• Korean Journal of Materials Research
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• v.9 no.10
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• pp.970-977
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• 1999

Effect of Mo interlayer on the relaxation of residual stress in AlN/Cu pint bonded by active-metal brazing method was investigated. The stress analyses by finite-element-method, the measurement of pint strength and the observation of fracture surface were carried out and their results were compared with each other. From the results of stress analysis it is confirmed that a Mo interlayer led to a shift of maximum stress concentration site from AlN/insert-metal interface$\rightarro$ insert-metal/Mo$\rightarro$Mo interlayer. Additionally, with increase of the Mo interlayer thickness the stress concentration with tensile component was separately built both at the interface of Cu/Mo and AlN/Mo. whereby the residual stress in the free surface of AlN close to the bonded interface was drastically reduced. The AlN/Mo/Cu pints with Mo interlayer thickness of above 400$\mu\textrm{m}$ showed the strengths higher than 200 MPa. upto max. 275 MPa, while the AlN/Cu pint only max. 52 MPa.

• Journal of the Korean institute of surface engineering
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• v.41 no.3
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• pp.109-113
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• 2008

High strength 7xxx series Al-Zn-Mg alloy have been investigated for using light weight automotive parts especially for bump back beam. The composition of commercial 7xxx aluminum has the Zn/Mg ratio about 3 and Cu over 2 wt%, but this composition isn't adequate for appling to automotive bump back beam due to its high resistance to extrusion and bad weldability. In this study the Zn/Mg ratio was increased for better extrusion and Cu content was reduced for better welding. With this new composition we investigated the effect of composition on the resistivity against stress corrosion cracking. As the Zn/Mg ratio is increased fracture energy obtained by slow strain rate test was decreased, which means degradation of SCC resistance. While the fracture energy was increased with Cu contents although it is below 1%, which means improvement of SCC resistance. These effects of composition change on the SCC resistivity were identified by observing the fracture surface and crack propagation.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.35-40
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• 2004

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film / substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 $\mu\textrm{m}$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI...

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1537-1540
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• 2003

MEMS technology with micro scale is complete system utilized as the sensor. micro electro device. The metallization of MEMS is very important to transfer the power operating the sensor and signal induced from sensor part. But in the MEMS structures local stress concentration and deformation is often happened by geometrical shape and different constraint on the metallization. Therefore. this paper studies the effect of supporting type and thickness ratio about thin film thickness of the substrate thickness for the residual stress variation caused by thermal load in the multi-layer thin film. Specimens were made from materials such as Al, Au and Cu and uniform thermal load was applied, repeatedly. The residual stress was measured by FEA and nano-indentation using AFM. Generally, the specimen made of Al induced the large residual stress and the 1st layer made of Al reduced the residual stress about half percent than 2nd layer. Specimen made of Cu and Au being the lower thermal expansion coefficient induce the minimum residual stress. Similarly the lowest indentation length was measured in the Au_Cu specimen by nano-indentation.

• Journal of the Korean institute of surface engineering
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• v.47 no.6
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• pp.303-310
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• 2014

In this study, the average in-situ stress in metallic thin film was measured during deposition of the Cu thin films on the Si(111) wafer and then the phenomenon of stress shift by the interruption of deposition was measured using Cu thin films. We have observed the stress shift in accordance with changing amount of atom's movement between the surface and grain boundary through altering the grain size of the Cu thin film with variety of parameters. The grain size is known to be affected on the deposition rate, film thickness and deposition temperature. As a experimental results, the these parameters was not adequate to explain stress shift because these parameters affect directly on the amount of atom's movement between the surface and grain boundary as well as the grain size. Thus, we have observed the stress shift toward tensile side in accordance with the grain size changing through the interlayer deposition. From an experiment with inserting interlayer before deposit Cu, in thin film which has big grain size with high roughness, amount of stress movement is higher along direction of tensile stress after deposition that means, after deposition process, driving force of atoms moving in grain boundary and on the surface of the film is relatively higher than before.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.251-254
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• 2003

In this study, main works are focused on investigating the stress distribution at the interface between a rotor core and Cu bar when a punch is applied into the body of Cu bar. A parametric study with dimensional changes of core slot was performed numerically to identify what factors are dominant in producing high contact forces in the interface. As analysis results, it was found that core slot length was a dominant factor in increasing contact force at the interface between a rotor core and Cu bar.

