• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.980-981
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• 2006

In this study, bottom-up type powder processing and top-down type SPD (severe plastic deformation) approaches were combined in order to achieve full density of Carbon nanotube (CNT)/metal matrix composites with superior mechanical properties by improved particle bonding and least grain growth, which were considered as a bottle neck of the bottom-up method using the conventional powder metallurgy of compaction and sintering. ECAP (equal channel angular pressing), the most promising method in SPD, was used for the CNT/Cu powder consolidation. The powder ECAP processing with 1, 2, 4 and 8 route C passes was conducted at room temperature.

• 한국분말재료학회지
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• 제14권3호
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• pp.197-201
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• 2007

Bulk metallic glass (BMG) composite was fabricated by consolidation of milled metallic glass composite powders. The metallic glass composite powder was synthesized by a controlled milling process using the Cu-based metallic glass powder blended with 30 vol% Zr-based metallic glass powders. The milled composite powders showed a layered structure with three metallic phases, which is formed as a result of mechanical milling. By spark plasma sintering of milled metallic glass powders in the supercooled liquid region, a fully dense BMG composite was successfully synthesized.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.523-524
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• 2006

The $TiB_2$ dispersion strengthened copper alloy was attracted as thermal and electrical functional material for the high mechanical strength, high thermal stability and good conductivity of $TiB_2$. In the present study, the focus is on the synthesis of $TiB_2$ dispersed copper alloy by spark plasma sintering process using copper oxide and titanium diboride as raw materials. The mechanical, thermal and electrical properties of sintered bodies were discussed with the sintering parameters, and developed microstructure and phase of sintered bodies.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.311-312
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• 2007

In this study, composite $BaSrTiO_3$ has been studied for high frequency device applications. Composite $Ba_{0.5}Sr_{0.5}TiO_3$ has high dielectric permittivity and low loss tangent at the relative frequency range from MHz to GHz. 10,30 and 50 wt% of epoxy doped $Ba_{0.5}Sr_{0.5}TiO_3$ powders were prepared with bisphenol A and F polymer employing ball milling process. Epoxy/($BaSrTiO_3$) composites thick films were screen printed on the Cu plated PCB substrates through screen printing methods. The specimens were designed for the embedded capacitor applications. Temperature dependent dielectric permittivity of Epoxy doped $BaSrTiO_3$ ceramics was measured.

• 한국재료학회지
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• 제28권12호
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• pp.691-695
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• 2018

In this study, we investigate the recycling of aluminum-based metal matrix composites(AMCs) embedded with SiC particulates. The microstructure of the AMCs is characterized by X-ray diffraction and scanning electron microscopy. The possibility of recycling the composite scrap is attempted from the melted alloy and SiC particulates by re-melting, holding and solidification in crucibles. The recovery percentage of the matrix alloy is calculated after a number of holding times, 0, 5, 10, 15, 20, 25 and 30 minutes and for different particulate sizes and weight fractions in the Al matrix. The results show that the recovery percentage of the matrix alloy, as well as the time required for maximum recovery of the matrix, is dependent on the size and weight fraction of SiC particulates. In addition, the percentage recovery increases with particulate size but drops with the particulate fraction in the matrix. The time to reach maximum recovery falls rapidly with an increase in particulate size and fraction.

• 한국분말재료학회지
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• 제13권5호
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• pp.321-326
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• 2006

Electronic packaging involves interconnecting, powering, protecting, and cooling of semiconductor circuits fur the use in a variety of microelectronic applications. For microelectronic circuits, the main type of failure is thermal fatigue, owing to the different thermal expansion coefficients of semiconductor chips and packaging materials. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers. The advantages of carbon nanofibers, especially the good thermal conductivity, are utlized to obtain a composite material having a thermal conductivity higher than 400 W/mK. The main challenge is to obtain a homogeneous dispersion of carbon nanofibers in copper. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed. In order to improve the bonding strength between copper and nanofibers, different alloying elements were added. The microstructure and the properties will be presented and the influence of interface modification will be discussed.

