• 한국입자에어로졸학회지
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• 제6권1호
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• pp.37-46
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• 2010

Cu nano-colloid was prepared by wire electric explosion process under de-mineralized water and anhydrous ethanol. To control the properties of Cu nano-colloid, experimental conditions such as diameter of Cu wire and applied voltage were changed. The optimal Cu nano-colloid was prepared when the 0.1mm diameter of Cu wire with the applied voltage of 2000 V was used. The shape of Cu particles in colloid was spherical and the XRD result revealed that the phase of Cu particles was cubic phase. About 20nm Cu nanoparticles with high crystallinity were successfully prepared using wire explosion process under anhydrous ethanol and they showed more than 100 hours dispersion stability.

• 한국분말재료학회지
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• 제14권1호
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• pp.38-43
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• 2007

Cu-Zn alloy nano powders were fabricated by the electrical explosion of Zn-electroplated Cu wire along with commercial brass wire. The powders exploded from brass wire were composed mainly of ${\alpha},{\beta},\;and\;{\gamma}$ phases while those from electroplated wires contained additional Zn-rich phases as ${\varepsilon}$, and Zn. In case of Zn-elec-troplated Cu wire, the mixing time of the two components during explosion might not be long enough to solidify as the phases of lower Zn content. This along with the high vapor pressure of Zn appears to be the reason for the observed shift of explosion products towards the high-Zn phases in electroplated wire system.

• 한국주조공학회지
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• 제33권6호
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• pp.248-253
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• 2013

To add alloying elements into a pure copper melt, the wire-feeding efficiency of cored (alloy containing) wire was evaluated using a commercial, computational fluid-dynamics program. The model design was based on an industrial-scale production line. The variables calculated included wire feed rate, melt temperature, wire diameter, melt flow rate and wire temperature. Efficiency was evaluated after a series of calculations based on the penetration depth of the alloy-wire into the molten copper bath. Of the five variables investigated, the wire feed rate and wire diameter were the most influential factors affecting the feeding efficiency of the cored-wire.

• 소성∙가공
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• 제18권4호
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 소성∙가공
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• 제32권1호
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• pp.35-40
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• 2023

In the case of a wire with a very fine diameter during the multi-stage drawing process, the heterogeneity of the deformation in the radial direction tends to develop strongly as the amount of deformation is accumulated. It is known that the heterogeneity of deformation in the radial direction of the wire is closely related to the process parameters during the multi-stage drawing process. In this study, finite element analysis (FEA) was used to theoretically examine the effect of friction between the surface of the wire and the drawing die during the multi-stage drawing process of Cu-0.2wt%Mg alloy on the deformation heterogeneity developed in the radial direction of the wire. The distribution of effective strain, radial strain, circumferential strain, and shear strain developed in the radial direction of the wire during the multi-stage drawing process was analyzed while changing the friction coefficient, and the results were analyzed and compared for each path and position. The FEA results revealed that the shear strain developed in the radial direction of the wire during the multi-stage drawing process of Cu-0.2wt%Mg alloy showed the most non-uniform distribution and was also severely affected by the friction coefficient.

• 한국분말재료학회지
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• 제13권3호
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• pp.187-191
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• 2006

Al-Cu alloy nano powders were produced by the electrical explosion of Cu-plated Al wires. The composition and phase of the alloy could be controlled by varying the thickness of Cu deposit on Al wire. When the Cu layer was thin, Al solid solution and $CuAl_2$ were the major phases. As the Cu layer becomes thicker, Al diminished while $Al_4Cu_9$ phase prevailed instead. The average particle size of Al-Cu nano powders became slightly smaller from 63 nm to 44 nm as Cu layer becomes thicker. The oxygen content of Al-Cu powder decreased linearly with Cu content. It is well demonstrated that the electrodeposition combined with wire explosion could be simple and economical means to prepare variety of alloy and intermetallic nano powders.

• 청정기술
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• 제22권4호
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• pp.281-285
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• 2016

난분해성 1,4-다이옥산을 분해시키기 위하여 촉매습식과산화반응에 활성적인 Cu wire촉매를 사용하였다. Cu wire 촉매를 사용함으로써 1,4-다이옥산의 완전한 분해가 가능하였으나, 분해된 1,4-다이옥산은 완전 무기화($CO_2$와 $H_2O$로 전환)되지 못하고 중간생성물인 ethylene glycol diformate, oxalic acid, formic acid, formaldehyde, acetaldehyde 등으로 전환되었다. 1,4-다이옥산이 분해되어 없어짐에 따라 formaldehyde와 oxalic acid가 점진적으로 나타나기 시작하여 증가하다가 최고농도를 보인 후 다시 감소하였다. 이들 두 중간체의 최고농도 도달시점에 acetaldehyde의 농도가 급격히 증가하여 최고농도를 보인 후 다시 감소하였다. 이들 세가지 중간물질의 감소와 함께 ethylene glycol diformate, formic acid가 생성되기 시작하여 그 농도가 점진적으로 증가하였다. 이들은 연속적인 과정을 통해 생성되었다. Cu wire 촉매는 반응이 진행되는 동안 활성이 떨어지지 않고 매우 안정적이었다.

• Transactions on Electrical and Electronic Materials
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• 제15권4호
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• pp.217-220
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• 2014

We studied the plating properties of Sn-Pb solder according to the shape of the Cu wire's cross-section for photovoltaic ribbon. The thickness of the Sn-Pb layer largely decreased to 29% on a curved Cu surface, compared to a flat Cu surface. This phenomenon is caused by the geometrical decrease in the contact angle of the liquid Sn-Pb solder and an increase in the surface energy of the solid/vapor on the curved Cu surface. We suggest a new ribbon's design where the Cu wire's cross-section is a semi-ellipse. These semi-ellipse ribbons can decrease the use of Sn-Pb solder to 64% and increase the photovoltaic efficiency, by reducing the contact area between the ribbon and cell, to 84%. We also see an improvement of reflectivity in the curved surface.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 한국주조공학회지
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• 제29권5호
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• pp.198-203
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• 2009

In order to manufacture copper ultra fine wire used for bonding wire in integrated circuit package, continuous casting process, which can produce high purity copper rod with small cross section, and wiredrawing process have to be optimized to prevent wire brakeage during entire manufacturing process of fine wire. The optimum condition for producing copper rod with mirror surface has to established by investigation of the effects of several parameters such as withdrawal speed, superheat and rod diameter on grain morphology of the cast rod and on its drawing characteristics to fine wire. The purpose of this study is to propose the optimized process parameters in continuous casting process in order to produce cast rod without internal defects, and to predict microstructure orientation suitable for wire drawing process.