• 한국결정성장학회지
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• 제1권2호
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• pp.15-22
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• 1991

$YBa_2Cu_3O_x$ 초전도체를 $925^{\circ}C$, 산소 분위기에서 16시간 액상 소결할 때 액상-포켓이 결정립 내부에 포획되어 있는 것이 관찰되었다. 액상-포켓은 a, b 축의 길이가 같고 c축이 짧은 직육면체 모양의 판상형태를 갖고 있었으며, 같은 조건에서 16시간 동안 재열처리해도 액상-포켓의 모양은 그대로 유지되었다. 그리고 액상에 분산되어 있는 모든 결정립들이 액상-포켓과 같은 형태를 보였는데, 이것은 액상에 분산되어 있는 $YBa_2Cu_3O_x$ 결정립의 모양이 열역학적 평형 조건에 의해 결정됨을 의미한다. 그러나 $925^{\circ}C$, 질소 분위기에서 16시간 액상 소결한 경우에는 $YBa_2Cu_3O_x$ 결정립이 산소에서 액상소결한 것보다 c축이 다소 두터워진 직육면체 모양의 판상형태를 갖는 것이 관찰되었다. 이러한 결정립 형태(grain shape)의 차이는 tetragonal 결정구조의 $CuO_2$면 (a-b basal plane)에 존재하는 산소 공공의 농도가 열처리 분위기에 따라 차이가 있기 때문이며, 이로 인해 c축에 평행한 (결국 $CuO_2$면에 수직한 방향) 고상-액상 계면 에너지가 열처리 분위기에 따라 변하기 때문인 것으로 믿어진다. 그리고 산소와 질소 분위기에서 각각 액상 소결한 So와 $S_N$시편을 분위기를 바꾸어 재열처리하는 스위칭 실험을 하여, 분위기에 따른 결정립 형태의 변화를 명확하게 관찰할 수 있었다.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 1993년도 추계연구발표회 논문개요집
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• pp.52-53
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• 1993

• 한국세라믹학회지
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• 제34권9호
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• pp.941-948
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• 1997

CuCl nanocrystallites dispersed nonlinear optical silica and borosilicate glasses were fabricated by sol-gel process. CuCl powder was dissolved in TEOS(Si(OC2H5)4) and TMB((CH3O)3B), precursors of silica and borosilicate glasses, with ethanol, water and HCl, and precipitated through the heat treatment in the matrix glass. The optical properties of CuCl doped glasses were measured using the spectrophotometer at room temperature and low temperature(77K); Z1, 2 and Z3 exciton peaks from the absorption spectra, were observed at about 370 nm and 380 nm, respectively. The average radius of nanocrystallites, calculated from the blue shift of Z3 excitons, was measured according to annealing temperature and time. The precipitation temperature of CuCl nanocrystallites was decreased when boron was added to silica glass. Increase of annealing temperature and time made average radius of nanocrystallites saturated about 2 nm.

• BMB Reports
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• 제28권4호
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• pp.311-315
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• 1995

Exogenous $Cu^{2+}$ or $Zn^{2+}$ at micromolar concentration had a strong inhibitory effect on detergent-solubilized cytochrome c oxidase. A similar effect was observed when $Cu^{2+}$ was added to vesicular cytochrome c oxidase, although the extent of inhibition was significantly larger for the uncoupled state than for the coupled state. Interestingly, the inhibition by $Zn^{2+}$ was almost negligible for both the coupled and uncoupled states. These results suggest that the binding sites for $Cu^{2+}$ ions are exposed to the extravesicular side. whereas those for $Zn^{2+}$ are exposed to the matrix side. The EPR spectra of bound $Cu^{2+}$ ions at 77 K indicate that each of the first two $Cu^{2+}$ ions is ligated by three or four histidine residues, as evidenced by distinct $^{14}N$ superhyperfine splitting. These $Cu^{2+}$ ions can not be removed readily by EDTA and inhibit the enzyme activity by as much as 80%.

• 한국결정성장학회지
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• 제15권4호
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• pp.141-144
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• 2005

[ $(Y_{0.5}Sm_{0.25}Nd_{0.25})Ba_2Cu_3O_y$ ] [(YSN)-123] high $T_c$ composite superconductors with $CeO_2$ addition were systematically investigated by top seeded melt growth (TSMG) process in air atmosphere. A melt textured $NdBa_2Cu_3O_y$ (Nd-123) single crystal was used as a seed for achieving the c-axis alignment large grains perpendicular to the surface of (YSN)-123 composite oxides. The size of $(Y_{0.5}Sm_{0.25}Nd_{0.25})_2BaCuO_5$ [(YSN)211] nonsuperconducting inclusions of the melt textured (YSN)-123 samples with $CeO_2$ addition were remarkably reduced and uniformly distributed within the (YSN)123 superconducting matrix except in the region very close to the Nd-123 seed crystal. The sample showed a sharp superconducting transition of 91 K.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.950-951
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• 2006

[ $Mg_{55}Y_{15}Cu_{30}$ ] metallic glass powders were prepared by the mechanical alloying of pure Mg, Y, and Cu after 10 h of milling. The thermal stability of these $Mg_{55}Y_{15}Cu_{30}$ amorphous powders was investigated using the differential scanning calorimeter (DSC). $T_g$, $T_x$, and ${\Delta}T_x$ are 442 K, 478 K, and 36 K, respectively. The as-milled $Mg_{55}Y_{15}Cu_{30}$ powders were then consolidated by vacuum hot pressing into disk compacts with a diameter and thickness of 10 mm and 1 mm, respectively. This yielded bulk $Mg_{55}Y_{15}Cu_{30}$ metallic glass with nanocrystalline precipitates homogeneously embedded in a highly dense glassy matrix. The pressure applied during consolidation can enhance thermal stability and prolong the existence of amorphous phase within $Mg_{55}Y_{15}Cu_{30}$ powders.