• Journal of the Korean Society of Safety
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• v.24 no.1
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• pp.26-30
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• 2009

Shape memory recoverable stress and strain of Ti-42.5at%Ni-10at%Cu alloys were measured by means of constant temperature tensile tests. The alloys' transformation behavior is B2 - B19 by DSC result. The strain by tensile stress were perfectly recovered by heating at any testing conditions but shape memory recoverable stress increased to 66MPa and then slightly decreased. Transformation temperatures from thermal cycling under constant uniaxial applied tensile loads linearly increased by increasing tensile load and their thermal hysteresis are about 110K and their maximum recoverable strain is 6.5% at 100MPa condition.

• Korean Journal of Materials Research
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• v.26 no.7
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• pp.370-375
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• 2016

Tensile tests and creep tests were carried out at high temperatures on an Al-$Al_4C_3$ alloy prepared by mechanical alloying technique. The material contains about 2.0% carbon and 0.9% oxygen in mass percent, and the volume fractions of $Al_4C_3$ and $Al_2O_3$ particles are estimated at 7.4 and 1.4%, respectively, from the chemical composition. Minimum creep rate decreased steeply near two critical stresses, ${\sigma}_{cl}$ (the lower critical stress) and ${\sigma}_{cu}$ (the upper critical stress), with decreasing applied stress at temperatures below 723 K. Instantaneous plastic strain was observed in creep tests above a critical stress, ${\sigma}_{ci}$, at each test temperature. ${\sigma}_{cu}$ and ${\sigma}_{ci}$ were fairly close to the 0.2% proof stress obtained by tensile tests at each test temperature. It is thought that ${\sigma}_{cl}$ and ${\sigma}_{cu}$ correspond to the microscopic yield stress and the macroscopic yield stress, respectively. The lower critical stress corresponds to the local yield stress needed for dislocations to move in the soft region within subgrains. The creep strain in the low stress range below 723 K arises mainly from the local deformation of the soft region. The upper critical stress is equivalent to the macroscopic yield stress necessary for dislocations within subgrains or in subboundaries; this stress can extensively move beyond subboundaries under a stress above the critical point to yield a macroscopic deformation. At higher temperatures above 773 K, the influence of the diffusional creep increases and the stress exponent of the creep rate decreases.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.67-73
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• 2012

After flash memory card(FMC) was manufactured by $B^2it$ process, interfacial reaction of silver bump with thermal stress was studied. To investigate bonding reliability of Ag bump, thermal shock and thermal stress tests were conducted and then examined on the crack between Cu land and Ag bump interface. Diffusion reaction of Ag bump/Cu land interface was analyzed using SEM, EDS and FIB. The Ag-Cu alloy layer due to the interfacial reaction was formed at the Ag/Cu interface. As the diffusivity of Ag ${\rightarrow}$ Cu is faster than Cu ${\rightarrow}$ Ag, a lot of (Cu, Ag) alloy layers were observed at the Cu layer than Ag. These alloy layers contributed to increase the Cu-Ag bonding strength and its reliability.

• Journal of the Korean Society of Safety
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• v.24 no.5
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• pp.1-5
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• 2009

NiTiCu alloys can produce a large force per unit volume and operate with a simple mechanism. For this reasons, it has been widely studied for application as a micro actuator. So in this study, one-way and two way shape memory effects of Ti-42.5at%Ni-2.0at%Cu alloys are studied. In the case of one-way shape memory effects, shape memory recoverable stress and strain of this alloys were measured by means of tension and compression tests under constant temperature. The strains by tension and compression stress were perfectly recovered by heating at any testing conditions also shape memory recoverable stress increased to 116 MPa in tension tests and to 260 MPa in compression tests. In the case of two-way shape memory effects, transformation temperatures from thermal cycling under constant uniaxial applied tension and compression loads linearly increased by increasing external loads and their maximum recoverable strain is 3.8% at 100MPa tensile condition and 2.2% at 125 MPa compression condition.