• Korean Journal of Poultry Science
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• v.41 no.4
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• pp.241-247
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• 2014

The objective of this experimental was to investigate the effect of dietary Cu-sulfate and Cu-soy proteinate on productive performance and small intestinal microflora. A total 1,000 Hy-Line Brown laying hens (35 weeks old) were randomly allotted to 1 of 5 dietary treatments: Control, Cu-sulfate 50, 100 (50, 100 ppm Cu supplementation as Cu-sulfate) and Cu-SP 50, 100 (50, 100 ppm Cu supplementation as Cu-soy proteinate). Each treatment was replicated 4 times with fifty birds per replication, housed in 2 birds cages. Fifty birds units were arranged according to randomized block design. Feeding trial lasted 5 weeks under 16L : 8D lighting regimen. Hen day egg production was significantly (P<0.05) higher in Cu treated groups than control. Feed intake, broken and shell-less egg production was not significantly influenced by treatment. Eggshell color, eggyolk color, haugh unit, and eggshell thickness were not significantly influenced by treatment. However, eggshell strength was significantly (P<0.05) greater in Cu treated groups than control. Concentration of copper of liver was significantly (P<0.05) greater in Cu treated groups than control. Concentration of zinc and iron of liver were not influenced by treatments. Population of Cl. perfrigens and Lactobacilli in the small intestinal content were significantly (P<0.05) influenced by treatments. Population of Cl. perfrigens decreased and that of Lactobacilli increased in the Cu supplement groups. In conclusion, dietary Cu sulfate and Cu-soy proteinate similarly improves egg production, eggshell strength, and favors intestinal microbial population of laying hens.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.43 no.2
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• pp.296-302
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• 1994

Polycrystalline CuInSeS12T thin were prepared by depositing Cu/In layer, which was sequentially sputtered varying the Cu/(Cu+In) mole ratio, on glass substrate and selenizing with selenium metal vapor in a nitrogen atmosphere. Compositional and structural, characterization was carried out by X-ray diffraction (XRD), wavelength-dispersive spectroscopy(WDS), and scanning electron microscope(SEM). Electrical characterization was carried out by the measurements of Hall effect, electrical resistivity. Large indium loss occurs in early stage of the selenization process. The selenized films which had mole ratios larger than 0.28 have chalcopyrite CuInSeS12T phase and these that had less mole ratios have sphalerite phase. The selenized films containing CuS1xTSe phase have Cu-rich CuInSeS12T phase and these that did not contain CuS1xTSe have In-rich CuInSeS12T phase. By optimizing the sputtering conditions,it is possible to fabricate CuInSeS12T thin films which have little secondary phases and an appropriate hole concentration (10S015T ~ 10S016TcmS0-3T) for solar cells.

• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.267-272
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• 2000

Electroplating Cu was deposited on Si(100) wafer after seed Cu was deposited by sputtering first. TaN was deposited as a diffusion barrier before depositing the seed Cu. Electroplating Cu thin films show highly (111)-oriented microstructure for both before and after annealing at $450^{\circ}C$ for 30min and no copper silicide was detected in the same samples, which indicates that TaN barrier layer blocks well the Cu diffusion into silicon substrate. After annealing the electroplating Cu film up to $450^{\circ}C$, the Cu film became columnar from non-columnar, its grain size became larger about two times, and also defects density of stacking faults, twins and dislocations decreased greatly. Thus the heat treatment will improve significantly electromigration property caused by the grain boundary in the Cu thin films.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.220-220
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• 2003

최근, Cu기판 위에 YBaCuO$_{7-x}$ 초전도체를 입혀 초전도 선재를 제작하려는 연구가 이루어지고 있으며 이 과정에서 CuO와 Cu$_2$O가 생성된다는 보고가 있다. CuO 및 Cu$_2$O의 생성은 초전도 선재의 전기전도적 특성 및 기계적 특성에 상당한 영향을 끼칠 수 있다. 따라서 CuO와 Cu$_2$O에 대한 연구가 필요하다고 할 수 있다. 본 연구에서는 DV-X$\alpha$ 분자궤도법을 통해 CuO와 Cu$_2$O에 대한 (Cu$_{29}$ O$_{58}$ )$^{58-}$ , (Cu$_{52}$ O$_{19}$ )$^{14+}$ 모델을 이용하여 전자상태계산을 하였다. CuO, Cu$_2$O의 valence orbital level 구조 및 DOS (Density of State)를 통해 Cu원자와 O원자간의 공유결합 세기를 측정하였으며 CuO, Cu$_2$O 서로간의 차이점을 분석하였다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.05a
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• pp.744-746
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• 2008

Organic photovoltaic effects were studied in a device structure of ITO/CuPc/Al and ITO/CuPc/$C_{60}$/BCP/Al. A thickness of CuPc layer was varied from 10 nm to 50 nm, we have obtained that the optimum CuPc layer thickness is around 40 nm from the analysis of the current density-voltage characteristics in CuPc single layer photovoltaic cell. From the thickness-dependent photovoltaic effects in CuPc/$Cu_{60}$ heterojunction devices, higher power conversion efficiency was obtained in ITO/20nm CuPc/40nm $C_{60}$/Al, which has a thickness ratio (CuPc:$C_{60}$) of 1:2 rather than 1:1 or 1:3. Light intensity on the device was measured by calibrated Si-photodiode and radiometer/photometer of International Light Inc(IL14004).

