• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.4
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• pp.350-356
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• 2005

We report the space charge and the surface potential of the interface between metal and copper(Ⅱ)-phthalocyanine(CuPc) thin films by measuring the microwave reflection coefficients S/sub 11/ of thin films using a near-field scanning microwave microscope(NSMM). CuPc thin films were prepared on Au and Al thin films using a thermal evaporation method. Two kinds of CuPc thin films were prepared by different substrate heating conditions; one was deposited on preheated substrate at 150。C and the other was annealed after deposition. The microwave reflection coefficients S/sub 11/ of CuPc thin films were changed by the dependence on grain alignment due to heat treatment conditions and depended on thickness of CuPc thin films. Electrical conductivity of interface between metal and organic CuPc was changed by the space charge of the interface. By comparing reflection coefficient S/sub 11/ we observed the electrical conductivity changes of CuPc thin films by the changes of surface potential and space charge at the interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.526-530
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• 2004

We report the space charge and the surface potential of the interface between metal and CuPc according to isotropic property and different metal by measuring the microwave reflection coefficients $S_{11}$ of copper(II)-phthalocyanine(CuPc) thin films by using a near-field microwave microscope(NSMM) in order to understand. CuPc thin films were prepared on gold and aluminium substrates using a thermal evaporation method. Two kinds of CuPc thin films were prepared. One was deposited on preheated substrate at $150^{\circ}C$ and the other was annealed after deposition by using thermal evaporation methods. The microwave reflection coefficients $S_{11}$ of CuPc thin films were changed by the dependence on the heat treatment conditions. By comparing reflection coefficient $S_{11}$ we measured electrical conductivity of CuPc thin films and studied this results with respect to the surface potential and space charge of the interface between metal and CuPc thin films.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.55-64
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• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

• Ecology and Resilient Infrastructure
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• v.5 no.2
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• pp.82-87
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• 2018

Proliferation of algae on the surface of concrete or mortar in aquatic habitat has a negative impact on maintenance of concrete-based structures. Growth of algae may decrease stability of structure by bio-deterioration. In this study, we developed a functional mortar for restraining bio-deterioration by using $Cu^{2+}$ ion. The mortar contains soluble glass beads made of $Cu^{2+}$ ion, which can dissolve into water slowly. Mortars prepared with different ratio of glass beads (0, 2, 5, 10, and 15%) were placed in a culture medium with algae and incubated over a month period. Water chemistry, chlorophyll-a, and extracellular enzyme activities were measured. The incubation was conducted in both freshwater and seawater conditions, to assess applicability to both aquatic conditions. Overall, mortar with Cu glass exhibited lower chlorophyll-a content, suggesting that the functional mortar reduced algal growth. DOC concentration increased because debris of dead algae increased. Cu glass also decreased phosphatase activity, which is involved in the regeneration of inorganic P from organic moieties. Since, P is often a limiting nutrient for algal production, algal growth may be inhibited. Activities of ${\beta}$-glucosidase and N-acetylglucosaminidase were not significantly affected because carbon and nitrogen mineralization may not be influenced by the Cu glass beads. Our study suggests that functional mortar with Cu glass beads may reduce the growth of algae on the surface, while it has little environmental impact.

• Journal of Welding and Joining
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• v.14 no.4
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• pp.53-61
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• 1996

It was attempted to improve the wear resistance of Al alloy under the load condition by making a formation of the thicker surface hardening alloy layers. The thicker surface hardening alloy layers were formed on 6061 Al alloys overlayed by MIG and TIG welding process with Cu powders feeding. The characteristics of hardening and wear resistance have been investigated in relation to the microstructures of alloyed layers, with a selection of optimum alloying conditions for formation of overlaying layer. The results obtained were summarized as follows With increasing feeding rate of Cu powders by MIG welding, the hardness and specific wear of the overlay weld alloys were increased. It is considered that these high hardness and specific wear of overlay weld alloys were due to the formation of Θ($Al_2Cu$) phases. With increasing feeding rate of Cu powders by TIG welding, the hardness and specific wear of the overlay weld alloys were increased in feeding rates 12 and 18g/min. However, the hardness and specific wear were decreased in the powder feeding rate 38g/min. It is considered that considered that decrease of hardness and specific wear in the powder feeding rate 38g/min due to formation of ${\gamma}$($Al_4Cu_9$) phases.

• Journal of Powder Materials
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• v.11 no.5
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• pp.376-382
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• 2004

Nanoscale Cu-Ni alloy nanopowders have been produced by a pulsed wire evaporation method in an inert gas. The effect of Cu-Ni alloy nanopowders as additives to motor oil on the tribological properties was studied at room temperature. The worn surfaces were characterized by Scanning Electron Microscopy (SEM) and Energy-Dispersive X-ray Spectroscopy (EDS). Cu-Ni alloy nanopowders as additives lowered coefficient of friction and wear rate. It was found that a copper containing layer on the worn surface was formed, and deposited layers of the metal cladding acted as lubricant on the worn surface, reducing the friction coefficient. It was clearly demonstrated that Cu-Ni alloy nanopowders as additives are able to restore the worn surface and to preserve the friction surfaces from wear.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.53-54
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• 1999

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.05a
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• pp.138-139
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• 1999

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.78-78
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• 1998

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.65-65
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• 1998