• 한국자기학회지
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• 제9권3호
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• pp.154-158
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• 1999

Nd 함유량을 2~6at.%로 변화시킨 $\alpha$-(Fe, Co)-B-Nb-Cu 초미세결정립합금의 미세조직 및 자기특성을 조사하였다. 급속응고된 Ndx(Fe0.9Co0.1)90-xB6Nb3Cu1(2$\leq$x$\leq$6, 1at.% 간격) 합금은 x=3 이상에서 비정질상으로 제조되었다. 제조된 비정질합금은 열처리에 의해 $\alpha$-(Fe, Co) 및 Nd2(Fe, Co)14B1상으로 구성된 초미세결정립합금으로 결정화 되었다. 최적열처리조건에서 잔류자화는 Nd의 증가에 따라 감소하며, x=3에서 1.55T로 최대 값을 나타내었다. 보자력은 Nd함유량 증가에 따라 직선적으로 증가하여 x=6에서 4.6kOe이었으며, 최대에너지적은 10.6MGOe였다.

• Journal of Welding and Joining
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• 제27권6호
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• pp.43-48
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• 2009

In this study, Cu-based bulk metallic glass (BMG) coatings were deposited by atmospheric plasma spraying (APS) process with different process conditions (with- and without hydrogen gas). As adding the hydrogen gas, thermal energy in the plasma flame increased and induced difference in the melting state of the Cu-based BMG particles. The microstructure and mechanical properties of the coatings were analyzed using a scanning electron microscope (SEM) with an energy dispersive spectroscopy (EDS) and nano-indentation tester in the light of phase analysis. It was elucidated by the nano-indentation tests that un-melted region was a mainly amorphous phase which showed discrete plasticity observed as the flow serrations on the load.displacement (P - h) curves, and the curves of solidified region showed lower flow serrations as amorphous phase mingled with crystalline phase. Oxides produced during the spraying process had the highest hardness value among the phases and were well mixed with other phases resulted from the increase in melting degree.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2004년도 International Symposium on Powder Materials and Processing
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• pp.30-31
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• 2004

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.239-240
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• 2008

As semiconductor devices are scaled down for better performance and more functionality, the Cu-based interconnects suffer from the increase of the resistivity of the Cu wires. The resistivity increase, which is attributed to the electron scattering from grain boundaries and interfaces, needs to be addressed in order to further scale down semiconductor devices [1]. The increase in the resistivity of the interconnect can be alleviated by increasing the grain size of electroplating (EP)-Cu or by modifying the Cu surface [1]. Another possible solution is to maximize the portion of the EP-Cu volume in the vias or damascene structures with the conformal diffusion barrier and seed layer by optimizing their deposition processes during Cu interconnect fabrication, which are currently ionized physical vapor deposition (IPVD)-based Ta/TaN bilayer and IPVD-Cu, respectively. The use of in-situ etching, during IPVD of the barrier or the seed layer, has been effective in enlarging the trench volume where the Cu is filled, resulting in improved reliability and performance of the Cu-based interconnect. However, the application of IPVD technology is expected to be limited eventually because of poor sidewall step coverage and the narrow top part of the damascene structures. Recently, Ru has been suggested as a diffusion barrier that is compatible with the direct plating of Cu [2-3]. A single-layer diffusion barrier for the direct plating of Cu is desirable to optimize the resistance of the Cu interconnects because it eliminates the Cu-seed layer. However, previous studies have shown that the Ru by itself is not a suitable diffusion barrier for Cu metallization [4-6]. Thus, the diffusion barrier performance of the Ru film should be improved in order for it to be successfully incorporated as a seed layer/barrier layer for the direct plating of Cu. The improvement of its barrier performance, by modifying the Ru microstructure from columnar to amorphous (by incorporating the N into Ru during PVD), has been previously reported [7]. Another approach for improving the barrier performance of the Ru film is to use Ru as a just seed layer and combine it with superior materials to function as a diffusion barrier against the Cu. A RulTaN bilayer prepared by PVD has recently been suggested as a seed layer/diffusion barrier for Cu. This bilayer was stable between the Cu and Si after annealing at $700^{\circ}C$ for I min [8]. Although these reports dealt with the possible applications of Ru for Cu metallization, cases where the Ru film was prepared by atomic layer deposition (ALD) have not been identified. These are important because of ALD's excellent conformality. In this study, a bilayer diffusion barrier of Ru/TaCN prepared by ALD was investigated. As the addition of the third element into the transition metal nitride disrupts the crystal lattice and leads to the formation of a stable ternary amorphous material, as indicated by Nicolet [9], ALD-TaCN is expected to improve the diffusion barrier performance of the ALD-Ru against Cu. Ru was deposited by a sequential supply of bis(ethylcyclopentadienyl)ruthenium [Ru$(EtCp)_2$] and $NH_3$plasma and TaCN by a sequential supply of $(NEt_2)_3Ta=Nbu^t$ (tert-butylimido-trisdiethylamido-tantalum, TBTDET) and $H_2$ plasma. Sheet resistance measurements, X-ray diffractometry (XRD), and Auger electron spectroscopy (AES) analysis showed that the bilayer diffusion barriers of ALD-Ru (12 nm)/ALD-TaCN (2 nm) and ALD-Ru (4nm)/ALD-TaCN (2 nm) prevented the Cu diffusion up to annealing temperatures of 600 and $550^{\circ}C$ for 30 min, respectively. This is found to be due to the excellent diffusion barrier performance of the ALD-TaCN film against the Cu, due to it having an amorphous structure. A 5-nm-thick ALD-TaCN film was even stable up to annealing at $650^{\circ}C$ between Cu and Si. Transmission electron microscopy (TEM) investigation combined with energy dispersive spectroscopy (EDS) analysis revealed that the ALD-Ru/ALD-TaCN diffusion barrier failed by the Cu diffusion through the bilayer into the Si substrate. This is due to the ALD-TaCN interlayer preventing the interfacial reaction between the Ru and Si.

