• Korean Journal of Materials Research
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• v.20 no.2
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• pp.65-71
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• 2010

In this study, the effect of Sn and Mg on microstructure and mechanical properties of Cu-Fe-P alloy were investigated by using scanning electron microscope, transmission electron microscope, tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases in order to satisfy characteristic for lead frame material. It was observed that Cu-0.14wt%Fe-0.03wt%P-0.05wt%Si-0.1wt%Zn with Sn and Mg indicates increasing tensile strength compare with PMC90 since Sn restrained the growth of the Fe-P precipitation phase on the matrix. However, the electrical conductivity was decreased by adding addition of Sn and Mg because Sn was dispersed on the matrix and restrained the growth of the Fe-P precipitation. The size of 100 nm $Mg_3P_2$ precipitation phase was observed having lattice parameter $a:12.01{\AA}$ such that [111] zone axis. According to the results of the study, the tensile strength and the electrical conductivity satisfied the requirements of lead frame; so, there is the possibility of application as a substitution material for lead frame of Cu alloy.

• Korean Journal of Materials Research
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• v.9 no.9
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• pp.926-931
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• 1999

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, $Ag_3Sn and Cu_6Sn_5$ phases in the matrix Sn and $1~2\mu\textrm{m}$ thick $Cu_6Sn_5$ phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5Agl Alloy42, only AgJSn phase of low density in the matrix Sn and $0.5~1.5\mu\textrm{m}$ thick $FeSn_2$, phase at the interface of solder/leadframe were formed. Comparing to Cu, Alloy42 showed wider area of spread and smaller contact angle, thus better wet­tability. But shear strength and ductility of Alloy 42 solder joints were only 33% and 75% of those of Cu, respectively After aging at $180^{\circ}C$ for 1 week, $\xi-Cu_3Sn$ layer on $\eta-Cu_6Sn_5$ layer was formed on Cu lead-frame, while coarsened cir­cular $Ag_3Sn$ phase in the matrix and thickened $FeSn_2$, at the interface were formed on Alloy42 lead- frame.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.640-644
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• 2000

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, Ag$_3$Sn and Cu$\sub$6/Sn$\sub$5/ phases in the matrix Sn and 1∼2$\mu\textrm{m}$ thick Cu$\sub$6/Sn$\sub$5/ Phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5AAg/A11oy42, only Ag$_3$Sn Phase of low density in the matrix Sn and 0.5∼1.5$\mu\textrm{m}$ thick FeSn$_2$phase at the interface of solder/lead-frame were formed. Comparing to Cu, Alloy42 shear strength of Alloy 42 solder joints was smaller than that of Cu and all declined after aging. After aging at 180$^{\circ}C$ for 1 week, η-Cu$\sub$6/Sn$\sub$5/ layer was formed on Cu lead-frame, while AgSn$_3$ phase in the matrix and thickened FeSn$_2$at the interface were formed on Alloy42 lead-frame.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.1 no.2
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• pp.15-22
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• 1991

When $YBa_2Cu_3Ox$ is liquid-phase sintered at $925^{\circ}C$ in $O_2$ for 16h, liquid pockets are entrapped within the grains. The liquid pockets show a thin parallelepiped shape with short edge lengths in the c axis, even after reannealing $925^{\circ}C$ in $O_2$ for 16h. All grains in contact with the liquid matrix show the same shape. However, when liquid-phase sintered at 925^{circ}C in $N_2$ for 16h, the grains dispersed in the liquid matrix show a thicker parallelepiped shape than in $O_2$, and their shape remains intact even after reannealing at $925^{\circ}C$ in $N_2$ for 16h. The effect of atmosphere on the grain shape is expected to be due to the variation of oxygen vacancy concentraion in $CuO_2$ plane of tetragonal unit cell.

• Journal of the Korean Ceramic Society
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• v.34 no.9
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• pp.941-948
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• 1997

CuCl nanocrystallites dispersed nonlinear optical silica and borosilicate glasses were fabricated by sol-gel process. CuCl powder was dissolved in TEOS(Si(OC2H5)4) and TMB((CH3O)3B), precursors of silica and borosilicate glasses, with ethanol, water and HCl, and precipitated through the heat treatment in the matrix glass. The optical properties of CuCl doped glasses were measured using the spectrophotometer at room temperature and low temperature(77K); Z1, 2 and Z3 exciton peaks from the absorption spectra, were observed at about 370 nm and 380 nm, respectively. The average radius of nanocrystallites, calculated from the blue shift of Z3 excitons, was measured according to annealing temperature and time. The precipitation temperature of CuCl nanocrystallites was decreased when boron was added to silica glass. Increase of annealing temperature and time made average radius of nanocrystallites saturated about 2 nm.

