• Korean Journal of Metals and Materials
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• v.46 no.5
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• pp.310-314
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• 2008

Electromigration test of flip chip solder bump is performed at $140^{\circ}C$ C and $4.6{\times}10^4A/cm^2$ conditions in order to compare electromigration with thermomigration behaviors by using electroplated Sn-3.5Ag solder bump with Cu under-bump-metallurgy. As a result of measuring resistance with stressing time, failure mechanism of solder bump was evaluated to have four steps by the fail time. Discrete steps of resistance change during electromigration test are directly compared with microstructural evolution of cross-sectioned solder bump at each step. Thermal gradient in solder bump is very high and the contribution of thermomigration to atomic flux is comparable with pure electromigration effect.

• Journal of Powder Materials
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• v.12 no.6 s.53
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• pp.406-412
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• 2005

This work is to present a new synthesis of metallic glass (MG)/metallic glass (MG) composites using gas atomization and spark plasma sintering (SPS) processes. The MG powders of $Cu_{54}Ni_6Zr_{22}Ti_{18}$ (CuA) and $Ni_{59}Zr_{15}Ti_{13}Nb_7Si_3Sn_2Al_1$(NiA) as atomized consist of fully amorphous phases and present a different thermal behavior; $T_g$ (glass transition temperature) and $T_x$ (crystallization temperature) are 716K and 765K for the Cu base powder, but 836K and 890K for the Ni base ones, respectively. SPS process was used to consolidate the mixture of each amorphous powder, being $CuA/10\%NiA\;and\;NiA/10\%CuA$ in weight. The resultant phases were Cu crystalline dispersed NiA matrix composites as well as NiA phase dispersed CuA matrix composites, depending on the SPS temperatures. Effect of the second phases embedded in the MG matrix was discussed on the micro-structure and mechanical properties.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.51-56
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• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

• Journal of the Korean Society of Safety
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• v.30 no.6
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• pp.7-11
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• 2015

The present study investigates the impact shear strength of thermal aged Sn-3Ag-0.5Cu lead-free solder joints at impact speeds ranging from 0.5 m/s to 2.5 m/s. The specimens were thermal aged for 24, 100, 250 and 1000 hours at $100^{\circ}C$. The experimental results demonstrate that the shear strength of the solder joint decreases with an increase in the load speed and aging time. The shear strength of the solder joint aged averagely decreased by 43% with an increase in the strain rate. For the as-reflowed specimens, the mode II stress intensity factor ($K_{II}$) of interfacial IMC between Sn-3.0Ag-0.5Cu and a copper substrate also was found to decrease from $1.63MPa.m^{0.5}$ to $0.97MPa.m^{0.5}$ in the speed range tested here. The degradations in the shear strength and fracture toughness of the aged solder joints are mainly caused by the growth of IMC layers at the solder/substrate interface.

• Journal of Powder Materials
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• v.24 no.5
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• pp.395-399
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• 2017

Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.

• Textile Coloration and Finishing
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• v.10 no.1
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• pp.11-19
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• 1998

For the purpose of standardization and practicability of dyeing by natural dyes, the mordanting and dyeing properties of cochineal and carminic acid were studied. Appropriate extraction, dyeing and mordanting condition of cochineal were determined, and the effect of mordanting method on dye uptake and color fastness of dyed fabric was investigated. The maximum absorbance of cochineal solution was 495nm, carminic acid was 533nm and 577nm. The color of carminic acid solution was affected by pH 6~9. The optimum temperature to extract cochineal was $80-100^\circ{C}$ and dyeing solution for 1 hour. And effective dyeing time to silk was 60min. Effective mordanting temperature was $80^\circ{C}$, and its time was 30min. In case mordants concentration, the maximum absorbance of Sn solution was 3%, K, Cu and Cr were in 1%. K/S value of dyeing fabrics was recoginazed by mordant treatment, specially Fe, Sn, Al, Cu. In the case of cochineal light fastness was increased by mordant treatment, specially Fe treatment. Perspiration fastness was good in acidic solution than in alkaline solution and perspiration fastness of cochineal was poor. Fastness of abrasion and dry-cleaning were good and these fastness improvement were generally effective for post-mordanting treatment.

