• Transactions of Materials Processing
• /
• v.14 no.2 s.74
• /
• pp.147-152
• /
• 2005

The objective of this study is to develop an optimal drawing die for the clad wire drawing process. Cu-clad wire, which has the advantages of the high strength of a steel core and the electro-conductivity, corrosion resistance of a copper layer, is widely being used in the field of the telecommunications, electric-electronic and military technology industries. It is important to obtain uniformly coated rate when producing clad wires. Drawing process of clad wire will be influenced on damage and coated rate of core and sleeve for process variables such as semi-die angle and reduction in area. Therefore, in this study, the finite-element result obtained in this study was analyzed to the effect of the various forming parameters, which included the semi-die angle and reduction in area. The coated rate will be predicted with observation of copper coated rate variation according to total reduction in area and the optimal pass schedule will be set up through proper reduction in area and semi-die angle variation.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2002.02a
• /
• pp.225-230
• /
• 2002

As in most metal forming processes, die and lubrication are of vital importance in hydrostatic extrusion. An efficient die design and lubrication system selection reduce the pressure required for a given reduction ratio by lowering friction at the billet-die interface. In contrast to the conventional macroscopic extrusion, fine-wire fabrication requires higher extrusion pressure and effect of friction is much more significant. Forming fine Au, Ag, and Cu wire with hydrostatic extrusion process in cold condition, the effect of extrusion die angle, lubrication and billet's initial diameter was studied.

• Applied Science and Convergence Technology
• /
• v.23 no.1
• /
• pp.14-26
• /
• 2014

Copper is an important component from coin metal to electronic wire, integrated circuit, and to lithium battery. Copper oxides, mainly including $Cu_2O$ and CuO, are important semiconductors for the wide applications in solar cell, catalysis, lithium-ion battery, and sensor. Due to their low cost, low toxicity, and easy synthesis, copper oxides have received much research interest in recent year. Herein, we review the crystallization of copper oxides by designing various chemical reaction routes, for example, the synthesis of $Cu_2O$ by reduction route, the oxidation of copper to $Cu_2O$ or CuO, the chemical transformation of $Cu_2O$ to CuO, the chemical precipitation of CuO. In the designed reaction system, ligands, pH, inorganic ions, temperature were used to control both chemical reactions and the crystallization processes, which finally determined the phases, morphologies and sizes of copper oxides. Furthermore, copper oxides with different structures as electrode materials for lithium-ion batteries were also reviewed. This review presents a simple route to study the reaction-crystallization-performance relationship of Cu-based materials, which can be extended to other inorganic oxides.

• Journal of the Korean Society for Railway
• /
• v.15 no.3
• /
• pp.224-230
• /
• 2012

The wearing slider of the rail motor car's pantograph is considerable changed by the type and the material properties. Especially, precipitation and arc influences are main factors decided to life time of wearing slider and contact wire. This study is wearing phenomenon analysis of Cu-type wearing slider with high electric conductivity and resistance arc through experiment by running train. Author observed that wearing phenomenon of Cu-type wearing slider with normal and abnormal wearing characteristics and comparatively analysis precipitation, mileage and weight influences of exchanged Cutype and Fe-type wearing sliders. In this paper result showed that necessity for the application which is the Fe-type of wearing slider had superior wear resisting capacity etc., through tribology approach.

• Proceedings of the KWS Conference
• /
• v.43
• /
• pp.46-48
• /
• 2004

• Proceedings of the KIEE Conference
• /
• 2015.07a
• /
• pp.657-658
• /
• 2015

본 논문에서는 자속집중 방식의 회전자 구조를 적용한 페라이트 영구자석 BLDC 모터의 원가절감 설계에 대하여 연구하였다. 자속집중형 회전자에 Al-wire가 적용된 신규 모터를 이용하여 Cu-wire가 사용된 표면부착형 모터와 동일 외경, 동등 이상 효율, 동등 이하 적층에서 원가절감 하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.11 no.11
• /
• pp.1022-1026
• /
• 1998

The mutifilamentary $Nb_3$Sn wire containing 135 Nb filaments was manufactured by the internal tin method. The critical current density ($J_C$) in magnetic fields for the wires heat-treated at $660^{/circ}C$ and $700^{/circ}C$ were investigated. The Non-Cu $J_C$ and n-value of 0.82 mm$\phi$ $Nb_3$Sn wire heat-treated at $700^{/circ}C$ for 240 hours was approximately 450 A/$mm^2$ at 12T, 4.2K and 14, respectively. Also the $B_{C2}$ of $Nb_3$Sn wire extrapolated by Kramer plot was 27.2T. The wire heat-treated at $700^{/circ}C$ for 240 hours showed smaller residual tin concentration in the matrix and the larger area of $Nb_3$Sn layer as comparison with the wire heat-treated at $660^{/circ}C$.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.133.2-133.2
• /
• 2016