• 한국재료학회지
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• 제23권7호
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• pp.366-372
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• 2013

Flexible polyurethane/clay porous nanocomposite foams were synthesized using natural and organically modified montmorillonite clays such as bentonite, closite 10A and closite 30B. The content of nanoclays was varied from 1 to 5 wt% of polyol. Dispersion of clay in Polyurethane(PU) matrix was investigated by X-ray diffraction(Cu-$K{\alpha}$ rays of wavelength $1.54{\AA}$) using an X-ray diffractometer. Also, we determined that the thermal resistance of PU foam increased with added clay, compared to that of pure PU foam. The cell size and the fraction of open cells of the precursor foam were controlled by the addition of clay to the polyurethane foam. Modified clays were found to be more efficient cell openers than the unmodified clay. In addition, the tensile strength and elongation of the polyurethane/clay porous nanocomposites were examined. Increasing clay content increased the mechanical properties of the composites, such as tensile strength, and elongation at break. However, increasing the content over 5 wt% deteriorated the properties of the composites. We found that the nanofillers(bentonite, closite 10A and closite 30B) improved the thermal stability of the nanocomposite foam. The nanocomposite foam containing 3 wt% of closite 30B exhibited the best tensile strength and thermal stability.

• Journal of Industrial and Engineering Chemistry
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• 제68권
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• pp.161-167
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• 2018

In this study, transition metal coated carbon nanofibers (CNFs) were synthesized and applied as anode materials of Li secondary batteries. CNFs/Ni foam was immersed into 0.01 M transition metal solutions after growing CNFs on Ni foam via chemical vapor deposition (CVD) method. Transition metal coated CNFs/Ni foam was dried in an oven at $80^{\circ}C$. Morphologies, compositions, and crystal quality of CNFs-transition metal composites were characterized by scanning electron microscopy (SEM), Raman spectroscopy (Raman), and X-ray photoelectron spectroscopy (XPS), respectively. Electrochemical characteristics of CNFs-transition metal composites as anodes of Li secondary batteries were investigated using a three-electrode cell. Transition metal/CNFs/Ni foam was directly employed as a working electrode without any binder. Lithium foil was used as both counter and reference electrodes while 1 M $LiClO_4$ was employed as the electrolyte after it was dissolved in a mixture of propylene carbonate:ethylene carbonate (PC:EC) at 1:1 volume ratio. Galvanostatic charge/discharge cycling and cyclic voltammetry measurements were taken at room temperature using a battery tester. In particular, the capacity of the synthesized CNFs-Fe was improved compared to that of CNFs. After 30 cycles, the capacity of CNFs-Fe was increased by 78%. Among four transition metals of Fe, Cu, Co and Ni coated on carbon nanofibers, the retention rate of CNFs-Fe was the highest at 41%. The initial capacity of CNFs-Fe with 670 mAh/g was reduced to 275 mAh/g after 30 cycles.

• Korean Chemical Engineering Research
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• 제56권2호
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• pp.191-203
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• 2018

이 연구는 각각 크기와 재질이 다른 3 가지 종류의 분쇄 매체를 이용하여 회전속도와 밀링 시간의 따른 구리 (Cu) 분말의 형상변화의 과정에 미치는 영향을 관찰하고, 볼 움직임의 DEM시뮬레이션을 행하였다. 전동볼밀에서 볼 움직임의 3차원 시뮬레이션을 통해 분쇄 메커니즘을 규명하기 위하여 분쇄매체의 힘, 운동에너지, 매체 운동속도 등을 계산하였다. 시뮬레이션에서는 회전속도, 볼 재질, 운동속도, 마찰계수 등을 실제 실험조건과 동일하게 조건을 맞추어 투입되는 에너지의 변화량도 계산하였다. 주사전자현미경 결과를 살펴보면 볼 직경이 작을 때 입자형상이 불규칙한 형태에서 구형 형태로 변화하는 것을 알 수 있었다.

• Applied Microscopy
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• 제26권1호
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• pp.95-104
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• 1996

A comprehensive methodology to characterize the interfacial reaction products of $SiC_p/2024$ Al composites is introduced on the basis of the experimental results obtained using XRD, SEM and TEM. XRD performed on the electrochemically extracted $SiC_p$ and bulk $SiC_p/2024$ Al composite have shown that the interfacial reaction products consist of $Al_{4}C_3$ having hexagonal crystallographic structure, pure eutectic Si having diamond cubic crystallographic structure, and $CuAl_2$, having tetragonal crystalloraphic structure, respectively. According to the images observed by SEM, $Al_{4}C_3$, which has been reported to have needle shape, has a hexagonal platelet-shape and eutectic Si is found to have a dendritic shape. In addition eutectic $CuAl_2$, was observed to form near interface and/or along the grain boundaries. In order to confirm the results obtained by XRD, the primitive cell volume and reciprocal lattice height of such interfacial reaction products were calculated using the data obtained from convergent beam electron diffraction (CBED) patterns, and then compared with theoretical values.