• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.10
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• pp.101-105
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• 1990

The use of a sol-gel processed cordierite precursor sinterable about$900^{\circ}C$ allows cosintering of the copper and the ceramic. A strong bonding between the copper film and the cordierite substrate can be achieved through an eutectic bonding technique. These interfaces were investigated using STEM. copper diffusion as well as strong chemical and structural modifications was observed in the interface region. Although these interfaces have good adhesion properties, there was no evidence of the formation of the copper compound at the interface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.414-417
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• 2003

A copper-clad aluminium composite bar is lighter and less expressive than a commercial copper alloy bar. Copper-clad aluminium composite bar can be fabricated by hot hydrostatic extrusion process. In this work, the effect of die angle on the compressive properties of copper-clad aluminium composites fabricated using hydrostatic extrusion process was investigated experimentally. The results showed that optimum half die angle was in the range of 40$^{\circ}$ to 50$^{\circ}$ for an extrusion ratio of 19. The results also showed that the half die angle had little influence on the compressive strength of copper-clad aluminium composites. A diffusion layer increased with increasing die angle.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.251-254
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• 2001

In this paper, the effect of grain refinement on room temperature ductility of copper was addressed. Recent experimental results have shown that this material, as well as a number of other single-phase metals that are ductile when coarse-grained, loose their ductility with decreasing grain size in the sub micrometer range. A recently developed model in which such materials are considered as effectively two-phase ones (with the grain boundaries treated as a linearly viscous second phase) was applied to analyze stability of Cu against ductile necking. As a basis, Hart's stability analysis that accounts for strain rate sensitivity effects was used. The results confirm the observed trend for reduction of ductility with decreasing grain size. The model can be applied to predicting the grain size dependence of ductility of other metallic materials as well.

• Environmental Sciences Bulletin of The Korean Environmental Sciences Society
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• v.10 no.S_3
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• pp.121-126
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• 2001

The techniques of pulse and cyclic voltammetry were applied to the determination of (E$_{1}$2)$_2$-(E$_{1}$2)$_1$ for two-step electrochemical charge transfers. In addition, a simple amplitude was derived far the dependence of the differential pulse response on (E$_{l}$ 2/)$_1$ and (E$_{1}$2/)$_2$. and the use of peak to peak separation in cyclic voltammetry and differential pulse methods was evaluated. A comparison of the comproportionation constants(Ke) from differential pulse and cyclic voltammetry methods exhibited a good agreement within 5%.

• Journal of Electrochemical Science and Technology
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• v.2 no.3
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• pp.136-142
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• 2011

$Li_4Ti_5O_{12}$ is prepared through a solid-state reaction between $Li_2CO_3$ and anatase $TiO_2$ for applications in lithium-ion batteries. The rate capability is measured and the electrode polarization is analyzed through the galvanostatic intermittent titration technique (GITT). The rate characteristics and electrode polarization are highly sensitive to the amount of carbon loading. Polarization of the $Li_4Ti_5O_{12}$ electrode continuously increases as the reaction proceeds in both the charge and discharge processes. This relation indicates that both electron conduction and lithium diffusion are significant factors in the polarization of the electrode. The transition metal (Cu, Ni, Fe) ion added during the synthesis of $Li_4Ti_5O_{12}$ for improving the electrical conductivity also greatly enhances the rate capability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.371-373
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• 1998

The SmBa$_2$Cu$_3$O$\sub$x/ single crystals were used as seeds to induced YBCO growth in MTG process. As the result, the large bulk oriented YBCO superconductors were prepared with dimension of plane 21mm and 32mm in diameter and 10mm in height. The typical Jc value of the sample is 6.5${\times}$10$^4$A/$\textrm{cm}^2$ and its flux float force is 4.6N/$\textrm{cm}^2$. The oxygen absorption in large bulk textured YBCO samples in pure oxygen was studied at several constant temperatures. It can be divided into two steps: a chemical reaction step and a diffusion step.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.491-493
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• 1998

The SmBa$_2$Cu$_3$O$\sub$x/ single crystals were used as seeds to induced YBCO growth in MTG process. As the result, the large bulk oriented YBCO superconductors were prepared with dimension of plane 21mm and 32mm in diameter and 10mm in height. The typical Jc value of the sample is 6.5${\times}$10$^4$A/$\textrm{cm}^2$ and its flux float force is 4.6N/$\textrm{cm}^2$. The oxygen absorption in large bulk textured YBCO samples in pure oxygen was studied at several constant temperatures. It can be divided into two steps: a chemical reaction step and a diffusion step.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.181-186
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• 2007

UBM (Under Bump Metallurgy) of flip chip assemblies consists of several layers such as the solder wetting, the diffusion barrier, and the adhesion layers. In addition, IMC layers are formed between the solder wetting layers (e.g. Cu, Ni) and the solder. The primary failure mechanism of the solder joints in flip chips is widely known as the fatigue failure caused by thermal fatigues or electromigration damages. Sometimes, the premature brittle failure occurs in the IMC layers. However, these phenomena have thus far been viewed from only experimental investigations. In this sense, this paper presents a method for solid modeling of IMC layers in flip chip assemblies, thus providing a pre-processing tool for finite element analysis to simulate the IMC failure mechanism. The proposed modeling method is CSG-based and can also be applied to the modeling of UBM structure in flip chip assemblies. This is done by performing Boolean operations according to the actual sequences of fabrication processes

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.34-37
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• 2001

In this study, the capacitance-voltage properties of (Sr$_{1-x}$ .Ca$_{x}$)TiO$_3$(0.05$\leq$x$\leq$0.20)-based grain boundary layer ceramics were investigated. The ceramics were fabricated by the conventional mixed oxide method. The sintering temperature and time were 1480~150$0^{\circ}C$ and 4 hours, respectively. The 2nd phase formed by the thermal diffusion of CuO from the surface leads to very excellent dielectric properties, that is, $\varepsilon$$_{r}$>50000, tan$\delta$<0.05, $\Delta$C<$\pm$10%. The capacitance is almost unchanged below about 20[V] but it decreases slowly about 20[V]. The results of the capacitance-voltage properties indicated that the grain boundary was composed of the continuous insulating layers.ulating layers.s.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.51-52
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• 2011

본 연구에서는 전해 구리도금막과 SiN 피복층 사이의 힐락 (Hillock) 및 보이드 (Void) 결함에 미치는 전해 구리도금 공정 및 CVD SiN 피복층 증착 전 NH3 플라즈마 처리 효과에 대해 연구하였다. SiN 피복층 증착전 NH3 플라즈마 효과를 정량화하기 위해 실험계획법을 이용해 NH3 플라즈마 공정 인자가 힐락 결함의 밀도에 미치는 영향에 대해 고찰하였다. 실험결과, 힐락 결함의 밀도는 NH3 플라즈마 인가 시간에 비례한다는 것을 알았다. 보이드 결함의 경우, 구리 씨앗층 및 NH3 플라즈마 조건의 최적화를 통해 구리 씨앗층의 표면 조도를 최소화할 경우 보이드 결함이 최소화된다는 것을 알 수 있었다. 이는 구리 씨앗층의 표면 조도를 최소화함에 따라 전해 구리도금막의 결정립 크기가 커져 결정립 계면에 존재하는 불순물 양이 줄어들었기 때문인 것으로 사료된다.