• Journal of Powder Materials
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• v.3 no.1
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• pp.33-41
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• 1996

Nanostructured Cu-Pb powders were synthesized by mechanical alloying process. The variation of powder characteristics with mechanical alloying time was investigated by x-ray diffraction, differential scanning calorimetry, SEM and TEM. An electrical resistivity of the hot pressed specimens was also measured by using the nanovoltmeter. It was shown that mechanical alloying for 12 hours leads to a homogenization and a grain refinement to the nanometer scale under 20 nm. The mechanically alloyed Cu-Pb alloys represented the enhanced solid solubility of 10wt% Pb in the Cu matrix. The monotectic temperature of nanostructured Cu-Pb alloy decreased from equilibrium state of 955$^{\circ}C$ to 855$^{\circ}C$ due to reduced grain size effect. The analysis of electrical resistivity showed that the hot pressed MA Cu-5wt% Pb compact existed as a solid solution.

• Journal of the Korean Society for Heat Treatment
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• v.35 no.3
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• pp.150-158
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• 2022

The effects of scandium addition on the Al-6Si-2Cu Alloy were investigated. The Al-6Si-2Cu-Sc alloy was prepared by gravity die casting process. In this study, scandium was added at 0.2 wt%, 0.4 wt%, 0.8 wt%, and 1.0 wt%. The microstructure of Al-6Si-2Cu-Sc alloy was investigated using Optical Microscope, Field Emission Scanning Electron Microscope, Electron Back Scatter Diffraction, and Transmission Electron microscope. The microstructure of Al-6Si-2Cu alloy with scandium added changed from dendrite structure to equiaxed crystal structure in specimens of 0.4 wt% Sc or more, and coarse needle-shape eutectic Si and β-Al₅FeSi phases were segmented and refined. The nanosized Al₃Sc intermetallic compound was observed to be uniformly distributed in the modified Al matrix.

• Korean Journal of Metals and Materials
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• v.46 no.3
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• pp.182-188
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• 2008

Carbon nanotubes(CNTs) have outstanding mechanical, thermal, and electrical properties. Thus, by placing nanotubes into appropriate matrix, it is postulated that the resulting composites will have enhanced properties. Cold spray can produce thick metal-based composite coatings with very high density, low oxygen content, and phase purity, which leads to excellent physical properties. In this study, we applied cold spray coating process for the consolidation of Cu/CNT composite powder. The precursor powder mixture, in which CNTs were filled into copper particles, was prepared to improve the distribution of the CNT in copper matrix. Pure copper coating was also conducted by cold spraying as a reference. Annealing heat treatment was applied to the coating to examine its effect on the properties of the composite coating. The hardness of Cu/CNT composite coating represented similar value to that of pure copper coating. It was importantly found that the electrical conductivity of the Cu/CNT composite coating significantly increased from 53% for the standard condition to almost 55% in the optimized condition, taking annealed ($500^{\circ}C/1hr$.) copper coating as a reference (100%). The thermal conductivity of Cu/CNT composite coating layer was higher than that of pure Cu coating. It was also found that the electrical and thermal conductivities of Cu/CNT composite could be improved through annealing heat treatment. The microstructural evolution of Cu/CNT coating was also investigated and related to the macroscopic properties.

• Progress in Superconductivity and Cryogenics
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• v.4 no.1
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• pp.21-25
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• 2002

The effect of Ca-doping on the superconducting properties of Nd-Ba-Cu-O bulk superconductors, fabricated by the oxygen-controlled melt growth process, has been systematically investigated. Various c-axis textured bulk samples were grown using precursors with the nominal compositions of $Nd_{1.8-x}Ca_{x]Ba_{2.4}Cu_{3.4}O_{y}$ (x= 0.00, 0.02, 0.05, 0.10, 0.15) in a reduced oxygen atmosphere of 1%O$_2$ in Ar. Magnetization measurements revealed that the critical temperatures(Tc) were almost linearly depressed from 95K to 86K with increasing the Ca dopant from x : 0.0 to 0.15, respectively, and thus critical current densities(Jc) at 77K and for H//c-axis of specimens were gradually degraded with increasing x. Compositional analyses revealed that although the amounts of the Ca dopant both in $NdBa_2Cu_2O_y(Nd123) and Nd_4Ba_2Cu_2O_{10}(Nd422)$,/TEX> were increased with increasing x, only less than half of the initial Ca compositions were detected in melt-grown Ca-doped Nd-Ba-Cu-O bulk crystals. The supression of Tc is attributed to an increased Nd substitution for the Ba site in the Nd123 superconducting matrix with increasing the amount of the Ca dopant.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.5
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• pp.226-231
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• 2020

The Cu-Co-Si alloy shows high strength by forming precipitates by aging precipitation heat treatment of supersaturated solid solution treated with solution treatment such as Cu-Ni-Si alloy, and the Co₂Si precipitated phase is dispersed in the copper matrix. The effect of aging treatment on the microstructure, mechanical and electrical properties of Cu-Co-Si alloys for electronic devices was investigated. As a results of SEM/EDS analysis, it was found that Co₂Si precipitates of 30~300 nm size were distributed in grains. By performing the double aging treatment, it was possible to improve the strength and electrical conductivity by dispersing the fine precipitate evenly.