• Title/Summary/Keyword: Cu-Cu Bonding

Search Result 333, Processing Time 0.026 seconds

Evaluating Nanomechanical Properties on Interface of Friction-welded TiAl and SCM440 Alloys with Cu as an Insert Metal (삽입금속 Cu를 적용한 TiAl 합금과 SCM440의 마찰용접 계면의 나노역학물성 평가)

  • Kim, Ki-Young;Oh, Myung-Hoon;Choi, In-Chul
    • Journal of the Korean Society for Heat Treatment
    • /
    • v.34 no.6
    • /
    • pp.309-314
    • /
    • 2021
  • Due to the superior corrosion resistance and mechanical properties of TiAl alloy at high temperature, it has been utilized as a turbine wheel of a turbocharger. The dissimilar metallic bonding is usually applied to combine the TiAl turbine wheel with the SCM440 structural steel which is used as a driving shaft. In this study, the TiAl and SCM440 joint were fabricated by using a friction welding technique. During bonding process, to suppress the martensitic transformation and the formation of cracks, which might reduce a strength of the joints, Cu was used as an insert metal to relieve stress. As a result, the intermetallic compounds (IMCs) layer was observed at TiAl/Cu interface while no IMC formation was formed at SCM440/Cu interface. Since understanding of the IMCs effects on the mechanical performance of welded joint is also essential for ensuring the reliability and integrity of the turbocharger system, we estimated the nanohardness of welded joint region through nanoindentation. The relation between the microstructural feature and its mechanical property is discussed in detail.

A novel low resistivity copper diffusion joint for REBa2Cu3O7-δ tapes by thermocompression bonding in air

  • Wei, Ren;Zhen, Huang;Fangliang, Dong;Yue, Wu;Zhijian, Jin
    • Progress in Superconductivity and Cryogenics
    • /
    • v.24 no.4
    • /
    • pp.16-24
    • /
    • 2022
  • Applications of REBa2Cu3O7-δ tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa2Cu3O7-δ tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 δ and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 nΩ·cm2 (resistance of 0.4 nΩ for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.

Effect of the Heat Treatment Temperature on the Brazed Microstructure of Dissimilar Ti and Cu Metals Using a Zr-Base Amorphous Filler (Zr계 비정질 삽입재를 이용한 Ti-Cu 이종 접합부의 미세조직 형성에 미치는 확산 열처리 온도의 영향)

  • Lee, Jung Gu;Lee, Jong Keuk;Lee, Min Ku;Rhee, Chang Kyu
    • Journal of the Korean Society for Heat Treatment
    • /
    • v.20 no.1
    • /
    • pp.17-21
    • /
    • 2007
  • In this study, brazing characteristics of the dissimilar Ti and Cu metals using a Zr-base amorphous filler ($Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10.0}Be_{22.5}$ in at.%) have been investigated for various bonding temperatures. In the sample brazed at $790^{\circ}C$ for 10 min., the Ti-rich phases in the joint were observed, while the Cu-rich phases were obtained in the sample brazed at $825^{\circ}C$ for 10 min.. Such a different microstructure and composition in the joints could be explained by the degree of the dissolution reaction. At $790^{\circ}C$, the reaction between the Zr-rich liquid phase and the Ti base metal was actively occurred to form Ti-rich liquid phase in the joint. As the temperature increased to $825^{\circ}C$, however, the reaction between the Ti-rich liquid phase and the Cu base metal was promoted to form the Cu-rich liquid phase in the joint finally. Such a different interface reaction is attributed to the reactivity or solubility between the Zr as a main element in the filler and the Ti and Cu as a base metal element.

Effects of cooling rate on Microstructure and Bond Strength in WC-Co/Cu/SM45C steel joint (WC-Co/Cu/SM45C강접합에 미세조직 및 접합강도에 미치는 냉각속도의 영향)

  • 정승부;양훈모
    • Journal of Welding and Joining
    • /
    • v.17 no.2
    • /
    • pp.104-111
    • /
    • 1999
  • The interfacial microstructure and bond strength were examined for WC-Co/Cu/SM45C steel join using a nickel-plated copper in vacuum at 1323K for 0.6ks∼3.6ks. After bonding, microstructure in bonding interface was observed by OM(Optical Microscopy), SEM(Scanning Electron Microscopy) and EPMA(Eelectron Probe Micro Analyzer). The oil cooling was carried out at 353K, the cooling rate in air and furnace was 22K/s and 4.4K/s. respectively. It was found that dendritic widths increased with the content of cobalt and bonding times at 1323K. As a whole, bond strength values at the same bonding condition decreased in this order: WC-13wt.%Co/SM45Csteel. WC-8wt.%Co/SM45Csteel and WC-4wt.%Co/SM45Csteel. The bond strength of WC-13wt.%Co/S45C steel joint in oil cooling was 273MPa. This value was greatly higher than those of 125MPa in furnace cooling and 93MPa in air cooling at 1323K for 0.6ks. The bond strength values were found to be closely associated with the content of cobalt in WC-Co and cooling rate.