• 한국분말재료학회지
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• 제20권1호
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• pp.33-36
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• 2013

A bulk metallic glass-forming alloy, $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ metallic glass powders was used for good commercial availability and good formability in supercooled liquid region. In this study, the Ni-based metallic glass was synthesized using by high pressure gas atomized metallic glass powders. In order to create a bulk metallic glass sample, the $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ metallic glass powders with ball-milled Ni-based amorphous powder with 40%vol brass powder and Cu powder for 20 hours. The composite specimens were prepared by Spark Plasma Sintering for the precursor. The SPS was performed at supercooled liquid region of Ni-based metallic glass. The amorphous structure of the final sample was characterized by SEM, X-ray diffraction and DSC analysis.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.788-789
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• 2006

Microstructure and soft magnetic properties of bulk amorphous and/or nanocrystalline $Fe_{73.5}Cu_1Nb_3Si_{13.5}B_9$ alloys prepared by consolidation at 5.5GPa were investigated. The relative density of the bulk sample 1 (from amorphous powders) was 98.5% and the grain sizes were about 10.6nm. While the relative density and grain sizes of bulk sample 2 (from nanocrystalline powders) are 98% and 20.1nm, respectively. Particularly, the bulk samples exhibited a good combined magnetic property: for Sample1, $M_s=125emu/g$ and $H_c=1.5Oe;$ for Sample2, $M_s=129emu/g$ and $H_c=3.3Oe$. The success of synthesizing the nanocrystalline Fe-based bulk alloys will be encouraging for the future development of bulk nanocrystalline soft magnetic alloys.

• 한국분말재료학회지
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• 제9권6호
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• pp.394-408
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• 2002

Nanostructured high strength metastable Al-, Mg- and Ti-based alloys containing different amorphous, quasicrystalline and nanocrystalline phases are synthesized by non-equilibrium processing techniques. Such alloys can be prepared by quenching from the melt or by powder metallurgy techniques. This paper focuses on one hand on mechanically alloyed and ball milled powders containing different volume fractions of amorphous or nano-(quasi)crystalline phases, consolidated bulk specimens and, on the other hand. on cast specimens containing different constituent phases with different length-scale. As one example. $Mg_{55}Y_{15}Cu_{30}$- based metallic glass matrix composites are produced by mechanical alloying of elemental powder mixtures containing up to 30 vol.% $Y_2O_3$ particles. The comparison with the particle-free metallic glass reveals that the nanosized second phase oxide particles do not significantly affect the glass-forming ability upon mechanical alloying despite some limited particle dissolution. A supercooled liquid region with an extension of about 50 K can be maintained in the presence of the oxides. The distinct viscosity decrease in the supercooled liquid regime allows to consolidate the powders into bulk samples by uniaxial hot pressing. The $Y_2O_3$ additions increase the mechanical strength of the composites compared to the $Mg_{55}Y_{15}Cu_{30}$ metallic glass. The second example deals with Al-Mn-Ce and Al-Cu-Fe composites with quasicrystalline particles as reinforcements, which are prepared by quenching from the melt and by powder metallurgy. $Al_{98-x}Mn_xCe_2$ (x =5,6,7) melt-spun ribbons containing a major quasicrystalline phase coexisting with an Al-matrix on a nanometer scale are pulverized by ball milling. The powders are consolidated by hot extrusion. Grain growth during consolidation causes the formation of a micrometer-scale microstructure. Mechanical alloying of $Al_{63}Cu_{25}Fe_{12}$ leads to single-phase quasicrystalline powders. which are blended with different volume fractions of pure Al-powder and hot extruded forming $Al_{100-x}$$(Al_{0.63}Cu_{0.25}Fe_{0.12})_x$ (x = 40,50,60,80) micrometer-scale composites. Compression test data reveal a high yield strength of ${\sigma}_y{\geq}$700 MPa and a ductility of ${\varepsilon}_{pl}{\geq}$5% for than the Al-Mn-Ce bulk samples. The strength level of the Al-Cu-Fe alloys is ${\sigma}_y{\leq}$550 MPa significantly lower. By the addition of different amounts of aluminum, the mechanical properties can be tuned to a wide range. Finally, a bulk metallic glass-forming Ti-Cu-Ni-Sn alloy with in situ formed composite microstructure prepared by both centrifugal and injection casting presents more than 6% plastic strain under compressive stress at room temperature. The in situ formed composite contains dendritic hcp Ti solid solution precipitates and a few $Ti_3Sn,\;{\beta}$-(Cu, Sn) grains dispersed in a glassy matrix. The composite micro- structure can avoid the development of the highly localized shear bands typical for the room temperature defor-mation of monolithic glasses. Instead, widely developed shear bands with evident protuberance are observed. resulting in significant yielding and homogeneous plastic deformation over the entire sample.

