• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.481-486
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• 2010

ENIG (electroless Ni immersion gold) is one of surface finishing which has been most widely used in fine pitch SMT (surface mount technology) and BGA (ball grid array) packaging process. The reliability for package bondability is mainly affected by interfacial reaction between solder and surface finishing. Since the behavior of IMC (intermetallic compound), or the interfacial reaction between Ni and solder, affects to some product reliabilities such as solderability and bondability, understanding behavior of IMC should be important issue. Thus, we studied the properties of ENIG with P contents (9 wt% and 13 wt%), where the P contents is one of main factors in formation of IMC layer. The effect of P content was discussed using the results obtained from FE-SEM(field-emission scanning electron microscope), EPMA(electron probe micro analyzer), EDS(energy dispersive spectroscopy) and Dual-FIB(focused ion beam). Especially, we observed needle type irregular IMC layer with decreasing Ni contents under high P contents (13 wt%). Also, we found how IMC layer affects to bondability with forming continuous Kirkendall voids and thick P-rich layer.

• Fashion & Textile Research Journal
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• v.19 no.3
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• pp.337-343
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• 2017

The purpose of this study is to investigate the optimal dyeing conditions and human-friendly properties of the extract from the branches of Alnus firma tree which is widely used for forestation and to provide basic information for quantification and commercialization of natural dyeing by discovering such as dye material. The optimal dyeing conditions, as a result, were shown at 100% of dye concentration, $90^{\circ}C$ of dyeing temperature and 40 minutes of dyeing time. In terms of dye uptake depending on the mordanting methods, it showed the best result in order of Fe, Sn, Cu and Al at pre-mordanting while found strong in order of Fe, Cu, Al and Sn at post-mordanting. Color fastness to washing and dry cleaning was found strong at grade 4-5 and fastness to light was rated at 2. The grade of change in color to rubbing and perspiration was good at 4-5. In aspects of functional properties, it showed excellent results of 98% deodorization rate at 120 minutes of dyeing time, 96.1% UV protection rate and 99.9% bacterial reduction against Staphylococcus aureus and Klebsiella pneuminiae. It is considered, therefore, the extract from Alnus firma tree is of great value as an eco-friendly natural dyestuff.

• Journal of Conservation Science
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• v.35 no.5
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• pp.392-402
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• 2019

This study interpreted the characteristics of the site and provenance of raw material by performing material characteristics analysis of the slags and tuyeres excavated from the Sinpung site in Wanju, Jeollabuk-do. The major chemical compositions suggested that the slags and tuyeres were created when Cu-Sn-Pb was alloyed. Metal microscope and scanning electron microscopy-energy dispersive spectrometer analyses revealed that the slags and tuyeres were by-products formed in the alloying process. This alloy, created by adding galena to copper and tin ingots, was an intermediary material used in making the finished products. According to the lead isotope ratio analysis result, slags could be made using galena of the southern Zone III region of Korea. Based on the decomposition of mica group minerals and the formation of mullite detected through X-ray diffraction analysis, it is possible to conclude that the tuyeres operated at approximately 1,000℃ as, the mullite was detected on the outside of the tuyeres.

• Journal of Conservation Science
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• v.32 no.1
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• pp.11-19
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• 2016

Seungja Chongtong is a small korean tubular arm that made by particular arm-making way imitating a chinese arm. This study organizes scientific analysis results with results of inscriptions reading of Seungja Chongtong in the Central museum of Kyunghee University. Three of Seungja Chongtongs are made with Cu-Sn-Pb ternary alloy which is not much differ in contents and the results of microstructure analysis of Seungja Chongtong 1 which could investigate a microstructure among the Chongtongs were found out that Seungja Chongtong is made by general casting, with no evidences of an additional heat-treatment and tempering. Furthermore, in results of lead isotope ratio analysis to find out a source of lead using during the production of Seungja Chongtong, It seems that Seungja Chongtong is made with a lead ore from northern Gyeongsangbuk-do Province and southern Gangwon-do Province called Korea southern zone 2 area.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.6
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• pp.1782-1786
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• 2008

To investigate the characteristics of elemental components of atmospheric particles in Cheonan, atmospheric particles were sampled using a high volume air sampler equipped with a 5-stage cascade impactor during 2006. 16 elemental concentrations in fine and coarse particles were determined using ICP-AES and ICP-MS. The total mass concentrations of fine and coarse particles were 33.23 and $20.66{\mu}g/m3$, respectively, and the total elemental concentrations were 1.27, $1.71{\mu}g/m3$, occupying 3.8 and 8.3% of the total mass. Fe, Al, Ti were the most abundant elements in both fine and coarse particles, and the total Pb concentration was 84.55ng/m3, below the National standard. Enrichment factor for Sc, Cr, Cu, Zn, As, Se, Sn, Pb in fine particles were above 1,000. This indicates that the elements in fine particles are mainly from the anthropogenic sources including automobiles.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1035-1040
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• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• Korean Journal of Heritage: History & Science
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• v.49 no.3
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• pp.4-11
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• 2016

This study compares eight bronze spoons in the Goryeo Dynasty and analyzes their components and lead isotopes in order to confirm the relationship between their production sites and excavation sites. Most of the excavated spoons have elliptical heads, and their handles are categorized into two types. Bronze spoons are made of binary Cu-Sn alloys, but Pb is not added. The same artifacts can have different trace elements depending on location, and the spoons had high Ag content. According to an analysis of their lead isotopic ratio, they were made with raw materials produced in Zone 3 of the South Korean galena map. If the data of the trace elements in the raw ores of the bronze is accumulated, it can be used to indicate the provenance of the artifacts.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.155-161
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• 2018

A Si chip with the Cu/Au bumps of $100-{\mu}m$ diameter was flip-chip bonded using different anisotropic conductive adhesives (ACAs) onto the local stiffness-variant stretchable substrate consisting of polydimethylsiloxane (PDMS) and flexible printed circuit board (FPCB). The average contact resistances of the flip-chip joints processed with ACAs containing different conductive particles were evaluated and compared. The specimen, which was flip-chip bonded using the ACA with Au-coated polymer balls as conductive particles, exhibited a contact resistance of $43.2m{\Omega}$. The contact resistance of the Si chip, which was flip-chip processed with the ACA containing SnBi solder particles, was measured as $36.2m{\Omega}$, On the contrary, an electric open occurred for the sample bonded using the ACA with Ni particles, which was attributed to the formation of flip-chip joints without any entrapped Ni particles because of the least amount of Ni particles in the ACA.

• Journal of the Korea Convergence Society
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• v.13 no.3
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• pp.197-202
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• 2022

The CZTS solar cell is a thin film solar cell using an absorption layer composed of Cu, Zn, Sn, Se, and S, and is cheaper than a CIGS solar cell using In and Ga and more eco-friendly than a perovskite and CdTe solar cell using Pb and Cd. In this study, we conducted a bending test for flexible CZTS solar cells. Experiments were conducted in the direction of inner benidng with compressive stress and outer bending with tensile stress, and during the number of bending 1,000 times with a radius of curvature of 50 mmR, the efficiency of the solar cell decreased by up to 12.7%, and the biggest cause of efficiency reduction in both directions was a large decrease in parallel resistance.