• Journal of Welding and Joining
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• 제34권1호
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• pp.26-34
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• 2016

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature ($>230^{\circ}C$) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was $1.9kg/mm^2$. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.

• 보존과학회지
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• 제26권2호
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• pp.143-148
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• 2010

본 연구에서는 경주 봉길리에서 출토된 청동검 한 점의 미세조직과 화학성분을 분석하였다. 그 결과 이 동검에는 납이 포함되지 않은 주석함량 10%의 청동합금이 사용되었으며 제작과정에 두드림 공정이 적용된 것으로 밝혀졌다. 지금까지 보고된 한반도 출토 동검의 절대다수가 납 청동을 주조하여 제작된 것임을 고려할 때 무연청동에 두드림 공정을 적용하였다는 점에서 본 동검은 다른 것들과 구별된다. 이 동검은 고고학적 가치가 큰 희귀한 자료로서 고대 경주지방에 독특한 청동기 기술을 구사하는 집단의 존재 가능성을 시사한다.

• 대한화학회지
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• 제15권2호
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• pp.49-54
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• 1971

It is shown that the impurities of Cu(II), Pb(II), Zn(II) and Ag(I) in Bismuth metal and the components of Pb(II), Zn(II) and Sn(IV) in Bismuth alloy are separated into their components from each other by elutions through $3.14cm^2{\times}10cm$ cation exchange resin, $Dowex\;50w\;{\times}\;8$ (100~200 mesh), column with the mixed solutions of HAc and NaAc as the eluents. The elution curve of Fe(III) has a long tailing and is not separated quantitatively from Bi(III). The eluents used for this separation are as follows; 1M HAc + 0.1M NaAc (pH 3.36) for Fe(III) and Bi (III). 0.3M HAc + 0.3M NaAc (pH 4.70) for Cu(II), Pb(II) and Zn(II). 0.5M HAc + 0.5M NaAc (pH4.70) for Ag(I) and Sn(IV). The analysis of cations eluted are carried out by spectrophotometry and EDTA titrimetry. Their recoveries are more than 99%.

• 한국표면공학회지
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• 제18권3호
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• pp.105-115
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• 1985

Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of ${\pm}2{\mu}m$ by using the slot width of 22mm. The surface morphology examination also shows the important role of concentration polarization of the micro-uniformity of overlay. The micro-uniformity has improved at the low concentration polarization which resulted from operating at the low current density and high fluoboric acid concentration. The surface morphology of deposits exhibits the vivid pyramid crystalline in the plating condition of low concentration polarizatio and all deposits have columnar structure parallel to the applied electric field regardless of the electroplating condition used.

• 보존과학회지
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• 제36권4호
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• pp.296-305
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• 2020

Konbaung Dynasty was the last unified dynasty that ruled Myanmar from 18^th to 19^th century. During this time Buddhist art flourished in Myanmar due to the interest of the rulers toward their traditional culture. Metal decorative artifacts in the 18^th century are classified into structures and Buddha statues. They are further subdivided into gilt-bronze and bronze objects, depending on their material component. Three-dimensional gilt-bronze decorative artifacts were cast with a brass alloy of Cu-Zn-Sn-Pb and their surfaces were gilded with extremely thin gold leaves (less than 1 ㎛ in thickness). The gilded layer approximately comprised 10 wt% silver in addition to the main element, gold. The lack of Hg in the gilded layer, indicated that the amalgam gilding technique was not applied. The analysis results indicated that the lacquered gilding technique was applied to the objects. Bronze decorative artifacts without gilding were cast with materials containing Cu-Sn-Pb. The bronze pavilions and bronze Buddha staues were crafted using the same alloy of high-tin bronze, which approximately contained 20 wt% Sn. No heat treatment was applied to reduce the brittleness of the objects after they were cast with a large amount of Sn. The most significant difference between the gilt-bronze and bronze decorative artifacts lie in their elemental compositions. The gilt-bronze decorative artifacts with their gilded surface were manufactured using brass containing zinc, while the unplated bronze decorative artifacts were composed of bronze containing tin. Artifacts of the same type and size are classified differently depending on the materials utilized in the surface treatment such as gilding.

