• The Journal of Advanced Prosthodontics
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• 제7권1호
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• pp.56-61
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• 2015

PURPOSE. The purpose of this study was to evaluate the effects of the surface treatment and shape of the dental alloy on the composition of the prosthetic work and its metallic ion release in a corrosive medium after casting. MATERIALS AND METHODS. Orion Argos (Pd-Ag) and Orion Vesta (Pd-Cu) were used to cast two crowns and two disks. One of each was polished while the other was not. Two as-received alloys were also studied making a total of 5 specimens per alloy type. The specimens were submersed for 7 days in a lactic acid/sodium chloride solution (ISO standard 10271) and evaluated for surface structure characterization using SEM/EDAX. The solutions were quantitatively analysed for the presence of metal ions using ICP-MS and the results were statistically analysed with one-way ANOVA and a Tukey post-hoc test. RESULTS. Palladium is released from all specimens studied (range $0.06-7.08{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$), with the Pd-Cu alloy releasing the highest amounts. For both types of alloys, ion release of both disk and crown pairs were statistically different from the as-received alloy except for the Pd-Ag polished crown (P>.05). For both alloy type, disk-shaped pairs and unpolished specimens released the highest amounts of Pd ions (range $0.34-7.08{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$). Interestingly, in solutions submerged with cast alloys trace amounts of unexpected elements were measured. CONCLUSION. Shape and surface treatment influence ion release from dental alloys; polishing is a determinant factor. The release rate of cast and polished Pd alloys is between $0.06-0.69{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$, which is close to or exceeding the EU Nickel Directive 94/27/EC compensated for the molecular mass of Pd ($0.4{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$). The composition of the alloy does not represent the element release, therefore we recommend manufacturers to report element release after ISO standard corrosion tests beside the original composition.

• 자원리싸이클링
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• 제10권1호
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• pp.49-55
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• 2001

The strategy of recovering metals from scrap is in general much different from primary sources. One of the main differences between the treatment of scrap and that of primary sources lies with the fact that metals are frequently associated with other met-als to form alloys in scrap, while metals occur in primary sources as oxides or sulfides. In this paper, factors affecting the dis-solution behavior of metals from various alloy systems have been reviewed and discussed. Specific examples have been drawn from Au/Ag, Au/cu and Ag/cu systems. Results of the dissolution behavior of various metals from these alloys have been reviewed and compared to the dissolution behavior of single metal systems in various lixiviants such as acids, cyanide and ammonia. It has been observed that the presence of other metals in alloys would significantly affect the dissolution rate of the metal in question. The leaching behavior of metals from homogeneous alloys relies on the chemical interaction between atoms in the lattice of the alloys, while that from heterogeneous alloys is affected by galvanic interaction established in the solution The manner in which the dissolution of a certain metal is influenced by surrounding metals has been discussed in terms of pas-sive and noble nature of the metal in relation to the neighboring metals. The role of the standard electrochemical Potential of these metals on the selective dissolution for a given lixiviant has also been discussed.

• Tribology and Lubricants
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• 제24권1호
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• pp.27-33
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• 2008

A micro-impression creep machine was designed and developed, adopting a small punch in diameter of 150 um, displacement gage with an accuracy of sub-${\mu}m$ scale, and load-cell with an accuracy of mN scale in order to investigate creep behavior of small solder ball in diameter of less than 1 mm. Creep behavior of lead-free solder ball(Sn-3.0Ag-0.5Cu) in diameter of $760\;{\mu}m$ was investigated in the stress range of $8{\sim}60\;MPa$ and at $303\;K{\sim}393\;K$. The applied load became decreased slightly and continuously in the creep rate of $10^{-4}/s$ range during the current experiments. Also, the machine frame was so sensitive to the environmental temperature that nm scaled displacement recording was unstable according to the change in environmental temperature.

• 한국분말재료학회지
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• 제24권5호
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• pp.395-399
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• 2017

Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.

• 한국전기전자재료학회논문지
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• 제32권4호
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• pp.327-332
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• 2019

Recently, inverter control systems have attracted immense attention to increase the energy efficiency. However, such systems use repeated on/off high currents for linear operation control, instead of the prevalent step variable current control method. Hence, there arise concerns of personal and property damage, especially due to the durability, explosive characteristics, and operating speed of the fuse, which is responsible for safety and is one of the internal components using current control. Therefore, in this paper, we propose an IEC60127-4 SMD sub-miniature fuse, consisting of Ag-Cu alloys and ceramic powder for arc soothing. The IEC60127-4 SMD sub-miniature fuse has high durability and cut-off capacity, and operates safely in dangerous circumstances caused by the inverter control system.

