 칩에서 발생하는 열을 어떻게 관리하는가 하는 방열의 문제이다. 따라서, LED의 가장 큰 특징인 장수명을 손해보지 않기 위해서는 칩에서 발생되고 있는 열을 외부에 확산시키기 위한 기술 개발이 필수적이다. 다양한 방열소재 중 W-Cu 복합재는 W의 낮은 열팽창계수와 Cu의 높은 열전도도로 인해 방열소재로써 유망한 소재로 주목받고 있으나, 우수한 열적 특성을 발현하기 위해서는 고치밀화를 갖는 W-Cu 복합재 제조가 우선적으로 필요하다. W-Cu 복합체는 일반적으로 액상소결법을 통해 균일한 미세조직을 얻을 수 있으나, 열팽창계수를 낮추기 위해 Cu 함량이 적어지게 되면 치밀화가 어려우며 이를 해결하기 위해 나노입자를 갖는 분말을 이용하고자 하는 연구가 많이 진행되고 있다. 본 연구에서는 W과 Cu 산화물을 이용하는 것이 구성성분끼리의 편석이 발생하지 않으며, 소결성도 우수하여 양산화에 가장 접근한 방법으로 알려져 있다. 그러나, 지금까지의 얻어진 W-Cu 복합체의 경우, 분말상태에서의 얻어진 나노입자가 승온시에 마이크로 크기로 과도한 입자성장이 일어나기 때문에 소결 후에도 나노크기를 유지하기 어려울 뿐만 아니라, 구성상끼리의 응집체가 형성된다. 본 연구에서는 액상소결후에 W 입자가 Cu 기지내에 균일하게 분산되는 동시에 나노크기의 입자를 가지는 고분산 W-Cu 소결체를 얻고자 하였다. 이를 위해 금속산화물 분말의 분쇄를 위해 효과적인 방법으로 알려진 습식상태에서의 고에너지 볼밀링을 통하여 혼합된 텅스텐과 구리 산화물 분말의 수소환원공정을 통해 얻어진 100nm 이하의 입자를 가지는 W-20wt%Cu 나노복합분말을 출발분말로 사용하였다. W-20wt%Cu 나노복합분말의 성형체를 $1050^{\circ}C-1250^{\circ}C$의 온도범위에서 소결거동을 조사하였다. 그 결과, $1100^{\circ}C$ 온도에서 이론밀도에 가까운 소결밀도를 나타내었으며, 이는 기존에 비해 $100^{\circ}C$ 정도 치밀화 온도를 낮추는 결과이다. 소결체의 미세구조 관찰결과, 소결 후 약 200nm의 텅스텐 입자가 Cu내에 균일하게 분산되어 있었다. 제조된 W-Cu 시편에 대해서는 LED 응용성을 조사하기 위해 열전도도와 열팽창계수 등을 평가하였다.

• Korean Journal of Materials Research
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• v.10 no.3
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• pp.227-232
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• 2000

Cu-W composites containing 20wt.% W were fabricated by hot pressing. Hot pressing was carried out at temperatures ranging from 800 to $1000^{\circ}C$ under pressures of 15MPa for 30MPa for 30min and 60min. This process gave composites of higher density, higher hardness and higher wear resistance than the conventional sintering processes. However, the microstructure of Cu-W composites under pressure of 15MPa revealed there was an inhomogeneous distribution of W, segregation of W on some area. These undesirable results are attributed to the immiscibility of W in Cu and the pressure effect on sintering.

• Journal of Powder Materials
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• v.7 no.2
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• pp.93-101
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• 2000

In order to clarify the enhanced sintering behavior of nanostructured(NS) W-Cu powder prepared by mechaincal alloying, the sintering behavior during heating stage was analysed by a dilatometry with various heating rates. The sintering of NS W-Cu powders was characterized by the densification of two stages, having two peaks in shrinkage rate curves. The temperature at which the first peak appear was much lower than Cu melting point, and dependent on heating rate. On the basis of the shrinkage rate curves and the microstructural observation, the coupling effect of nanocrystalline W-grain growth and the liquid-like behavior of Cu phase was suggested as a possible mechanism for the enhanced sintering of NS W-Cu powder in the state.