• 한국분말재료학회지
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• 제3권1호
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• pp.33-41
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• 1996

Nanostructured Cu-Pb powders were synthesized by mechanical alloying process. The variation of powder characteristics with mechanical alloying time was investigated by x-ray diffraction, differential scanning calorimetry, SEM and TEM. An electrical resistivity of the hot pressed specimens was also measured by using the nanovoltmeter. It was shown that mechanical alloying for 12 hours leads to a homogenization and a grain refinement to the nanometer scale under 20 nm. The mechanically alloyed Cu-Pb alloys represented the enhanced solid solubility of 10wt% Pb in the Cu matrix. The monotectic temperature of nanostructured Cu-Pb alloy decreased from equilibrium state of 955$^{\circ}C$ to 855$^{\circ}C$ due to reduced grain size effect. The analysis of electrical resistivity showed that the hot pressed MA Cu-5wt% Pb compact existed as a solid solution.

• 열처리공학회지
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• 제35권3호
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• pp.150-158
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• 2022

The effects of scandium addition on the Al-6Si-2Cu Alloy were investigated. The Al-6Si-2Cu-Sc alloy was prepared by gravity die casting process. In this study, scandium was added at 0.2 wt%, 0.4 wt%, 0.8 wt%, and 1.0 wt%. The microstructure of Al-6Si-2Cu-Sc alloy was investigated using Optical Microscope, Field Emission Scanning Electron Microscope, Electron Back Scatter Diffraction, and Transmission Electron microscope. The microstructure of Al-6Si-2Cu alloy with scandium added changed from dendrite structure to equiaxed crystal structure in specimens of 0.4 wt% Sc or more, and coarse needle-shape eutectic Si and β-Al₅FeSi phases were segmented and refined. The nanosized Al₃Sc intermetallic compound was observed to be uniformly distributed in the modified Al matrix.

• 대한치과기공학회지
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• 제21권1호
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• pp.27-41
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• 1999

치과용 Ag기 합금에서 30wt%Pd 및 10wt%Cu의 용질농도의 구성비가 3이 되는 3원 합금과 여기에 2wt% Au의 첨가에 미치는 석출상의 영향을 조사 분석하여 아래와 같은 결론을 얻었다. Ag-Pd-Cu 3원 합금은 $\alpha$ 단일상에서 Ag-rich ${\alpha}_2 $ 및 PdCu 규칙상에 의해서 경화반응이 진행되며 연속승온시효곡선에 의하면 100-$300^{\circ}C$의 저항증가와 300-$500^{\circ}C$의 저항감소라고 하는 2단계 변화에 의해서 경화곡선이 얻어졌다. 또한 본 합금의 시효과정에서는 ${\alpha}{\to}{\alpha}_2+PdCu{\to}$의 2상 분리반응에 의하여 경화원인이 되었다. 석출과정은 ${\alpha}{\to}{\alpha}_1+PdCu{\to}{\alpha}_2+PdCu$ 이고 Cu-rich인 ${\alpha}_2$상은 거의 나타나지 않으며 최고 경도값은 ${\alpha}_2$ 및 PdCu의 2상공존 구역에서 나타났다. 미량의 Au첨가에 의해서 경화는 다소 증가하지만 경화성보다는 내식성에 보다 크게 기여하였고 Pd/Cu=3인 합금은 Pd/Cu=1 또는 1.7의 합금보다도 전반적으로 경도값은 가장 낮게 나타나며 이것은 치과용 Ag기 합금의 시효경화성에는 Cu농도가 크게 기여하였다. 불연속석출물인 nodule 생성물은 입계에 우선 형성되어 $\alpha$ matrix로 진행되어 nodule 석출물은 부드러운 경계면을 가지고 $\alpha$ matrix주위에 strain matrix를 나타내므로 nodule 형성이 본 합금의 시효경화를 야기하였다. 내식성은 Pd 함량이 가장 높은 본 합금에서 매우 양호하게 나타났으며 Pd 함량이 증가가 내식성의 향상에 크게 기여하여 미량의 Au 첨가에 의해서 보다 현저히 효과를 얻었다. 본 합금의 시효열처리 조건은 $450^{\circ}C$ 적절하며 1-120min 시효시간에 걸쳐서 소정의 경도 값을 얻을 수 있고 시효경화성 및 내식성의 결과로부터 Ag-30wt%Pd-10wt%Cu합금 및 미량 Au 합금은 치과용 금속재료로 적합하였다.

• ETRI Journal
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• 제41권6호
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.