• Journal of Korea Foundry Society
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• v.13 no.4
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• pp.333-341
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• 1993

The effects of alloying elements on the structure and mechanical properties of compacted/vermicular graphite cast irons containing copper, tin and molubdenum for producing pearlite matrix, and also containing phosphorus and boron for increasing wear resistance, were investigated. The Brinell hardness and ultimate tensile strength of the specimens with the range of compositions, [1.5% Cu-0.05% Sn-(0.2-0.4)% Mo-(0.2-0.6)% P-(0.035-0.070)% B], was found to fall within in the following range, depending on their composition; Brinell hardness of BHN 250-315, ultimate tensile strength of $28.1-40.3kg/mm^2$. It was also found within this experiment that CV graphite cast irons possessing higher amount of phosphide eutectic exhibit better wear resistance, but the wear resistance became deteriorate when the area fraction of phosphide eutectics exceed more than 10%. From these experimental results, it could be concluded that the CV graphite cast iron containing 1.5% Cu, 0.05% Sn, 0.4% Mo, 0.2% P and 0.035% B showed good mechanical and wear resistance properties.

• Journal of the Korean Chemical Society
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• v.15 no.2
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• pp.49-54
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• 1971

It is shown that the impurities of Cu(II), Pb(II), Zn(II) and Ag(I) in Bismuth metal and the components of Pb(II), Zn(II) and Sn(IV) in Bismuth alloy are separated into their components from each other by elutions through $3.14cm^2{\times}10cm$ cation exchange resin, $Dowex\;50w\;{\times}\;8$ (100~200 mesh), column with the mixed solutions of HAc and NaAc as the eluents. The elution curve of Fe(III) has a long tailing and is not separated quantitatively from Bi(III). The eluents used for this separation are as follows; 1M HAc + 0.1M NaAc (pH 3.36) for Fe(III) and Bi (III). 0.3M HAc + 0.3M NaAc (pH 4.70) for Cu(II), Pb(II) and Zn(II). 0.5M HAc + 0.5M NaAc (pH4.70) for Ag(I) and Sn(IV). The analysis of cations eluted are carried out by spectrophotometry and EDTA titrimetry. Their recoveries are more than 99%.

• Journal of Surface Science and Engineering
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• v.43 no.1
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• pp.41-45
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• 2010

The effect of $MoS_2$ and graphite content on wear resistance and mechanical properties of Cu/Sn bonded diamond micro blades was comparatively investigated in terms of volume and weight fraction. For the evaluation of endurance and cutting performance, instantaneous electric power consumption and cumulative wear loss during cutting glass work piece at constant velocity were measured with the micro blades of the wide range of lubricant content. The energy consumption of blades for glass cutting decreased with the content of lubricants. Wear amount of blade in volume increased with the amount of lubricant addition. It was found to be relevant to the decrease in flexural strength and hardness with the amount of lubricants. With the same amount of lubricant content in volume fraction $MoS_2$ showed superiority in mechanical properties and cutting performance than graphite while graphite could result in stronger effect on lowering electric consumption during cutting work piece for the same weight percent fraction than $MoS_2$ because of lower density.

• Progress in Superconductivity and Cryogenics
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• v.19 no.3
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• pp.18-22
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• 2017

Addition of $BaSnO_3$ (BSO) to $GdBa_2Cu_3O_{7-{\delta}}$ (GdBCO) is reported to enhance the flux pinning property of GdBCO thick films. To investigate the effect of growth condition on the pinning properties, 700 nm-thick BSO-added GdBCO films deposited with varying temperatures and growth rates were prepared by using a pulsed laser deposition method. As the deposition temperature increases, the critical current density and the pinning force density show an improved field dependence up to $750^{\circ}C$ due to the increase in the formation of the a-axis growth and the BSO nanostructures. The films deposited at higher temperatures show degraded surfaces and as a result, degraded pinning behaviors. For the change in growth rate, the critical current density and the pinning force increase as the repetition rate increase at low magnetic fields, but this behavior is reversed in high magnetic fields. These results indicate that the film growth conditions significantly affect the formation of BSO nanostructures and the pinning properties of BSO-added GdBCO films.