• Journal of Powder Materials
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• v.1 no.2
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• pp.174-180
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• 1994

Electrical contact property of the W-20wt%Cu contact materials manufactured by liquid phase sintering of nanocomposite W-Cu powders was investigated and discussed in terms of microstructural development during performance test. Nanocomposite powders were prepared by hydrogen reduction of ball milled W-Cu oxide mixture. They underwent complete densification and microstructural homogenization during liquid phase sintering. As a consequence, the W-Cu contacts produced from nanocomposite powders showed superior contact property of lower arc erosion and stable contact resistance. This might be mostly due to the fact that the arc erosion by evaporation of Cu liquid droplets and surface cracking remarkably became weakened. It is concluded that the improvement of anti-arc erosion of the composite specimen is basically attributed to microstructural homogeneity.

• Journal of the Korean institute of surface engineering
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• v.16 no.2
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• pp.41-47
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• 1983

An investigation has been performed on the effects of temperature and Ni addition on the wetting behaviour of Cu on W substrate in hydrogen atmosphere. An sessile drop method was used to measure a wetting angle. The concentration profiles of W, Cu and Ni elements in W/Cu - 5 Ni specimen were made by EPMA. With increasing temperature, the wetting angle of Cu droplet on W plate decreases and the time to reach an equilibrium wetting angle is shortened in hydrogen atmosphere. The addition of Ni improves appreciably the wettability of Cu on W. With increasing Ni content in Cu liquid droplet(0, 1, 3, 5%), the wetting angle is decreased from 21$^{\circ}$to 0$^{\circ}$.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.345-349
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• 2005

Low resistive ($300{\mu}{\Omega}$-cm) W-C-N films have been deposited on tetraethylorthosilicate (TEOS) interlayer dielectric by atomic layer deposition (ALD) with $WF_6-N_2-CH_4$ gas. The exposure cycles of $N_2$ and $CH_4$ are synchronized with pulse plasma. The W-C-N films on TEOS layer follow the ALD mechanism and keep constant deposition rate of 0.2 nm/cycle from 10 to 100 cycles. As a diffusion barrier for Cu interconnection the W-C-N films maintain amorphous phase and Cu inter-diffusion is not occurred even at $800^{\circ}C$ for 30 min.

• Journal of the Korean Vacuum Society
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• v.18 no.3
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• pp.203-207
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• 2009

Copper is known as a replacement for aluminum wire which is used for semiconductor. Because specific resistance of Cu ($1.67{\mu}{\Omega}$-cm) is lower than that of Al ($2.66{\mu}{\Omega}$-cm), Cu reduce RC delay time. Although melting point of Cu($1085^{\circ}C$) is higher than melting point of Al, Cu have characteristic to easily react with Silicon(Si) in low temperature, and it isn't good at adhesive strength with Si. For above these reason, research of diffusion barrier to prevent reaction between Cu and Si and to raise adhesive strength is steadily advanced. Our study group have researched on W-C-N (tungsten-carbon-nitrogen) Diffusion barrier for preventing diffusion of Cu through semiconductor. By recent studies, It's reported that W-C-N diffusion barrier can even precent Cu and Si diffusing effectively at high temperature. In this treatise, we vaporized different proportion of N into diffusion barrier to research Cu's Electromigration based on the results and studied surface hardness in the heat process using nano scale indentation system. We gain that diffusion barrier containing nitrogen is more stable for Cu's electromigration and has stronger surface hardness in heat treatment process.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2001.11a
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• pp.46-46
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• 2001

The microstructure of the 1020 mild steel target in the region ahead of craters, made by colliding against Cu and W-Cu shaped-charge jets. has been investigated in the present work. The region ahead of the crater impacted by the Cu shaped-charge jet reveals grain refinement implying the formation of sub-grains, while that of W-Cu one leads to martensitic transformation indicating that the region was heated up to an austenitic region which was followed by rapid cooling. The pressure of W-Cu shaped-charge jet impacting against the target when calculated is higher than that of Cu one. The microhardness of the region ahead of the crater impacted by the W-Cu shaped-charge jet is also higher than that of the Cu one. The microstructure of W-Cu slug that remains inside of the crater depicts the occurrence of the remarkable elongation of W particles during the liner collapse. The microstructural evolution of the region ahead of the crater is discussed on the basis of the pressure dependency of the ferrite/austenite transformation in the steel.