차세대 디스플레이로 유연하고 투명한 기능들이 요구되면서 Indium Tin Oxide(ITO)를 대체하기 위한 투명전극 개발 연구가 많이 수행되고 있다. ITO는 높은 투과도와 낮은 저항으로 현재 가장 많이 활용되고 있는 투명전극 소재이지만 유연성이 떨어져 유연 터치 패널 소재로 활용하기 어렵다. 이러한 문제 해결을 위해 ITO 대체 물질로 CNT, Graphene, Metal mesh, Ag nano wire, 전도성 고분자 등의 차세대 투명 전극 소재가 대두되고 있다. 본 연구에서는 메탈 메쉬 전극 소재로 사용하기 위해 Cu 박막 증착 시 플라즈마 표면처리를 통해 밀착력 및 저항을 개선하였다. Cu 금속 박막의 양산화를 위한 공정으로 자체 제작한 Linear Ion Source(LIS)가 부착된 roll to roll 시스템을 적용하여 플라즈마 전처리 공정 및 Ni buffer layer 도입 이후 Cu 박막을 형성하였다. 그 결과 PET 기판과 Cu 박막 사이의 밀착력을 0 degree에서 5 degree까지 향상시킬 수 있었고, 플라즈마 표면처리를 시행함으로써 저항 또한 감소되는 결과를 얻을 수 있었다. 본 연구를 통해서 폴리머 기판 소재에 in-situ로 표면처리 및 Cu 금속 박막을 증착함으로써 금속 박막의 밀착력 및 전기적 특성이 향상되는 공정 기술을 개발하였다.

• Journal of the Korean Institute of Gas
• /
• v.19 no.5
• /
• pp.20-28
• /
• 2015

This work investigated the size and shape effect of ${\gamma}$-alumina-supported metal oxides on the hydrocarbon selective catalytic reduction of nitrogen oxides. Several metal oxides including Ag, Cu and Ru were used as the catalysts, and n-heptane as the reducing agent. For the Ag/${\gamma}$-alumina catalyst, the $NO_x$ reduction efficiency in the range of $250{\sim}400^{\circ}C$ increased as the size of Ag decreased (20 nm>50 nm>80 nm). The shape effect of metal oxides on the $NO_x$ reduction was examined with spherical- and wire-shape nanoparticles. Under identical condition, higher catalytic activity for $NO_x$ reduction was observed with Ag and Cu wires than with the spheres, while spherical- and wire-shape Ru exhibited similar $NO_x$ reduction efficiency to each other. Among the metal oxides examined, the best catalytic activity for $NO_x$ reduction was obtained with Ag wire, showing almost complete $NO_x$ removal at a temperature of $300^{\circ}C$. For Cu and Ru catalysts, considerable amount of NO was oxidized to $NO_2$, rather than reduced to $N_2$, leading to lower $NO_x$ reduction efficiency.

• Korean Chemical Engineering Research
• /
• v.48 no.1
• /
• pp.33-38
• /
• 2010

A microfluidic system has been developed using biomaterial for the measurement of cupric ion concentration. The cell-membrane-mimicking bilayer lipid membrane(BLM)-coated silver electrode was used for the sensing of cupric ion concentration. The silver-supported BLM could increase its stability. A silver-supported bilayer lipid membrane(s-BLM) was easily obtained using its self-assembling characteristics by immersing silver wire into lipid(phosphatidylcholine; PC) solution and then dipping into aqueous KCl solution. These s-BLMs were used to determine the relationship between $Cu^{2+}$ concentration and current crossing s-BLM. Their relationship showed high linearity and reproducibility. The calibration curve was constructed to express the relationship between $Cu^{2+}$ concentration and current in the $Cu^{2+}$ concentration range of 10 and $130{\mu}M$. This calibration curve was used to measure $Cu^{2+}$ concentration in an unknown sample. Microfluidic system with s-BLM was made of PDMS(polydimethyl siloxane) using typical soft photolithography and molding technique. This integrated system has various functions such as activation of the silver surface without cutting silver wire, coating of BLM on silver surface, injection of KCl buffer solution, injection of $Cu^{2+}$ sample and measurement of $Cu^{2+}$ concentration in the sample.