• 미생물학회지
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• 제53권4호
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• pp.257-264
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• 2017

Pseudomonas veronii MS1과 P. migulae MS2는 여러 가지의 구리-내성 및 식물 생장 촉진 방법을 갖고 있으며 또한 스트레스 에틸렌의 전구체인 1-aminocyclopropane-1-carboxylic acid (ACC)의 ACC deaminase에 의한 가수분해를 통해 식물에서 비생물적 스트레스를 완화시킬 수 있다. 구리 농도 700 mg/kg 토양에서의 4주간 소규모 토마토 재배 실험에서 MS1과 MS2 접종은 비접종 대조군에 비해 토마토 식물의 지상부와 뿌리 길이 및 습윤중량과 건조중량을 모두 유의성 있게 증가시켰다. 접종 토마토 식물은 비생물적 스트레스로부터 식물을 보호할 수 있는 proline및 산화 스트레스 지표인 malondialdehyde도 비접종 대조군보다 적게 함유하였다. 에틸렌 생합성에 관여하는 ACC synthase 유전자, ACS4와 ACS6 그리고 ACC oxidase 유전자, ACO1와 ACO4는 구리 스트레스를 받는 토마토에서 강하게 발현된 반면 MS1과 MS2 접종 토마토에서는 유의성 있게 감소했다. 또한 금속 결합 단백질인 metallothionein 암호화 유전자인 MT2도 위의 유전자들과 유사한 발현 양상을 보였다. 이 모든 결과들은 이 근권세균들이 구리 스트레스 하의 토마토 식물에 구리 내성을 부여하여 낮은 수준의 구리 스트레스와 생장 촉진을 허용하는 것을 가리킨다.

• 한국재료학회지
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• 제9권10호
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• pp.970-977
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• 1999

활성금속브레이징법으로 계면접합된 AlN/Cu 접합체의 잔류응력 완화에 미치는 Mo 중간재의 영향을 조사하였다. 유한요소법에 의한 응력 해석과 접합체 강도 측정, 파단면의 관찰을 행하였으며, 이들 결과를 비교, 분석하였다. 응력 해석 결과로부터, Mo 중간재를 사용할 경우 최대 잔류 주응력이 형성되는 위치가 AlN/삽입금속 계면으로부터 삽임금속/Mo 계면을 통하여 Mo 내부로 이동됨을 확인하였다.접합체의 자유표면에 형성되는 인장성분의 응력집중 위치는 Mo 중간재 두께가 증가됨에 따라 Cu/Mo 계면과 Mo/AlN 계면의 두 곳으로 분리되었으며, AlN측 잔류응력의 크기는 크게 감소하였다. 중간재를 사용하지 않은 경우 최대 접합강도가 52 MPa로 낮은 강도를 보였으나, 두께 400$\mu\textrm{m}$ 이상의 Mo 중간재를 사용한 접합체의 경우, 200 MPa 이상, 최대 275 MPa의 접합강도를 얻을 수 있었다.

• 한국표면공학회지
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• 제41권3호
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• pp.109-113
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• 2008

High strength 7xxx series Al-Zn-Mg alloy have been investigated for using light weight automotive parts especially for bump back beam. The composition of commercial 7xxx aluminum has the Zn/Mg ratio about 3 and Cu over 2 wt%, but this composition isn't adequate for appling to automotive bump back beam due to its high resistance to extrusion and bad weldability. In this study the Zn/Mg ratio was increased for better extrusion and Cu content was reduced for better welding. With this new composition we investigated the effect of composition on the resistivity against stress corrosion cracking. As the Zn/Mg ratio is increased fracture energy obtained by slow strain rate test was decreased, which means degradation of SCC resistance. While the fracture energy was increased with Cu contents although it is below 1%, which means improvement of SCC resistance. These effects of composition change on the SCC resistivity were identified by observing the fracture surface and crack propagation.

• 반도체디스플레이기술학회지
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• 제3권2호
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• pp.35-40
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• 2004

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film / substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 $\mu\textrm{m}$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI...

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1537-1540
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• 2003

MEMS technology with micro scale is complete system utilized as the sensor. micro electro device. The metallization of MEMS is very important to transfer the power operating the sensor and signal induced from sensor part. But in the MEMS structures local stress concentration and deformation is often happened by geometrical shape and different constraint on the metallization. Therefore. this paper studies the effect of supporting type and thickness ratio about thin film thickness of the substrate thickness for the residual stress variation caused by thermal load in the multi-layer thin film. Specimens were made from materials such as Al, Au and Cu and uniform thermal load was applied, repeatedly. The residual stress was measured by FEA and nano-indentation using AFM. Generally, the specimen made of Al induced the large residual stress and the 1st layer made of Al reduced the residual stress about half percent than 2nd layer. Specimen made of Cu and Au being the lower thermal expansion coefficient induce the minimum residual stress. Similarly the lowest indentation length was measured in the Au_Cu specimen by nano-indentation.