• 보존과학회지
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• 제27권1호
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• pp.1-11
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• 2011

강화도 능내리에서 출토된 고려시대 은제유물을 대상으로 성분조성과 경도, 조직특성을 연구하고 출토된 은제유물과 비슷한 성분비로 시편을 제작하여 가공방법과 온도에 따라 변하는 미세조직의 변화를 관찰하였다. 그 결과 능내리 출토 은제유물의 소지는 Cu가 2~6% 함유된 Ag-Cu 합금으로, Cu는 적절한 경도유지 등 특정 목정을 위하여 인위적으로 합금한 것으로 판단되며, 금으로 이루어진 도금층에서는 Hg가 약 11%의 함량으로 검출되어 아말감법으로 도금한 것으로 판단된다. 또한 일부 은제유물의 표면에서 확인되는 다공질 층은 실험시편 제작을 통한 확인결과 $400^{\circ}C$이상의 열이 가해질 때 생성되는 것으로, 능내리출토 은제유물들은 $400^{\circ}C$이상의 온도에서 열간가공하거나 열처리를 실시한 것으로 추정된다. 한편, 고부조로 타출된 은제유물 1점은 다른 은제유물과 비슷한 성분조성에도 불구하고 매우 낮은 경도를 보였는데, 이는 타출기법과 관계가 있는 것으로 추정된다.

• Transactions on Electrical and Electronic Materials
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• 제1권2호
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• pp.32-37
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• 2000

Effect of alloying element additions to Ag on thermal conductivity and electrical conductivity of sheath materials for Bi-Pb-Sr-Ca-Cu-O(BSCCO) tapes has been characterized. The thermal conductivity at low temperature range (10~300K) of Ag and Ag alloys were evaluated by both direct and indirect measurement techniqueas and compared with each other, It was observed that the thermal conductivity decreases with increasing the content of alloying element such as Au, Pd and Mg. Thermal conductivity of pure Ag at 3 0K was measured to be 994.0 W(m.K) on the other hand, the corresponding values of $Ag_{0.9995}Mg_{0.0005}$, $Ag_{0.974}$, $Au_{0.025}$, $Mg_{0.001}$, $Ab_{0.973}$, $Au_{0.025}$, $Mg_{0.002}$ and $Ag_{0.92}$, $Pb_{0.06}$, $Mg_{0.02}$ were 342.6, 62.1, 59.2 and 28.9 W(m.K), respectively, indicating 3 to 30 times lower than that of pure Ag. In addition, the thermal conductivity of pure Ag measured by direct and indirect measurement techniques was 303.2 and 363.8 W(m.K) The difference in this study is considered to be within an acceptable error range compared to the reference data.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• Journal of Welding and Joining
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• 제10권3호
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• pp.63-72
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• 1992

The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

• Restorative Dentistry and Endodontics
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• 제18권2호
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• pp.431-445
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• 1993

The purpose of this study was to observe corrosion characteristics of six dental amalgams and was to analyse corrosion products electrochemically. After each amalgam alloy and Hg was triturated as the direction of the manufacturer by using mechanical amalgamator, the triturated mass was inserted into the cylinderical metal mold ($12{\times}10mm$) and was condensed with 160kg/$cm^2$ by using the hydrolic press. The specimen was removed from the mold and was stored at room temperature for 1 week, and was polished with amalgam polishing kit. The anodic and cathodic polarization curve was obtained by using cyclic voltammetric method with 3-electrode potentiostat in saline for each amalgam and Ag, Sn, Cu plate specimen at $37{\pm}0.5^{\circ}C$. The potential sweep range was -1.7V~0. 4V(vs SCE) in working electrode and scan rate was 50mV/s and the exposed surface area of each specimen to the electrolytic solution was $0.79cm^2$. The results were as follows. 1. In anodic-cathodic polarization curve of amalgam specimens, two anodic current rising areas and two cathodic current peaks were obtained at the low Cu amalgam(CF, CS) specimen and three anodic current rising areas and three cathodic current peaks were obtained at the high Cu amalgam (TY, DS, HV) specimen. 2. As this compared with the anodic and cathodic current peak potentials of Sn, Cu and Ag specimen, the first cathodic current peak I c was caused by the reduction of divalent tin salt, second cathodic current peak IIIc results from the reduction of quadravalent tin salt, and third cathodic current peak me results from the reduction of copper salt. 3. As reverse potential sweeping was done repeatedly, anodic current was decreased slightly in all amalgam specimens.