• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.414-417
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• 2003

A copper-clad aluminium composite bar is lighter and less expressive than a commercial copper alloy bar. Copper-clad aluminium composite bar can be fabricated by hot hydrostatic extrusion process. In this work, the effect of die angle on the compressive properties of copper-clad aluminium composites fabricated using hydrostatic extrusion process was investigated experimentally. The results showed that optimum half die angle was in the range of 40$^{\circ}$ to 50$^{\circ}$ for an extrusion ratio of 19. The results also showed that the half die angle had little influence on the compressive strength of copper-clad aluminium composites. A diffusion layer increased with increasing die angle.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.1
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• pp.17-24
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• 1994

The evaluation and analysis of diffusivity of lithium for coarsening and coarsening kinetics of ${\delta}^{\prime}$ precipitate in Al-Li-Cu-Mg-Zr alloy aged at $170^{\circ}C$ have been investigated by transmission electron microscopy. With ageing time, ${\delta}^{\prime}$ precipitate coaesened to followed $\bar{\gamma}{\propto}t^{1/3}$ and coarsening kinetics was found to be obeyed to the Lifshitz-Slyozov-Wagner(LSW) theory and diffusivity of lithium for coarsening of ${\delta}^{\prime}$ precipitate in Al-Li-Cu-Mg-Zr alloy was obtained to be $5.85{\times}10^{-17}{\sim}1.53{\times}10^{-16}$ by experimental coarsening rate constant and various coarsening kinetic theory. Diffusivity of lithium measured by using various model but MLSW and Tsumuraya (VI) et al. model in Al-Li-Cu-Mg-Zr alloy is similar to that calculated by the Costas's diffusivity equation. It was, therefore, suggested that additing to the Cu, Mg and Zr element in Al-Li system have no great effect on diiffusivity of lithium for coarsening of ${\delta}^{\prime}$ This suggest that in matrix.

• Transactions of Materials Processing
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• v.22 no.3
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• pp.143-149
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• 2013

A new finite element model for the hydrostatic extrusion of a biaxial bar is introduced. In this model, a penalty contact algorithm, which is adopted to replace the traction boundary conditions due to the fluid in the container of the extruder, is incorporated into a consistent penalty finite element formulation for the viscoplastic deformation of a work piece during hydrostatic extrusion. Two parameters, introduced in the penalty contact algorithm in this study, a critical penalty contact pressure $P_0$ and a critical penalty contact distance $D_c$, are carefully examined for various process conditions. The proposed finite element model is applied to the hydrostatic extrusion of a Cu-clad Al bar. The extrusion loads and thickness ratios of the clad materials by the proposed model are compared in detail to values from experiments reported in the literature. Finally, it is concluded that the proposed finite element model is useful in practical implementations.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.236-240
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• 2007

In order to control the microstructure of amorphous/crystalline composites, gas atomized $Cu_{54}Ni_{6}Zr_{22}Ti_{18}$ metallic glass powders wrapped in a crystalline brass were extruded repeatedly. The size of microstructure in the resultant composites was varied depending on the pass of extrusion as well as on the area reduction ratio. The microstructure could be estimated using an equation of $r_n=r_{n-1}/R^{1/2}$, where R is reduction ratio and $r_n$ is the resultant radius of the extruded bar after n pass. Theory of microstructural refinement as well as the relationship between the resultant microstructures and mechanical properties was discussed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.281-284
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• 2003

The microstructural changes of Al-Zn-Mg-Cu alloy containing Sc during hot extrusion and post heat treatment is investigated. Two kinds of Al-Sc alloys with different alloying elements (B1, B2) are hot extruded to make I-shape bars at 380$^{\circ}C$, then the bars are solution treated at 480$^{\circ}C$ for 2hrs followed by artificial aging at 120$^{\circ}C$ for 24hrs. The interior microstructure of as extruded bar consists of elongated grains, however, fine equiaxed grains are mainly observed around surface. The microstructural gradient suggests that different restoration process can proceed during the hot extrusion. For B1 and B2, different grain growth behaviors are found around the surface during the post heat treatment. Rapid grain growth behavior around the surface is discussed related with the crystallographic orientation of the grain.

• Transactions of Materials Processing
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• v.16 no.5 s.95
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• pp.386-390
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• 2007

In order to, simultaneously, synthesize and control the size of microstructure of amorphous/crystalline composites, a repeated extrusion process was performed using the gas atomized $Cu_{54}Ni_6Zr_{22}Ti_{18}$ metallic glass powders and the crystalline brasses. The size of microstructure in the resultant composites was varied depending on the pass of extrusion as well as on the area reduction ratio. The microstructure could be estimated using an equation of $r_n=r_{n-1}/R^{1/2}$, where R is reduction ratio and $r_n$ is the resultant radius of the extruded bar after n pass. Theory of microstructural refinement as well as the relationship between the resultant microstructures and mechanical properties was discussed.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.73-76
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• 2021

This thesis described the optical and electrical properties of the alternating current powder electroluminescent device based on Ag nanowire as a transparent electrode. The Ag nanowire electrode showed the morphology of 20 nm in diameter and 15 ㎛ in length. The transparent electroluminescent devices that were fabricated using the nanomilled ZnS : Cu, Mn phosphor by bar-coating process showed the transmittance of 67%. In order to improve the luminous efficiency, it is necessary to apply the transparent dielectric layer and increase the amount of the nanophosphor while maintaining the transmittance.

• Proceedings of the KAIS Fall Conference
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• 2011.12a
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• pp.200-203
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• 2011

A copper-based metal organic framework (MOF) named Cu-BTC, also known as HKUST-1, was synthesized by using a solvothermal method at various synthesis temperature, time and pressure. The obtained samples were characterized with Powder X-ray diffraction (XRD) for phase structure, scanning electron microscopy (SEM) for crystal structure, and nitrogen adsorption-desorption for pore textural structure. The Cu-BTC sample was also studied for $CO_2$ adsorption. The analysis results displayed that the sample synthesized at the condition of temperature: $120^{\circ}C$, synthesis time: 12 hours, pressure: 1 bar exhibited a good crystal structure with uniform size of octahedral particles. The BET data revealed a high surface area of 1741.7 $m^2g^{-1}$ and a pore volume of 0.7137 $cm^3g^{-1}$and exhibiteda maximum $CO_2$ adsorption capacity of 170 mg/g of the sorbent at $25^{\circ}C$.

• Current Photovoltaic Research
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• v.7 no.1
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• pp.21-27
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• 2019

Lifetime of Si photovoltaics modules are about 25 years and a large amount of waste modules are expected to be discharged in the near future. Therefore, the extraction and collection of valuable metals out of discharged Si modules will be one of the important technologies. In this study, we demonstrated that supercritical $CO_2$ extraction method can be effectively used to remove Cu, one of the abundant elements in the module, as well as its oxide form, $Cu_2O$. Especially, we proved that the addition of hexane as co-solvent is effective for the removal of both materials. The optimal ratio of $CO_2$ and hexane was 4:1 at a fixed temperature and pressure of $250^{\circ}C$ and 250 bar, respectively. In addition, it was proven that the removal of $Cu_2O$ was preceded via reduction of $Cu_2O$ to Cu.