• 한국표면공학회지
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• 제47권6호
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• pp.303-310
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• 2014

In this study, the average in-situ stress in metallic thin film was measured during deposition of the Cu thin films on the Si(111) wafer and then the phenomenon of stress shift by the interruption of deposition was measured using Cu thin films. We have observed the stress shift in accordance with changing amount of atom's movement between the surface and grain boundary through altering the grain size of the Cu thin film with variety of parameters. The grain size is known to be affected on the deposition rate, film thickness and deposition temperature. As a experimental results, the these parameters was not adequate to explain stress shift because these parameters affect directly on the amount of atom's movement between the surface and grain boundary as well as the grain size. Thus, we have observed the stress shift toward tensile side in accordance with the grain size changing through the interlayer deposition. From an experiment with inserting interlayer before deposit Cu, in thin film which has big grain size with high roughness, amount of stress movement is higher along direction of tensile stress after deposition that means, after deposition process, driving force of atoms moving in grain boundary and on the surface of the film is relatively higher than before.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.251-254
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• 2003

In this study, main works are focused on investigating the stress distribution at the interface between a rotor core and Cu bar when a punch is applied into the body of Cu bar. A parametric study with dimensional changes of core slot was performed numerically to identify what factors are dominant in producing high contact forces in the interface. As analysis results, it was found that core slot length was a dominant factor in increasing contact force at the interface between a rotor core and Cu bar.

• 한국안전학회지
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• 제24권1호
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• pp.26-30
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• 2009

Shape memory recoverable stress and strain of Ti-42.5at%Ni-10at%Cu alloys were measured by means of constant temperature tensile tests. The alloys' transformation behavior is B2 - B19 by DSC result. The strain by tensile stress were perfectly recovered by heating at any testing conditions but shape memory recoverable stress increased to 66MPa and then slightly decreased. Transformation temperatures from thermal cycling under constant uniaxial applied tensile loads linearly increased by increasing tensile load and their thermal hysteresis are about 110K and their maximum recoverable strain is 6.5% at 100MPa condition.

• 한국재료학회지
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• 제26권7호
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• pp.370-375
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• 2016

Tensile tests and creep tests were carried out at high temperatures on an Al-$Al_4C_3$ alloy prepared by mechanical alloying technique. The material contains about 2.0% carbon and 0.9% oxygen in mass percent, and the volume fractions of $Al_4C_3$ and $Al_2O_3$ particles are estimated at 7.4 and 1.4%, respectively, from the chemical composition. Minimum creep rate decreased steeply near two critical stresses, ${\sigma}_{cl}$ (the lower critical stress) and ${\sigma}_{cu}$ (the upper critical stress), with decreasing applied stress at temperatures below 723 K. Instantaneous plastic strain was observed in creep tests above a critical stress, ${\sigma}_{ci}$, at each test temperature. ${\sigma}_{cu}$ and ${\sigma}_{ci}$ were fairly close to the 0.2% proof stress obtained by tensile tests at each test temperature. It is thought that ${\sigma}_{cl}$ and ${\sigma}_{cu}$ correspond to the microscopic yield stress and the macroscopic yield stress, respectively. The lower critical stress corresponds to the local yield stress needed for dislocations to move in the soft region within subgrains. The creep strain in the low stress range below 723 K arises mainly from the local deformation of the soft region. The upper critical stress is equivalent to the macroscopic yield stress necessary for dislocations within subgrains or in subboundaries; this stress can extensively move beyond subboundaries under a stress above the critical point to yield a macroscopic deformation. At higher temperatures above 773 K, the influence of the diffusional creep increases and the stress exponent of the creep rate decreases.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.67-73
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• 2012

본 연구는 고밀도 미세회로 형성 및 원가절감에 유리한 페이스트의 인쇄/건조, 프리프레그 관통 및 적층 공법을 이용한 $B^2it$ 공법을 이용하여 FMC 기판을 제조한 후 열적 스트레스에 대한 범프의 계면반응 연구를 수행하였다. 열적 스트레스에 대한 Ag 범프의 접합 신뢰성을 조사하기 위해 열충격시험, 열응력시험을 수행한 후 전기적 특성 및 단면분석을 통해 균열발생 여부를 조사하였다. 또한 Ag 범프와 Cu 랜드의 접합계면에 대한 계면반응 특성을 분석하기 위해 주사전자현미경(SEM), 에너지분산스펙트럼(EDS) 및 FIB분석을 수행하여 계면에서 발생되는 확산반응을 분석하였다. 이러한 결과를 바탕으로 열적 스트레스에 대한 Ag 페이스트 범프/Cu 랜드 접합계면에서 계면반응에 의해 형성된 Ag-Cu 합금층을 확인할 수 있었다. 이러한 합금층은 Cu ${\rightarrow}$ Ag 보다, Ag ${\rightarrow}$ Cu 로의 확산속도가 빠르기 때문에, Cu층에서의 (Ag, Cu) 합금층이 보다 많이 관찰되었으며, 합금층이 Ag범프의 계면 접합력 향상에 기여하는 것을 알 수 있었다.