  • PDF

THIN FILM ADHESION IN Cu/Cr/POLYIMIDE AND Cu/Cu-Cr/POLYIMIDE SYSTEMS

  • Joh, Cheol-Ho;Kim, Young-Ho;Oh, Tae-Sung;Park, Ik-Sung;Yu, Jin
    • Journal of the Korean institute of surface engineering
    • /
    • v.29 no.5
    • /
    • pp.379-385
    • /
    • 1996
  • Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

  • PDF

Synthesis of Cu Sintering Paste Using Growth of Nanofiber on Cu Microparticles Mixed with Formic Acid (포름산 혼합 나노섬유 성장 구리마이크로입자를 이용한 구리 소결 페이스트 합성)

  • Young Un Jeon;Ji Woong Chang
    • Applied Chemistry for Engineering
    • /
    • v.35 no.2
    • /
    • pp.96-99
    • /
    • 2024
  • A sintering paste for bonding copper plates was synthesized using Cu formate nanofibers on Cu microparticles, mixed with formic acid. Copper oxide nanofibers of 10 ㎛ grown at 400 ℃ on Cu microparticles on the surface were transformed into copper formate nanofibers through the mixing of formic acid. Compared to Cu bulk particles or nanoparticles, Cu formate on Cu microparticles decomposed into metallic Cu at a lower temperature of 210 ℃, facilitating the sintering of copper paste. The growth of nanofiber on Cu microparticles allowed for an increase in the reaction rate of formation to copper formate, aggregating surface area, and decomposition rate of copper formate, resulting in fast sintering.

Experimental Study on Pressure Welding of Cu and Al at Cold and Warm Temperatures (냉간 및 온간에서의 구리와 알루미늄 압접에 관한 실험적 연구)

  • 심경섭;김용일;장성동;김원술;이용신
    • Proceedings of the Korean Society for Technology of Plasticity Conference
    • /
    • 2003.10a
    • /
    • pp.225-228
    • /
    • 2003
  • This paper is concerned with pressure welding, which has been known as a main bonding mechanism for the cold and warm clad forming. Bonding characteristics of pressure welding between the copper and aluminum plates are experimentally investigated. Experiments are performed at the cold and warm temperature range with the variation of important factors such as magnitude of pressure, surface roughness of Cu and Al plates, and pressure holding time. It could be concluded that the bonding criterion might be given as a function of bonding pressure and surface roughness for the cold and warm temperature ranges.

  • PDF

Mechanical properties of porcelain fused gold alloy containing indium, tin and copper (인듐, 주석, 동 첨가에 따른 도재소부용 금합금의 기계적 특성 변화)

  • Nam, Sang-Yong;Kwak, Dong-Ju;Lee, Deok-Su
    • Journal of Technologic Dentistry
    • /
    • v.24 no.1
    • /
    • pp.65-71
    • /
    • 2002
  • This study was performed to observe the microhardness change of the surface and the bonding strength between the porcelain and alloy specimens in order to investigate the effects of appended indium, tin and copper on interfacial properties of Au-Pd-Ag alloys. The hardness of castings was measured with a micro-Vicker's hardness tester. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The microhardness of Au-Pd-Ag alloy was increased by adding indium and tin, but not increased by adding copper. The shear bonding strength of Au-Pd-Ag-Sn alloy and Au-Pd-Ag-Cu alloy showed 87MPa, 57MPa. The higher concentration of adding elements showed the higher shear bonding strength.

  • PDF

Sinter-bonding of Iron Based Compacts Containing P and Cu

  • Pieczonka, Tadeusz;Kazior, Jan
    • Proceedings of the Korean Powder Metallurgy Institute Conference
    • /
    • 2006.09a
    • /
    • pp.306-307
    • /
    • 2006
  • The sinter-bonding behavior of iron based powder mixtures was investigated. To produce the green compacts to be joined the following powders based on $H{\ddot{o}}gan{\ddot{a}}s$ AB grade NC 100.24 plain iron powder were used: NC 100.24 as delivered, PNC 30, PNC 60 and NC 100.24 + 4%Cu powder mixtures. Dimensional behaviour of all those materials during the sintering cycle was monitored by dilatometry. Simple ring shaped specimens as the outer parts and cylindrical as the inner parts were pressed. The influence of parts' composition on joining strength was established. Diffusion of alloying elements: copper and phosphorous, across the bonding surface was controlled by metallography, SEM and microanalysis.

  • PDF