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.15-20
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• 2007

Growth kinetics of intermetallic compound (IMC) at various interface in Cu pillar bump during aging have been studied by thermal aging at 120, 150 and $165^{\circ}C$ for 300h. In result, $Cu_6Sn_5\;and\;Cu_3Sn$ were observed in the Cu pillar/SnPb interface and IMC growth followed parabolic law with increasing aging temperatures and time. Also, growth kinetics of IMC layer was faster for higher aging temperature with time. Kirkendall void formed at interface between Cu pillar and $Cu_3Sn$ as well as within the $Cu_3Sn$ layer and propagated with increasing time. $(Cu,Ni)_6Sn_5$ formed at interface between SnPb and Ni(P) after reflow and thickness change of $(Cu,Ni)_6Sn_5$ didn't observe with aging time. The apparent activation energies for growth of total $(Cu_6Sn_5+Cu_3Sn),\;Cu_6Sn_5\;and\;Cu_3Sn$ intermetallics from measurement of the IMC thickness with thermal aging temperature and time were 1.53, 1.84 and 0.81 eV, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.1-9
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• 2002

The intermetallic formation between Sn-Ag-(Cu) solders and metal pads in a real BGA package was characterized using SEM, EDS, and XRD. The intermetallic phase formed in the interface between Sn-Ag-Cu and Au/Ni/Cu pad is likely to be ternary compound of $(Cu,Ni)_6Sn_5$ from EDS analysis High concentration of Cu was observed in the solder/Ni interface. XRD analysis confirmed that $\eta -Cu_6 Sn_5$ type was intermetallic phase formed in the interface between Cu containing solders and Ni substrates and $Ni_3$Sn_4$ intermetallic was formed in the Sn-Ag solder/Ni interface. The thickness of intermetallic phase increased with the reflow times and Cu concentration in solder.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1991.10a
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• pp.3-6
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• 1991

CuInSe$_2$ films have been prepared by selenium vapor annealing of sputtered Cu/In layer. The properties of selenized CuInSe$_2$films have been studied as a function of selenization temperature for two sputtered thicknesses. A large indium loss occurs in the sputtered Cu/In layer during the selenization. The indium loss with the selenization temperature is confirmed by the increase in the amount of CuxSe phase at lower temperature and the decrease in the crystallinity of chalocpyrite CuInSe$_2$phase at higher temperature. The variations of the electrical properties in the selenized films with the selenization conditions are due primarily to the variation of hole concentration. The variation of the hole concentration can be explanined by the indium loss away the sputtered Cu/In layer.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.314.2-314.2
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• 2013

CIGS 박막의 물성은 조성에 크게 영향을 받으며, 특히 박막 내 Cu/(In+Ga) 비는 매우 중요한 변수로서 태양전지 특성에 영향을 주게 된다. Cu(In1-xGax)Se2 박막의 전하농도 및 반도체로의 성격을 가장 명확하게 결정하는 조성비는 Cu/(In+Ga) 비이다. 태양전지와 같은 소자로 작용하기 위해서는 Cu/(In+Ga) 비가 1보다 작아야 한다. 고효율의 태양전지는 Cu/(In+Ga)조성이 0.85~0.95로 slightly Cu-poor가 되어야 만들어진다. 본 연구에서는 Cu조성에 따른 CIGS 박막의 구조적, 전기적 특성과 CIGS 태양전지 효율 특성에 관하여 연구하였다. 미세구조 분석결과 Cu 조성이 증가함에 따라 큰 결정립을 가지며 결정립의 성장이 고르게 되어 접합 형성을 좋게 하는 경향을 보였다. X선 회절 분석결과, Cu 함유량 비율이 증가하면서 <112>의 우선배향성에서 <220/204>으로 변화하였다. 그러나, Cu/(In+Ga) 비율이 1이상이 첨가됨에 따라 우선배향은 다시 <112>로 변화함을 알 수 있었다. EDX 분석결과 Ga/(In+Ga) 0.31, Cu/(In+Ga) 0.86의 비율일 때, Carrier density $1.49{\times}1016$ cm-3을 나타내었다. CIGS의 태양전지의 효율 측정결과 Voc=596mV, Jsc=37.84mA/cm2, FF=72.96%로 ${\eta}$=16.47%를 달성하였다.

• Journal of Nutrition and Health
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• v.17 no.3
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• pp.185-192
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• 1984

This study was performed to investigate the effects of different levels of Cu(0,6,60 ppm ) and kinds of lipid(corn oil, sesame oil or butter) in the diet upon lipids metabolism and Cu & Fe contents in weanling rats. The results obtained were summarized as following : 1) Food consumptions, total body weight gains and F.E.R.s showed no significant differences among groups with different dietary Cu levels and the kinds of lipid. 2) Weights of liver, hind limb muscle, kidney, spleen and epididymal fat pad showed no significant differences among groups. 3) The contents of total lipids and total cholesterols in serum, hind limb muscle were significantly higher in low Cu groups than in control and high Cu groups. But the contents of total lipid in liver were significantly lower in low Cu groups than in other groups. 4) The contents of total lipid and total cholesterol in serum, liver and total lipid in muscle were significantly higher in butter groups, but the contents of total cholesterol in muscle were significantly lower in butter groups. 5) The Cu concentrations in serum, liver, muscle and feces were significantly higher in high Cu groups than in control and low Cu groups. The Fe concentrations in serum tended to be lower and those in muscle were significantly higher in low Cu groups.