• 헤리티지:역사와 과학
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• 제53권1호
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• pp.24-33
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• 2020

출토 청동 유물에서는 매장 환경 내 공존하는 복합적인 부식 인자로 인해 다양한 형태와 색상의 부식 생성물이 관찰되며, 이러한 부식 생성물은 장기 부식의 정보뿐만 아니라 보존처리 시 중요한 자료가 될 수 있다. 따라서 청동 유물의 부식층 및 부식 생성물에 대한 과학적 분석을 실시하여 부식층 형성 과정 및 부식 생성물의 특성을 규명하고, 노출된 매장 환경의 특성 및 내부 부식 인자와의 연관성을 해석하는 연구가 필수적이다. 본 연구에서는 동일 유적에서 출토된 청동 유물을 합금비와 제작기법에 따라 분류 후, 표면·부식층·부식 생성물에 대한 종합적인 분석을 실시하여 청동 유물의 부식 메커니즘과 부식층 형성 과정, 부식 생성물의 특성에 대해 알아보고자 하였다. 분석 대상으로 선정된 총 5점의 시료는 합금비 및 제작기법 분석 결과에 따라 2개의 그룹으로 구분되는데, Cu-Sn-Pb합금으로 열처리가 진행되지 않은 Group 1은 내·외측 중 일부 또는 양측에 외부 부식층이 형성되어 있으며, 표면은 녹색 또는 청색으로 확인되었다. 소지 금속에서는 α상, α+δ상 선택 부식이 일어나는 것을 알 수 있었으며, α+δ상 선택 부식 후 빈 공간에 순도가 98% 이상인 Cu가 농축되어 있는 현상이 확인되었다. Cu-Sn합금으로 열처리가 진행된 Group 2는 외부 부식층이 형성되지 않았으며, 표면이 어두운 황색으로 관찰되었다. 또한 Group 1과는 다르게 소지 금속 내부에서 α상 선택 부식이 발생한 것을 확인하였다. 연구결과를 종합해 볼 때 동일한 유적에서 출토된 청동 유물에서도 합금비 및 제작기법에 따라 부식층 형성과정 및 부식 생성물의 형태와 색상, 금속이온 이동경로 등 여러 측면에서 차이를 나타냄을 알 수 있다. 또한 동일 유물에서도 부분적으로 서로 다른 부식 특성을 보이기도 하는데 이는 매장 환경 내 노출 환경에 따라 다른 형태의 부식이 발생할 수 있음을 뜻한다. 따라서 동일 유적에서 출토된 청동 유물이라 하더라도 합금비, 제작기법, 노출 환경에 따라 부식 특성이 다를 것이라고 판단된다. 본 연구는 특정 지역 및 유물을 대상으로 한 부식 특성의 일면을 보여주는 것이므로 향후 여러 지역에서 출토되는 청동 유물의 부식층 및 부식 생성물 특성에 대한 연구를 통해 매장 환경에 따른 부식 메커니즘에 대한 심층적인 연구가 필요할 것으로 판단된다.

• 마이크로전자및패키징학회지
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• 제21권4호
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• pp.83-89
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• 2014

Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.

• 한국표면공학회지
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• 제15권4호
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• pp.192-207
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• 1982

A study has been made of the interaction parameters of Zn other elements in dilute solutesd solution of molten cadmium alloys over the temperature range of 450 to 570$^{\circ}C$. The experi-mental measurementss were made in a touch instant cell using a fusedd Licl-KCl electrolyte. The activity of zinc in binary and ternary solutions sexhibiteds a strong positive deviation from Raoult's law. The addition of silver, indium or lead increased the activity of zinc whereas addition of copper, bismuth or tin decreased the zinc activity slightly. The results for all the metallic solutions showed a linear dependence of reciprocal of ab-solute temperature over the experimental range. The interaction parameters obtained are as follows.

• 한국표면공학회지
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• 제29권5호
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• pp.478-481
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• 1996

Disproportionation reaction is very important and interesting reaction to be applied to such surface treatment as metal, alloy, compound coating, a surface etching and so on. In gaseous system, the reaction of Al chloride is applied to Al and Al alloy coating, and the similar reaction of Ti chloride is also used for Ti, Ti alloy and Ti compound coating. As for aqueous system, this reaction is utilized to such metal coat as Sn etc. and metal etching such as Cu, Fe and so on. Also in molten salts system, this reaction has many application for surface treatment like metal, alloy and compound coatings for corrosion, wear, heat resistance and so forth. For instance, carbide film, nitride film, boride film, alloy film, quite new different film from the components of substrate material are coated in single and multiple component film system by the disproportionation reaction.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.