• 전기화학회지
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• 제18권3호
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• pp.130-135
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• 2015

흑연 분말을 프탈로시아닌 또는 구리 프탈로시아닌과 함께 비활성 분위기에서 각각 열처리하여 표면처리를 진행하였고, 이의 속도특성과 저온 작동특성을 조사하였다. 표면처리 후 흑연 분말의 표면에 비정질 탄소와 구리의 코팅 층이 균일하게 형성되었다. 표면처리를 통하여 흑연 전극의 속도특성이 개선되는 것을 확인하였는데, 특히 구리 프탈로시아닌으로 처리한 경우 속도특성의 향상이 두드러졌다. 흑연 전극의 저항을 교류 임피던스와 펄스 저항측정법을 활용하여 조사하였는데, 구리 프탈로시아닌으로 처리된 흑연 전극의 경우가 저항이 가장 작았다. 프탈로시아닌으로 부터 유도된 비정질 탄소 층이 리튬이온의 확산을 용이하게 하고, 구리 프탈로시아닌으로부터 유도된 금속상태의 구리는 전자 전도도를 증가시키기 때문에 저항을 감소시키는 것으로 판단된다.

• 한국분말재료학회지
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• 제13권5호
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• pp.351-359
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• 2006

Ni based($Ni_{57}Zr_{20}Ti_{18}Si_2Sn_3$) bulk metallic glass(BMG) powders were produced by a gas atomization process, and ductile Cu powders were mixed using a spray drying process. The Ni-based amorphous powder and Cu mixed Ni composite powders were compacted by a spark plasma sintering (SPS) processes into cylindrical shape. The relative density varied with the used SPS mold materials such as graphite, hardened steel and WC-Co hard metal. The relative density increased from 87% to 98% when the sintering temperature increased up to $460^{\circ}C$ in the WC-Co hard metal mold.

• Journal of Magnetics
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• 제19권4호
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• pp.327-332
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• 2014

The effect of minor element additions (Ca, Al) on microstructural change and magnetic properties of Fe-Nb-Cu-Si-B alloy has been investigated, in this paper. The Fe-Si-B-Nb-Cu(-Ca-Al) alloys were prepared by arc melting in argon gas atmosphere. The alloy ribbons were fabricated by melt-spinning, and heat-treated under a nitrogen atmosphere at $520-570^{\circ}C$ for 1 h. The soft magnetic properties of the ribbon core were analyzed using the AC B-H meter. A differential scanning calorimetry (DSC) was used to examine the crystallization behavior of the amorphous alloy ribbon. The microstructure was observed by X-ray diffraction (XRD), transmission electron microscope (TEM) and scanning electron microscope (SEM). The addition of Ca increased the electrical resistivity to reduce the eddy current loss. And the addition of Al decreased the intrinsic magnetocrystalline anisotropy $K_1$ resulting in the increased permeability. The reduction in the size of the ${\alpha}$-Fe precipitates was observed in the alloys containing of Ca and Al. Based on the results, it can be concluded that the additions of Ca and Al notably improved the soft magnetic properties such as permeability, coercivity and core loss in the Fe-Nb-Cu-Si-B base nanocrystalline alloys.